JPH0197556U - - Google Patents

Info

Publication number
JPH0197556U
JPH0197556U JP19447787U JP19447787U JPH0197556U JP H0197556 U JPH0197556 U JP H0197556U JP 19447787 U JP19447787 U JP 19447787U JP 19447787 U JP19447787 U JP 19447787U JP H0197556 U JPH0197556 U JP H0197556U
Authority
JP
Japan
Prior art keywords
semiconductor device
flange
flange portion
resin
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19447787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19447787U priority Critical patent/JPH0197556U/ja
Publication of JPH0197556U publication Critical patent/JPH0197556U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す説明図、第
２図はこの考案の他の実施例を示す説明図である
。 図において、１はシヤーシ、２は放熱板、３は
トランジスタ、４はフランジ、５はビス、６は樹
脂コートである。 FIG. 1 is an explanatory diagram showing one embodiment of this invention, and FIG. 2 is an explanatory diagram showing another embodiment of this invention. In the figure, 1 is a chassis, 2 is a heat sink, 3 is a transistor, 4 is a flange, 5 is a screw, and 6 is a resin coat.

Claims (1)

【実用新案登録請求の範囲】 (1) 取り付け用のフランジ部を形成してなる半
導体装置において、該フランジ部は少なくともそ
の表面を合成樹脂で形成してなることを特徴とす
る半導体装置。 (2) 前記フランジ部を樹脂モールドで形成した
ことを特徴とする実用新案登録請求の範囲第１項
に記載の半導体装置。 (3) 前記フランジ部を樹脂コーテイングで形成
したことを特徴とする実用新案登録請求の範囲第
１項に記載の半導体装置。[Claims for Utility Model Registration] (1) A semiconductor device formed with a flange for attachment, characterized in that at least the surface of the flange is formed of synthetic resin. (2) The semiconductor device according to claim 1, wherein the flange portion is formed by resin molding. (3) The semiconductor device according to claim 1, wherein the flange portion is formed by resin coating.
JP19447787U 1987-12-21 1987-12-21 Pending JPH0197556U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19447787U JPH0197556U (en) 1987-12-21 1987-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19447787U JPH0197556U (en) 1987-12-21 1987-12-21

Publications (1)

Publication Number Publication Date
JPH0197556U true JPH0197556U (en) 1989-06-29

Family

ID=31485206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19447787U Pending JPH0197556U (en) 1987-12-21 1987-12-21

Country Status (1)

Country Link
JP (1) JPH0197556U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322654B2 (en) * 1973-04-02 1978-07-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322654B2 (en) * 1973-04-02 1978-07-10

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