JPH0197263U - - Google Patents

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Publication number
JPH0197263U
JPH0197263U JP19269187U JP19269187U JPH0197263U JP H0197263 U JPH0197263 U JP H0197263U JP 19269187 U JP19269187 U JP 19269187U JP 19269187 U JP19269187 U JP 19269187U JP H0197263 U JPH0197263 U JP H0197263U
Authority
JP
Japan
Prior art keywords
package
measurement probe
probe assembly
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19269187U
Other languages
Japanese (ja)
Other versions
JPH0533974Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19269187U priority Critical patent/JPH0533974Y2/ja
Publication of JPH0197263U publication Critical patent/JPH0197263U/ja
Application granted granted Critical
Publication of JPH0533974Y2 publication Critical patent/JPH0533974Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案によるICパツケージ用測定プ
ローブ組立体の一実施例を示す正面図、第2図は
第1図に示したICパツケージ用測定プローブ組
立体の1つの測定プローブとICパツケージのリ
ードとの係合状態を拡大して示す斜視図、第3図
は本考案によるICパツケージ用測定プローブ組
立体の別の実施例を示す正面図、第4図は本考案
によるICパツケージ用測定プローブ組立体の更
に別の実施例を示す側面図、第5図は本考案によ
るICパツケージ用測定プローブ組立体の更に別
の実施例を示す正面図、第6図は本考案によるI
Cパツケージ用測定プローブ組立体の更に別の実
施例を示す側面図である。 10……櫛形部材、12……歯部、14……測
定プローブ、16……テーパ状ヘツド部材、18
……導体部材、20……導体小片、22……リー
ド線、24……接続部、26……電気ケーブル、
28……測定器、30……リード、32……歯部
、34……テーパ状部材、36……磁石、38…
…ICパツケージ、40……プリント回路基板、
44……フツク要素、46……ロツド部材。
FIG. 1 is a front view showing an embodiment of the measurement probe assembly for IC packages according to the present invention, and FIG. 2 shows one measurement probe of the measurement probe assembly for IC packages shown in FIG. 1 and the leads of the IC package. FIG. 3 is a front view showing another embodiment of the measurement probe assembly for an IC package according to the present invention, and FIG. 4 is a perspective view showing the measurement probe assembly for an IC package according to the present invention. FIG. 5 is a front view showing still another embodiment of the measurement probe assembly for an IC package according to the present invention; FIG. 6 is a side view showing another embodiment of the three-dimensional measurement probe assembly according to the present invention;
It is a side view which shows yet another Example of the measurement probe assembly for C package. 10... Comb-shaped member, 12... Teeth, 14... Measurement probe, 16... Tapered head member, 18
... Conductor member, 20 ... Conductor piece, 22 ... Lead wire, 24 ... Connection part, 26 ... Electric cable,
28... Measuring device, 30... Lead, 32... Teeth, 34... Tapered member, 36... Magnet, 38...
...IC package, 40...printed circuit board,
44... Hook element, 46... Rod member.

Claims (1)

【実用新案登録請求の範囲】 1 プリント回路基板40上に設置されたICパ
ツケージ38の電気特性テスト、機能テスト等を
行う際に用いられるICパツケージ用測定プロー
ブ組立体であつて、少なくとも2つの測定プロー
ブ14を具備し、これら測定プローブの各々は絶
縁材料から作られたテーパ状ヘツド部材16と、
このテーパ状ヘツド部材の互いに対向する両テー
パ側面に絶縁状態で適用された一対の導体部材1
8とからなり、この一対の導体部材間の距離が前
記テーパ状ヘツド部材の狭窄端部側でICパツケ
ージのリードピツチ間隔よりも小さくされ、前記
2つの測定プローブがそれらのテーパ状ヘツド部
材の両テーパ側面を互いに向かい合わせて整列さ
せるような態様で配置されると共に該2つの測定
プローブの中心間距離がICパツケージの連続す
る3つのリードピツチ間隔のうちの両外側のリー
ドピツチ間隔の中心間距離に相当するようになつ
ているICパツケージ用測定プローブ組立体。 2 実用新案登録請求の範囲第1項に記載のIC
パツケージ用測定プローブ組立体において、前記
2つの測定プローブ14が櫛形部材10の歯部の
先端に設けられることを特徴とするICパツケー
ジ用測定プローブ組立体。 3 実用新案登録請求の範囲第2項に記載のIC
パツケージ用測定プローブ組立体において、前記
測定プローブ14のそれぞれをICパツケージ3
8の該当リードピツチ間隔内に挿入させるような
態様で前記櫛形部材10をICパツケージ38の
リード上に保持させるための保持手段が設けられ
ることを特徴とするICパツケージ用測定プロー
ブ組立体。 4 実用新案登録請求の範囲第3項に記載のIC
パツケージ用測定プローブ組立体において、前記
支持手段が前記櫛形部材10から吊下されしかも
その歯部の中間に配置されたテーパ状弾性部材か
らなり、このテーパ状弾性部材がICパツケージ
38の連続する3つのリードピツチ間隔のうちの
中間リードピツチ間隔内に挿入されるようになつ
ているICパツケージ用測定プローブ組立体。 5 実用新案登録請求の範囲第3項に記載のIC
パツケージ用測定プローブ組立体において、前記
支持手段が前記櫛形部材10の両端から吊下され
たフツク要素44からなり、これら両フツク要素
がICパツケージ38の連続する3つのリードピ
ツチ間隔のうちの両外側のリード30とスナツプ
係合し得るようになつていることを特徴とするI
Cパツケージ用測定プローブ組立体。 6 実用新案登録請求の範囲第3項に記載のIC
パツケージ用測定プローブ組立体において、前記
支持手段が前記櫛形部材10から片持梁りの態様
で支持された磁石36からなり、この磁石がIC
パツケージ38の本体上に置かれるようになつて
いることを特徴とするICパツケージ用測定プロ
ーブ組立体。 7 実用新案登録請求の範囲第3項に記載のIC
パツケージ用測定プローブ組立体において、前記
支持手段が前記櫛形部材10に枢動自在に取り付
けられた支え部材からなり、この支え部材が筋交
いの態様で前記櫛形部材をICパツケージ38の
リード上に保持させることを特徴とするICパツ
ケージ用測定プローブ組立体。 8 実用新案登録請求の範囲第7項に記載のIC
パツケージ用測定プローブ組立体において、前記
支え部材も櫛形部材10として構成され、その歯
部12の先端には前記測定プローブ14が設けら
れることを特徴とするICパツケージ用測定プロ
ーブ組立体。 9 実用新案登録請求の範囲第1項から第8項ま
でのいずれか1項に記載のICパツケージ用測定
プローブ組立体において、前記テーパ状ヘツド部
材が楔形状を呈し、その互いに向かい合つた楔面
に前記一対の導体部材が適用されることを特徴と
するICパツケージ用測定プローブ組立体。 10 実用新案登録請求の範囲第1項から第8項
までのいずれか1項に記載のICパツケージ用測
定プローブにおいて、前記テーパ状ヘツド部材が
切頭円錐形状を呈し、その直径方向で互いに向か
い合う両テーパ面部分に前記一対の導体部材が適
用されていることを特徴とするICパツケージ用
測定プローブ組立体。 11 実用新案登録請求の範囲第1項から第8項
までのいずれか1項に記載のICパツケージ用測
定プローブにおいて、前記テーパ状ヘツド部材が
切頭楕円錐形状を呈し、その直径方向で互いに向
かい合う両テーパ面部分に前記一対の導体部材が
適用されていることを特徴とするICパツケージ
用測定プローブ組立体。
[Claims for Utility Model Registration] 1. A measurement probe assembly for an IC package used when performing electrical characteristic tests, functional tests, etc. of an IC package 38 installed on a printed circuit board 40, which is capable of performing at least two measurements. A probe 14 is provided, each measuring probe having a tapered head member 16 made of an insulating material;
A pair of conductor members 1 are applied in an insulating state to both mutually opposing tapered side surfaces of this tapered head member.
8, the distance between the pair of conductor members is made smaller than the lead pitch spacing of the IC package on the narrow end side of the tapered head member, and the two measurement probes are connected to both tapers of the tapered head member. The two measurement probes are arranged in such a manner that their sides are aligned facing each other, and the distance between the centers of the two measurement probes corresponds to the distance between the centers of the outer lead pitches of the three consecutive lead pitches of the IC package. Measurement probe assembly for IC package. 2 IC described in paragraph 1 of claims for utility model registration
A measurement probe assembly for an IC package, characterized in that the two measurement probes 14 are provided at the tips of teeth of a comb-shaped member 10. 3 IC stated in paragraph 2 of claims for utility model registration
In the package measurement probe assembly, each of the measurement probes 14 is connected to the IC package 3.
A measurement probe assembly for an IC package, characterized in that holding means are provided for holding the comb-shaped member 10 over the leads of the IC package 38 in such a manner that the comb-shaped member 10 is inserted within a corresponding lead pitch interval of 8. 4 IC described in paragraph 3 of claims for utility model registration
In the measurement probe assembly for a package, the support means comprises a tapered elastic member suspended from the comb-shaped member 10 and disposed intermediate the teeth of the comb-shaped member 10; A measurement probe assembly for an IC package adapted to be inserted into an intermediate lead pitch interval of two lead pitch intervals. 5 IC described in paragraph 3 of claims for utility model registration
In the measurement probe assembly for a package, the support means comprises hook elements 44 suspended from both ends of the comb-shaped member 10, and these hook elements are located at both outer sides of three consecutive lead pitch intervals of the IC package 38. I characterized in that it is adapted to snap engage with the lead 30.
Measurement probe assembly for C package. 6 IC stated in Paragraph 3 of Claims for Utility Model Registration
In a measurement probe assembly for a package, the support means comprises a magnet 36 supported in a cantilevered manner from the comb member 10;
A measurement probe assembly for an IC package, characterized in that it is adapted to be placed on the body of a package 38. 7 IC stated in paragraph 3 of claims for utility model registration
In a measurement probe assembly for an IC package, the support means comprises a support member pivotally attached to the comb member 10, which support member holds the comb member in a braced manner over the leads of the IC package 38. A measurement probe assembly for an IC package, characterized in that: 8 IC described in paragraph 7 of claims for utility model registration
A measurement probe assembly for an IC package, wherein the support member is also configured as a comb-shaped member 10, and the measurement probe 14 is provided at the tip of the teeth 12 of the support member. 9 Utility Model Registration In the measurement probe assembly for an IC package according to any one of claims 1 to 8, the tapered head member has a wedge shape, and wedge surfaces facing each other are provided. A measurement probe assembly for an IC package, wherein the pair of conductor members is applied to the IC package. 10 Utility Model Registration In the measurement probe for an IC package according to any one of claims 1 to 8, the tapered head member has a truncated conical shape, and has two ends facing each other in the diametrical direction. A measurement probe assembly for an IC package, characterized in that the pair of conductor members is applied to a tapered surface portion. 11 Utility Model Registration In the IC package measurement probe according to any one of claims 1 to 8, the tapered head member has a truncated elliptical cone shape and faces each other in the diametrical direction. A measurement probe assembly for an IC package, characterized in that the pair of conductor members is applied to both tapered surface portions.
JP19269187U 1987-12-21 1987-12-21 Expired - Lifetime JPH0533974Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19269187U JPH0533974Y2 (en) 1987-12-21 1987-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19269187U JPH0533974Y2 (en) 1987-12-21 1987-12-21

Publications (2)

Publication Number Publication Date
JPH0197263U true JPH0197263U (en) 1989-06-28
JPH0533974Y2 JPH0533974Y2 (en) 1993-08-27

Family

ID=31483531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19269187U Expired - Lifetime JPH0533974Y2 (en) 1987-12-21 1987-12-21

Country Status (1)

Country Link
JP (1) JPH0533974Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261144A (en) * 2005-03-15 2006-09-28 Minowa Koa Inc Method of manufacturing resistor and measurement instrument of resistor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261144A (en) * 2005-03-15 2006-09-28 Minowa Koa Inc Method of manufacturing resistor and measurement instrument of resistor

Also Published As

Publication number Publication date
JPH0533974Y2 (en) 1993-08-27

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