JPH0194256A - Humidity sensor - Google Patents
Humidity sensorInfo
- Publication number
- JPH0194256A JPH0194256A JP25224887A JP25224887A JPH0194256A JP H0194256 A JPH0194256 A JP H0194256A JP 25224887 A JP25224887 A JP 25224887A JP 25224887 A JP25224887 A JP 25224887A JP H0194256 A JPH0194256 A JP H0194256A
- Authority
- JP
- Japan
- Prior art keywords
- humidity
- temp
- sensing element
- correcting
- sensitive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 2
- 230000035945 sensitivity Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は各種の機器における湿度検知システム等に用
いる湿度センサーに関するものである。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a humidity sensor used in humidity detection systems and the like in various types of equipment.
〈従来の技術〉
セラミック半導体を用いた湿度センサーは種々のものが
公知である。<Prior Art> Various humidity sensors using ceramic semiconductors are known.
この公知の湿度センサーは湿度の変化により抵抗値が変
化するi湿索子を用いるものであるから抵抗値の変化を
測定する回路により湿度を知ることができる。Since this known humidity sensor uses an i-humidity probe whose resistance value changes with changes in humidity, humidity can be determined by a circuit that measures changes in resistance value.
〈発明が解決しようとする問題点〉
上記のような従来の湿度センサーに用いる感湿素子は温
度を感知すると同時に温度についての感度も併せもって
いるため、湿度と共に温度が変化する環境では温度の影
響を受けるために正確な湿度の検出ができないという問
題があった。<Problems to be Solved by the Invention> Since the humidity sensing element used in the conventional humidity sensor described above detects temperature and is also sensitive to temperature, it may be affected by temperature in an environment where temperature changes with humidity. There was a problem in that accurate humidity detection was not possible due to the high humidity.
このような問題を解決するためには、温度補正の必要が
あり、@湿素子と温度係数が等しく、しかも湿度の影響
を受けないという特性の素子が必要であるが、そのよう
な素子を見つけ出すことは容易でなく、折角優れた感湿
素子を見つけたとしても、実用化に結びつけることが困
難であった。In order to solve such problems, temperature correction is necessary, and an element with the same temperature coefficient as the humidity element and not affected by humidity is needed, but it is necessary to find such an element. This is not easy, and even if an excellent moisture-sensitive element was found, it was difficult to put it into practical use.
〈問題点を解決するための手段〉
この発明は上記のような問題点を解決するためになされ
たもので、感湿素子と、該感湿素子と同じ材質の抵抗体
をガラス等の耐湿封入部材で封入した上で、該盛況素子
と熱容量を等しくしたものを温度補正素子とし、該感湿
素子と該温度補正素子とを直列に接続して、周囲温度の
変化による感湿素子の湿度誤差を該温度補正素子により
補正するようにしたものである。<Means for Solving the Problems> The present invention was made to solve the above-mentioned problems, and includes a moisture-sensitive element and a resistor made of the same material as the moisture-sensitive element, sealed in a moisture-resistant material such as glass. A temperature correction element is encapsulated with a material and has the same heat capacity as the active element, and the humidity sensing element and the temperature correction element are connected in series to correct humidity errors in the humidity sensing element due to changes in ambient temperature. is corrected by the temperature correction element.
〈実施例〉
この本発明の実施例を添付図面の第1図ないし第3図に
もとづいて説明する。<Embodiment> An embodiment of the present invention will be described based on FIGS. 1 to 3 of the accompanying drawings.
第1図において、1は感湿素子、2は該感湿素子と同じ
材料からなる温度補正素子であり、何れも抵抗体である
が、その材料としては、例えば(Ba Ce )o、y
f’Jd o、+ 03を用いる。In FIG. 1, 1 is a humidity sensing element, and 2 is a temperature correction element made of the same material as the humidity sensing element, both of which are resistors. For example, (Ba Ce ) o, y
f'Jdo, +03 is used.
このような素子は通常の窯業的な手法を用いて成形体と
し、1450℃で2時間焼成して、1ommx10mt
n X 1 rRtnの焼成体を作り、この焼成体に電
極形成材料としてゐ○tペーストを塗布して850℃で
焼き付けた後、カットする。Such an element is made into a molded body using a normal ceramic method and fired at 1450°C for 2 hours to form a 10mm x 10mt
A fired body of n x 1 rRtn is made, and after applying I○t paste as an electrode forming material to this fired body and baking it at 850°C, it is cut.
実施例における該感湿素子1の寸法は、1.411+1
1X 1.41 rRy+X 1 ramである。The dimensions of the moisture sensitive element 1 in the example are 1.411+1
1X 1.41 rRy+X 1 ram.
又、同じ材料を0.125mm厚にスライスして、温度
補正素子2とする。その寸法は0.5rtrtn X
0.5mtnx 0.125111#Iのチップ状のも
のである。Further, the same material is sliced to a thickness of 0.125 mm to form the temperature correction element 2. Its dimensions are 0.5rtrtn
It is in the form of a chip of 0.5mtnx 0.125111#I.
該温度補正素子2は、第2図のようにガラスチューブ3
に封入して、該温度補正素子2の両端の電極には、該チ
ューブ3の両端から挿入したリード電極4.5を電気的
に接続する。The temperature correction element 2 includes a glass tube 3 as shown in FIG.
Lead electrodes 4.5 inserted from both ends of the tube 3 are electrically connected to electrodes at both ends of the temperature correction element 2.
そして、このガラスチューブ3の両端を加熱溶融等の手
段により密封する。Then, both ends of the glass tube 3 are sealed by means such as heating and melting.
但し、ガラス以外の合成樹脂等の材料で密封してもよい
。感湿素子1の一方の電極に接続したリード電極6を該
リード電極5に接続する。However, it may be sealed with a material other than glass, such as synthetic resin. A lead electrode 6 connected to one electrode of the humidity sensing element 1 is connected to the lead electrode 5.
7は感湿素子1の他方の電極に接続したリード電極であ
る。7 is a lead electrode connected to the other electrode of the humidity sensing element 1.
第3図の回路図において、前記感湿素子1と温度補正素
子2とを直列に接続し、この画素子1.2に電源8から
一定の電圧を印加する。そして該温度補正素子2の両端
を電圧計9に接続することによって湿度を電圧の変化と
して検出する。In the circuit diagram of FIG. 3, the humidity sensing element 1 and the temperature correction element 2 are connected in series, and a constant voltage is applied from a power source 8 to this pixel element 1.2. By connecting both ends of the temperature correction element 2 to a voltmeter 9, humidity is detected as a change in voltage.
〈効果〉
この発明は上記のように感湿素子と、該感湿素子と同じ
材質の抵抗体をガラス封入した上で、該感湿素子と熱容
量を等しくしたものを温度補正素子 3 −
子とし、該感湿素子と、該温度補正素子とを直列に接続
して、周囲温度の変化による感湿素子の湿度誤差を該温
度補正素子により補償するようにしたものであり、感湿
素子と温度補正素子とは同じ材質の抵抗体を用いるもの
であるから、明らかに8定数は等しい。しかも温度補正
素子はガラス封入等の手段により、外部から遮断して大
気中の水蒸気の影響を全く受けないようにしたから、湿
度に対する感度がない。<Effects> As described above, the present invention includes a humidity sensing element and a resistor made of the same material as the humidity sensing element sealed in glass, and which has the same heat capacity as the humidity sensing element as a temperature correction element. , the humidity sensing element and the temperature correction element are connected in series so that the humidity error of the humidity sensing element due to changes in ambient temperature is compensated for by the temperature correction element. Since the correction element uses a resistor made of the same material, the 8 constants are obviously equal. Moreover, since the temperature correction element is sealed from the outside by means such as glass encapsulation so as to be completely unaffected by water vapor in the atmosphere, it is not sensitive to humidity.
従って、感湿素子が受ける温度の影響は、温度補正素子
が完全に除去するので、周囲温度が変化してもその影響
を受けることなく、極めて高い精度の湿度測定が可能で
あり、ブリッジ回路を組む必要がなく、実施例に示すよ
うな簡単な直列回路によって湿度検出が可能である等の
効果がある。Therefore, the temperature compensation element completely eliminates the influence of temperature on the humidity sensing element, making it possible to measure humidity with extremely high accuracy without being affected by changes in ambient temperature. There is no need for assembly, and there are advantages such as humidity detection being possible with a simple series circuit as shown in the embodiment.
第1図はこの発明の一実施例を示す要部の斜視図、第2
図は同上に用いる温度補正素子の拡大縦断側面図、第3
図は回路の一例を示す回路図である。
1・・・感湿素子 2・・・温度補正素子3・
・・封入部材Fig. 1 is a perspective view of the main parts showing one embodiment of the present invention;
The figure is an enlarged longitudinal cross-sectional side view of the temperature correction element used in the above, and the third figure is
The figure is a circuit diagram showing an example of the circuit. 1...Moisture sensing element 2...Temperature correction element 3.
・Encapsulating material
Claims (1)
の耐湿封入部材で封入した上で、該感湿素子と熱容量を
等しくしたものを温度補正素子とし、該感湿素子と、該
温度補正素子とを直列に接続して、周囲温度の変化によ
る感湿素子の温度誤差を該温度補正素子により補正する
ようにしたことを特徴とする湿度センサー。A humidity sensing element and a resistor made of the same material as the humidity sensing element are encapsulated in a moisture resistant enclosing member such as glass, and the temperature correction element is made to have the same heat capacity as the humidity sensing element, and the humidity sensing element and A humidity sensor characterized in that the temperature correction element is connected in series so that the temperature error of the humidity sensing element due to a change in ambient temperature is corrected by the temperature correction element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25224887A JPH0194256A (en) | 1987-10-06 | 1987-10-06 | Humidity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25224887A JPH0194256A (en) | 1987-10-06 | 1987-10-06 | Humidity sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0194256A true JPH0194256A (en) | 1989-04-12 |
Family
ID=17234577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25224887A Pending JPH0194256A (en) | 1987-10-06 | 1987-10-06 | Humidity sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0194256A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848841A (en) * | 1981-09-18 | 1983-03-22 | Marcon Electronics Co Ltd | Temperature compensating circuit of ceramic moisture sensing element |
| JPS62223054A (en) * | 1986-03-24 | 1987-10-01 | 工業技術院長 | Moisture sensing element and its manufacturing method |
-
1987
- 1987-10-06 JP JP25224887A patent/JPH0194256A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848841A (en) * | 1981-09-18 | 1983-03-22 | Marcon Electronics Co Ltd | Temperature compensating circuit of ceramic moisture sensing element |
| JPS62223054A (en) * | 1986-03-24 | 1987-10-01 | 工業技術院長 | Moisture sensing element and its manufacturing method |
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