JPH0215864U - - Google Patents
Info
- Publication number
- JPH0215864U JPH0215864U JP9389388U JP9389388U JPH0215864U JP H0215864 U JPH0215864 U JP H0215864U JP 9389388 U JP9389388 U JP 9389388U JP 9389388 U JP9389388 U JP 9389388U JP H0215864 U JPH0215864 U JP H0215864U
- Authority
- JP
- Japan
- Prior art keywords
- holder
- polishing
- water
- substrate
- polishing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
第１図は本考案の研磨ホルダの一実施例を示す
断面図、第２図は本考案の研磨ホルダの一実施例
を示す下方斜視図、第３図は本考案の研磨ホルダ
を用いた研磨装置の一実施例を示す正面図である
。
１…基板、２…研磨ホルダ、３…保持部、４…
アーム、５…本体、６…研磨皿、７…主軸、８…
エツチヤントタンク、９…弁、１０…ノズル、１
１…水タンク、１２…弁、１３…スリツプリング
、１４…中空部、１５…穴、１６…注水口。
Fig. 1 is a sectional view showing an embodiment of the polishing holder of the present invention, Fig. 2 is a downward perspective view showing an embodiment of the polishing holder of the present invention, and Fig. 3 is a polishing using the polishing holder of the present invention. FIG. 1 is a front view showing one embodiment of the device. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Polishing holder, 3... Holding part, 4...
Arm, 5... Main body, 6... Polishing plate, 7... Main shaft, 8...
Etchant tank, 9... Valve, 10... Nozzle, 1
DESCRIPTION OF SYMBOLS 1... Water tank, 12... Valve, 13... Slip ring, 14... Hollow part, 15... Hole, 16... Water inlet.
Claims (1)
して、研磨皿上に供給された水溶性エツチヤント
のハイドロプレーン効果により、前記基板を浮上
させ、加工する研磨装置に用いる該基板保持用研
磨ホルダにおいて、ホルダ中心に該ホルダ内に水
を注入すると注入口と、ホルダ下面外周近傍に複
数の水の流出口を備えることを特徴とする研磨ホ
ルダ。 In a polishing holder for holding a substrate used in a polishing apparatus that holds a semiconductor substrate facing a rotating polishing plate and levitates the substrate by the hydroplane effect of a water-soluble etchant supplied onto the polishing plate for processing. A polishing holder comprising: an inlet for injecting water into the holder at the center of the holder; and a plurality of water outlets near the outer periphery of the lower surface of the holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389388U JPH0215864U (en) | 1988-07-14 | 1988-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389388U JPH0215864U (en) | 1988-07-14 | 1988-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215864U true JPH0215864U (en) | 1990-01-31 |
Family
ID=31318371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9389388U Pending JPH0215864U (en) | 1988-07-14 | 1988-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215864U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04129669A (en) * | 1990-09-19 | 1992-04-30 | Mitsubishi Materials Corp | Method and device for super precision polishing of wafer |
| JPH05132136A (en) * | 1991-11-08 | 1993-05-28 | House Food Ind Co Ltd | Water-jet type cutting device of solid matter |
-
1988
- 1988-07-14 JP JP9389388U patent/JPH0215864U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04129669A (en) * | 1990-09-19 | 1992-04-30 | Mitsubishi Materials Corp | Method and device for super precision polishing of wafer |
| JPH05132136A (en) * | 1991-11-08 | 1993-05-28 | House Food Ind Co Ltd | Water-jet type cutting device of solid matter |