JPH0193209A - Method for housing case of electronic component and case used for the same - Google Patents

Abstract

PURPOSE:To easily perform the housing of the case of an electronic component with a few amount of energy efficiently by forming two areas of low and high crystallinities on each of a pair of upper and lower cases, and depositing the pair of cases at the area of low crystallinity with each other. CONSTITUTION:At the time of forming the case by using a male metallic die 23 whose vertical cross section is formed in projecting shape and a female metallic die 24 whose vertical cross section is formed in recessed shape and supplying a thermoplastic resin material such as polyphenylene sulfide(PPS), polycarbonate, or polyacetal, etc., between the male metallic die 23 and the female metallic die 24, molding is performed by keeping the male metallic die 23 is kept at a temperature less than the recrystallization temperature in crystallization degree of the thermoplastic resin material 25, and keeping the female metallic die 24 at the temperature over the recrystallization temperature of the thermoplastic resin material 25. In such a way, superior adhesion and high adhesive strength in the cases 26 and 27 can be obtained. And thermoplastic resin at the deposited part of the cases 26 and 27 can be highly crystallized by the heat of the frame body 13 of a terminal frame 12.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a case housing method for electronic components that involve mechanical vibration, such as piezoelectric resonators and vibrator vibrators, and a case used therein.

(Prior art) Conventionally, electronic components such as integrated circuits have been packaged using transfer molding, which involves pouring epoxy resin into a mold. For electronic components such as piezoelectric resonators and vibrator vibrators, it has been difficult to package the element body using transfer molding. Therefore, in order to package the element body of this type of electronic component, a pair of ceramic cases formed into a hollow structure in advance was used, and the cases were bonded together using low melting point glass or adhesive. As electronic components become smaller and outer cases become smaller, it becomes difficult to apply low-melting glass and adhesives, the alignment accuracy between cases deteriorates, and the adhesive takes a long time to harden. This method has disadvantages in that the temperature becomes high and the overall production efficiency is low.

As one method to eliminate the above-mentioned drawbacks, a thermoplastic resin such as PP5 (polyphenylene sulfide) resin is molded between a pair of cases so that the vertical cross section has a concave shape.
A method has been proposed in which a terminal frame made of metal plates and having a frame body for mounting electronic components is sandwiched, and both cases are heated with ultrasonic waves or hot air to weld the contact surfaces of both cases.

By the way, when the pair of cases are welded to each other at their contact surfaces, in order to increase the adhesive strength, conventionally, the temperature of the mold during molding of the pair of cases is lower than the glass transition point temperature of the thermoplastic resin. The crystallinity of the molded product was kept low. However, although this improves the weldability of the case, there is a problem in that the dimensional stability of the case is impaired due to changes in thermal environmental conditions.

Contrary to the above, in order to increase the dimensional stability of the case under thermal environmental conditions, the mold temperature during molding of the case is kept above the glass transition temperature of the thermoplastic resin mentioned above, and the crystallinity of the molded product is reduced. If it is increased, there is a problem in that the weldability of the cases to each other deteriorates.

(Object of the Invention) An object of the present invention is to provide a method for accommodating a case for electronic components, which improves the weldability of cases made of thermoplastic resin to each other and stabilizes dimensional changes of the case under thermal environmental conditions. It is.

Another object of the present invention is to provide a case for electronic components that has high weldability and exhibits little dimensional change under thermal environmental conditions.

(Structure of the Invention) Therefore, the first invention of the present application has a frame body that supports an electronic component body inside, a terminal frame that has lead terminals drawn out to the outside of the frame body, and It is made of a plastic resin material, and during molding, one of the male and female molds is kept at a temperature lower than the recrystallization point temperature of the crystallinity of the thermoplastic resin material, and the other mold is kept at a temperature lower than the recrystallization point temperature of the crystallinity of the thermoplastic resin material. A pair of upper and lower cases each having a region of low crystallinity and a region of high crystallinity are prepared by molding the mold while maintaining the temperature at the recrystallization point temperature or higher, and the frame body of the terminal frame is prepared. After arranging each of the cases on both sides of the case and sandwiching the frame between them, heating the pair of cases to weld each case to each other in the region of low crystallinity in contact with the frame, It is characterized in that the electronic component main body is enclosed within the pair of cases.

Further, a second invention of the present application provides a terminal frame in which a lead terminal is pulled out to the outside of a frame supporting an electronic component main body on the inside, and the contact surface with the frame is sandwiched between the frame. A pair of upper and lower cases that are welded together and house the electronic component body inside, each case is made of thermoplastic resin, and when molded with a mold, one of the male mold and the female mold is used. By keeping the thermoplastic resin at a temperature lower than the recrystallization point temperature of the crystallinity and maintaining the other mold at a temperature higher than the recrystallization point temperature, each case has a low crystallinity area. It is characterized by forming a region of high crystallinity.

The exterior case is molded using a mold having a temperature lower than the recrystallization point temperature of the crystallinity of the thermoplastic resin and a mold having a temperature higher than the recrystallization point temperature. As a result, two regions of low crystallinity and high crystallinity are formed in the case, and the pair of cases are welded to each other in each region of low crystallinity.

(Effect of the Invention) According to the first invention of the present application, two regions of low crystallinity and high crystallinity are formed in each of the pair of upper and lower cases, and the two regions of low crystallinity are formed in each of the pair of cases. Since they are welded to each other in the area, the cases have good welding properties, and electronic components can be easily housed in the case and efficiently with less thermal energy. Further, according to the second invention of the present application, since the cases are welded together in their respective low crystallinity regions, the welding strength is increased, and the cases have high crystallinity regions,
Moreover, since the degree of crystallinity of the welded portion also increases, it also has excellent dimensional stability under thermal environmental conditions.

(,Example) Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Embodiments in which the present invention is applied to a vibrator are shown in FIGS. 1 to 8.
As shown in the figure.

As shown in FIG. 1, the vibrating element 1 utilizes the vibration of a vibrating element 3 supported inside a rectangular support frame 2. The vibrating piece 3 is coupled to and supported by the supporting frame 2 at its vibration nodes by supporting pieces 4, 5, 6, and 7 having a constant width.

A piezoelectric film 8 made of a piezoelectric material such as zinc oxide (ZnO) is formed on one surface of the vibrating piece 3, a part of the support piece 4.5.6, and from the support piece 7 to one surface of the support frame 2. has been done. Then, an electrode film 9 is formed on the piezoelectric film 8 on the vibrating piece 3. This electrode film 9 is drawn out onto the support frame 2 by a draw-out portion II formed from the support piece 7 of the vibrating element 3 to the piezoelectric film 8 on the support frame 2 .

The vibrating bar vibrator 1 whose structure has been explained above is attached to and supported by the frame 13 of the terminal frame 12 shown in FIG. In the terminal frame I2, lead terminals 14.15 are drawn out to the outside of the frame body 13, and energizing terminals 16.17, the operation of which will be explained later, are drawn out. And the current-carrying terminals 16 and 17 of the terminal frame 12
No other terminal frame! 2 current-carrying terminals i 6.17 and connecting plates 18゜19 arranged at regular intervals.
is combined with The terminal frame 12, the current-carrying terminal 16.
17 and the coupling plates 18, 19 are integrally formed by punching out a thin metal plate.

As shown in FIG. 3, on the frame body 13 of the terminal frame 12, the drawer part I+ of the electrode film 9 of the transducer l and the support frame 2 are attached to the tongue pieces 21 and 22 that protrude inwardly. The transducer 1 is electrically conductively bonded and supported within the frame 13 of the terminal frame 12.

As described above, the vibrator 1 supported within the frame 13 of the terminal frame 12 is covered with a pair of upper and lower cases (see FIG. 6) formed as follows.

That is, as shown in FIG. 4, a male mold 23 having a convex longitudinal section and a female mold 24 having a concave longitudinal section are used, and as shown in FIG. Polyphenylene sulfide (PPS) is placed between 23 and the female mold 24.
When supplying thermoplastic resin materials such as polycarbonate and polyacetal to mold the case (see Figure 6),
The male mold 23 is kept at a temperature lower than the recrystallization point temperature of the crystallinity of the thermoplastic resin material 25, and the male mold 24 is kept at a temperature higher than the recrystallization point temperature of the thermoplastic resin material 25 for molding. Do this.

As a result, as shown in FIG. 6, the area that was in contact with the male mold 23 and the area that was in contact with the female mold 24 are changed to a low crystallinity area 26a and a high crystallinity area 2, respectively.
A case 26 having a concave vertical cross section as shown in FIG. 6b is obtained. In exactly the same manner as described above, a case 27 having a concave longitudinal section is obtained, which is composed of a region 27a of low crystallinity and a region 27b of high crystallinity.

The cases 26 and 27 have protrusion forming recesses 23 formed in the male mold 23 for positioning during bonding.
A (see FIG. 4), a positioning protrusion 26c is formed on the case 26. Furthermore, a positioning recess 27c is formed in the case 26.

In the cases 26 and 27 described above, as shown in FIG. The frame body 13 of the terminal frame 12 is sandwiched between the outer peripheral edges of the recess opening. Thereafter, a voltage is applied between the current-carrying terminals 16 and 17 of the terminal frame 12, and the terminal frame 12
An electric current is applied to the frame 13 of the frame 13 to cause the frame 13 to generate heat due to its electrical resistance. This heat generation melts the abutment surfaces on the outer periphery of the respective recess openings of the cases 26 and 27, and the two abutment surfaces are welded to each other.

This welding is caused by the low crystallinity region 2 that was in contact with the male mold 23, which was kept at a temperature lower than the recrystallization point temperature of the crystallinity of the thermoplastic resin material 25 during molding of the case 26 and 27.
6a and 27a (see FIG. 6), the cases 26 and 27 have excellent adhesion and adhesive strength. The heat generated by the frame body 13 of the terminal frame 12 causes the thermoplastic resin in the welded portions of the cases 26 and 27 to become highly crystallized.

Therefore, the thermoplastic resin on the outer peripheral surfaces of the cases 26 and 27 that are joined to each other is completely highly crystallized. This also increases dimensional stability under thermal environmental conditions.

Next, the current-carrying terminals 16. of the terminal frame 12 of the transducer l covered with the cases 26.27 as described above.
17 is cut at the position shown by the dashed line a in FIG. As a result, the lead terminals 14.15 are electrically isolated by the notch 31 formed in the portion of the current-carrying terminal 16.17 drawn out from the frame 3 of the terminal frame 12. This makes it possible to obtain a so-called single in-line resin molded tone piece vibrator.

In the above embodiment, a method for housing a vibrating unit vibrator and a case used therein have been described, but the present invention is not limited to a vibrating unit vibrator, but is applicable to piezoelectric resonators, reed switches, reed relays, etc. It can also be applied to electronic components that involve zero mechanical vibration or mechanical displacement, such as bimetals, pressure sensors, etc.

In addition, for welding cases 26 and 27 together, terminal frame 1
Instead of using the Joule heat generated by energization in step 2, it is also possible to use heating using ultrasonic waves or hot air.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing the configuration of the vibrating unit vibrator, Fig. 2 is a plan view of the terminal frame, Fig. 3 is a plan view showing the condition in which the vibrating unit vibrator is attached to the frame of the terminal frame, and Fig. 4 5 and 5 are respectively explanatory diagrams of the manufacturing process of the outer case. FIG. 6 is a longitudinal sectional view of the case. FIGS. 7 and 8 are respectively explanatory diagrams of the method of accommodating the sound unit vibrator in the case shown in FIG. 1. It is. l...Tone piece vibrator, 12...Terminal frame, 1
3...Frame body, 14.15...Relay terminal, 2
3...Male mold, 24...Female mold, 25...Thermoplastic resin material, 26.27...Case. Patent Applicant: Murata Manufacturing Co., Ltd. Agent: Patent Attorney: 2 people (including the above) Figure 1 Figure 2 Figure 3 C I7 [5 Figure 4 Figure 5 Figure 6 1bc1 1b13 Figure 7

Claims (2)

[Claims] (1) It has a frame that supports the electronic component body inside,
A terminal frame is made of a thermoplastic resin material and a terminal frame with lead terminals drawn out of the frame body. By keeping the temperature lower than the recrystallization point temperature of the crystallinity, and keeping the other mold at a temperature higher than the recrystallization point temperature, a region of low crystallinity and a region of high crystallinity are respectively formed. After preparing a pair of upper and lower cases having upper and lower cases, placing each of the cases on both sides of the frame of the terminal frame and sandwiching the frame between them, heat the pair of cases to heat each case. A method for accommodating an electronic component in a case, the method comprising: welding the electronic component to each other in a low crystallinity area that contacts the frame, and enclosing the electronic component main body within the pair of cases. (2) A terminal frame is formed by pulling out lead terminals to the outside of a frame that supports an electronic component main body on the inside, and the contact surfaces with the frame are welded to each other with the frame body in between, and the A pair of upper and lower cases housing an electronic component main body,
Each case is made of thermoplastic resin, and during molding, one of the male and female molds is kept at a temperature lower than the recrystallization temperature of the crystallinity of the thermoplastic resin, and the other A case for an electronic component, characterized in that a region of low crystallinity and a region of high crystallinity are formed in each case by molding the mold while maintaining the temperature at the recrystallization point temperature or higher.