JPH0415237U - - Google Patents

Info

Publication number
JPH0415237U
JPH0415237U JP1990056804U JP5680490U JPH0415237U JP H0415237 U JPH0415237 U JP H0415237U JP 1990056804 U JP1990056804 U JP 1990056804U JP 5680490 U JP5680490 U JP 5680490U JP H0415237 U JPH0415237 U JP H0415237U
Authority
JP
Japan
Prior art keywords
wire
capillary
magnetic field
current
spool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990056804U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990056804U priority Critical patent/JPH0415237U/ja
Publication of JPH0415237U publication Critical patent/JPH0415237U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第３図は本考案の一実施例を示すも
のであつて、第１図は電磁テンシヨナの斜視図、
第２図はワイヤボンダの構成図、第３図は金線に
おける電流と磁界と電磁力との関係を説明するた
めの図、第４図は従来例を示すものであつて、ワ
イヤボンダの構成図、第５図はワイヤボンダにお
けるキヤピラリの動作を説明するための半導体装
置の縦断面図である。 １……スプール、２……金線（ワイヤ）、６…
…キヤピラリ、３……電磁テンシヨナ（磁界印加
手段）、８……第１電源（電流供給手段）、２１
……半導体ペレツト（被ボンデイング物）、２２
……インナーリード（被ボンデイング物）。 1 to 3 show an embodiment of the present invention, in which FIG. 1 is a perspective view of an electromagnetic tensioner;
FIG. 2 is a block diagram of a wire bonder, FIG. 3 is a diagram for explaining the relationship between current, magnetic field, and electromagnetic force in a gold wire, and FIG. 4 is a block diagram of a wire bonder, showing a conventional example. FIG. 5 is a longitudinal sectional view of a semiconductor device for explaining the operation of a capillary in a wire bonder. 1... Spool, 2... Gold wire (wire), 6...
... Capillary, 3 ... Electromagnetic tensioner (magnetic field application means), 8 ... First power supply (current supply means), 21
...Semiconductor pellet (object to be bonded), 22
...Inner lead (object to be bonded).

Claims (1)

【実用新案登録請求の範囲】 スプールから繰り出されキヤピラリに挿通され
たワイヤを被ボンデイング部に押圧しボンデイン
グするワイヤボンダにおいて、 スプールとキヤピラリの間でワイヤに電流を流
す電流供給手段と、この電流供給手段によつて流
れる電流に直交する成分を有する磁界をワイヤに
加える磁界印加手段とが設けられたことを特徴と
するワイヤボンダ。[Scope of Claim for Utility Model Registration] A wire bonder that presses and bonds a wire drawn out from a spool and inserted into a capillary to a part to be bonded, including a current supply means for passing a current through the wire between the spool and the capillary, and the current supply means. 1. A wire bonder comprising: magnetic field applying means for applying a magnetic field having a component perpendicular to a current flowing through the wire to the wire.
JP1990056804U 1990-05-29 1990-05-29 Pending JPH0415237U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990056804U JPH0415237U (en) 1990-05-29 1990-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990056804U JPH0415237U (en) 1990-05-29 1990-05-29

Publications (1)

Publication Number Publication Date
JPH0415237U true JPH0415237U (en) 1992-02-06

Family

ID=31580958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990056804U Pending JPH0415237U (en) 1990-05-29 1990-05-29

Country Status (1)

Country Link
JP (1) JPH0415237U (en)

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