JPH02102735U - - Google Patents

Info

Publication number
JPH02102735U
JPH02102735U JP1989011116U JP1111689U JPH02102735U JP H02102735 U JPH02102735 U JP H02102735U JP 1989011116 U JP1989011116 U JP 1989011116U JP 1111689 U JP1111689 U JP 1111689U JP H02102735 U JPH02102735 U JP H02102735U
Authority
JP
Japan
Prior art keywords
electrode
magnetic field
wire
applying means
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989011116U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989011116U priority Critical patent/JPH02102735U/ja
Publication of JPH02102735U publication Critical patent/JPH02102735U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例にかかる検査装置の
斜視図、第２図は他の実施例にかかる検査装置の
斜視図、第３図は従来の検査装置の斜視図である
。 １……ペレツトマウント部、２……半導体ペレ
ツト、３……電極、５……ワイヤ、６……リード
、７……荷重付加手段、９……通電手段、１０…
…磁界付与手段、１００……リードフレーム。 FIG. 1 is a perspective view of an inspection device according to one embodiment of the present invention, FIG. 2 is a perspective view of an inspection device according to another embodiment, and FIG. 3 is a perspective view of a conventional inspection device. DESCRIPTION OF SYMBOLS 1... Pellet mount part, 2... Semiconductor pellet, 3... Electrode, 5... Wire, 6... Lead, 7... Load applying means, 9... Current supply means, 10...
...Magnetic field applying means, 100...Lead frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームのペレツトマウント部にマウン
トした半導体ペレツトの電極と該電極に近接する
リードとの間にボンデイングされたワイヤに引張
荷重を付加する荷重付加手段と、上記ワイヤへの
通電手段と、上記ワイヤに磁界を与える磁界付与
手段よりなる検査装置。 load applying means for applying a tensile load to a wire bonded between an electrode of a semiconductor pellet mounted on a pellet mount portion of a lead frame and a lead close to the electrode; a means for supplying current to the wire; An inspection device consisting of a magnetic field applying means that applies a magnetic field to the area.
JP1989011116U 1989-01-31 1989-01-31 Pending JPH02102735U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989011116U JPH02102735U (en) 1989-01-31 1989-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989011116U JPH02102735U (en) 1989-01-31 1989-01-31

Publications (1)

Publication Number Publication Date
JPH02102735U true JPH02102735U (en) 1990-08-15

Family

ID=31219380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989011116U Pending JPH02102735U (en) 1989-01-31 1989-01-31

Country Status (1)

Country Link
JP (1) JPH02102735U (en)

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