JPH02102726U - - Google Patents

Info

Publication number
JPH02102726U
JPH02102726U JP1056889U JP1056889U JPH02102726U JP H02102726 U JPH02102726 U JP H02102726U JP 1056889 U JP1056889 U JP 1056889U JP 1056889 U JP1056889 U JP 1056889U JP H02102726 U JPH02102726 U JP H02102726U
Authority
JP
Japan
Prior art keywords
etching
liquid
hole
etching liquid
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1056889U
Other languages
English (en)
Other versions
JPH0710494Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1056889U priority Critical patent/JPH0710494Y2/ja
Publication of JPH02102726U publication Critical patent/JPH02102726U/ja
Application granted granted Critical
Publication of JPH0710494Y2 publication Critical patent/JPH0710494Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Description

【図面の簡単な説明】
第１図は本考案になるエツチング装置の一実施
例を示す側断面図、第２図は本考案になる装置の
動作を説明する側断面図、第３図は従来のエツチ
ング装置の主要部を示す側断面図、である。図に
おいて、 ２は液溜部、４は基板、５は基板ホルダ、６は
エツチング液、７は装置本体、８，９はエツチン
グ液噴出孔、をそれぞれ表す。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体装置用基板の一主面をエツチングする装
    置であつて、上面に開口し開口部が基板４より大
    きい円錐形の液溜部２と、第１のエツチング液噴
    出孔８と、第２のエツチング液噴出孔９とを具え
    てなる装置本体７を有し、 エツチング液を交互に該液溜部２に供給するよ
    う構成された、第１のエツチング液噴出孔８が該
    液溜部２の中央に配設され、第２のエツチング液
    噴出孔９が該液溜部２の周囲に沿つて、配設され
    てなることを特徴とする基板エツチング装置。
JP1056889U 1989-01-31 1989-01-31 基板エッチング装置 Expired - Lifetime JPH0710494Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1056889U JPH0710494Y2 (ja) 1989-01-31 1989-01-31 基板エッチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1056889U JPH0710494Y2 (ja) 1989-01-31 1989-01-31 基板エッチング装置

Publications (2)

Publication Number Publication Date
JPH02102726U true JPH02102726U (ja) 1990-08-15
JPH0710494Y2 JPH0710494Y2 (ja) 1995-03-08

Family

ID=31218346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1056889U Expired - Lifetime JPH0710494Y2 (ja) 1989-01-31 1989-01-31 基板エッチング装置

Country Status (1)

Country Link
JP (1) JPH0710494Y2 (ja)

Also Published As

Publication number Publication date
JPH0710494Y2 (ja) 1995-03-08

Similar Documents

Publication Publication Date Title
JPH02102726U (ja)
JPS62187680U (ja)
JPH0168163U (ja)
JPS58107158U (ja) 洗浄用ノズル
JPH0450153U (ja)
JPS62154648U (ja)
JPS62202375U (ja)
JPH01169027U (ja)
JPH0215864U (ja)
JPS6232533U (ja)
JPS63127632U (ja)
JPH0371622U (ja)
JPS6441131U (ja)
JPS6370144U (ja)
JPH02122067U (ja)
JPH0327040U (ja)
JPS63754U (ja)
JPS639129U (ja)
JPS6074775U (ja) 回転式表面処理装置
JPS6135984U (ja) 人体局部洗浄装置のノズル構造
JPS6293964U (ja)
JPH0315676U (ja)
JPH0180928U (ja)
JPH02137037U (ja)
JPS6268236U (ja)