JPH02103220A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH02103220A JPH02103220A JP25494288A JP25494288A JPH02103220A JP H02103220 A JPH02103220 A JP H02103220A JP 25494288 A JP25494288 A JP 25494288A JP 25494288 A JP25494288 A JP 25494288A JP H02103220 A JPH02103220 A JP H02103220A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid
- solid
- bisphenol
- normal temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 27
- 239000000203 mixture Substances 0.000 title abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000007787 solid Substances 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 10
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 7
- 230000035939 shock Effects 0.000 abstract description 8
- 239000011256 inorganic filler Substances 0.000 abstract description 5
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 5
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005266 casting Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 description 4
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- -1 alicyclic acid anhydride Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、液状で作業性が良好であると共に、ヒートシ
ョック性、耐湿性及び高電圧特性に優れた電気、電子部
品注型材料用エポキシ樹脂組成物に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides an epoxy for casting materials for electrical and electronic components that is liquid and has good workability, and has excellent heat shock resistance, moisture resistance, and high voltage characteristics. This invention relates to a resin composition.
高温高圧下で使用される電子電気部品は、使用ｂ＼“
中に絶縁破壊を生じること幀しばしば！ある。エポキシ
樹脂注型材料においては、このような高電圧特性を改良
するため、従来、固形エポキシ樹脂と固形又は液状酸無
水物を高温（１５０°Ｃ程度）で加熱溶融させて行なう
のが一般的であったが、固形の材料を使用するため作業
性が非常に悪く、自動化が行なえない欠点があった。Electronic and electrical components used under high temperature and high pressure often suffer from dielectric breakdown during use.In order to improve such high voltage characteristics in epoxy resin casting materials, conventionally solid It was common practice to heat and melt epoxy resin and solid or liquid acid anhydride at high temperatures (approximately 150°C), but since solid materials are used, workability is very poor and automation is not possible. There were drawbacks.
本発明は、高電圧特性を高水準に維持しながら、作業性
を改良し、自動化を行なえるエポキシ樹脂組成物を提供
することを目的とするものである。An object of the present invention is to provide an epoxy resin composition that improves workability and can be automated while maintaining high voltage characteristics at a high level.
本発明は、エポキシ当量４００〜１０００の常温で固形
のビスフェノールＡ型エポキシ樹脂とエポキシ当量２５
０以下の常温で液状のエポキシ樹脂とが２０番：８０〜
８０ ： ２０ （重量比）であるエポキシ樹脂、およ
び常温で液状のポリカルボン酸無水物を主成分とするこ
とを特徴とするエポキシ樹脂組成物である。The present invention uses a bisphenol A type epoxy resin that is solid at room temperature with an epoxy equivalent of 400 to 1000 and an epoxy equivalent of 25.
Epoxy resin that is liquid at room temperature below 0 is No. 20: 80 ~
This is an epoxy resin composition characterized by containing as main components an epoxy resin having a weight ratio of 80:20 and a polycarboxylic acid anhydride that is liquid at room temperature.
本発明で用いる常温で固形のビスフェノールＡ型エポキ
シ樹脂は、エポキシ当量が４００〜１０００であれば特
に限定されない。The bisphenol A type epoxy resin that is solid at room temperature used in the present invention is not particularly limited as long as it has an epoxy equivalent of 400 to 1000.
エポキシ当量２５０以下で常温で液状のエポキシ樹脂と
しては、分子中に２個以上のエポキシ基を有する化合物
であれば特に限定されない０例えば、ビスフェノールＡ
型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、脂
環式エポキシ樹脂等を例示することができる。Epoxy resins that are liquid at room temperature and have an epoxy equivalent of 250 or less are not particularly limited as long as they have two or more epoxy groups in the molecule.For example, bisphenol A
Examples include a type epoxy resin, a bisphenol F type epoxy resin, and an alicyclic epoxy resin.
本発明に用いる常温で固形のビスフェノール型エポキシ
樹脂は、電気特性、特に高電圧特性がすぐれ、可撓性で
あるので耐ヒートシ式ツタ性にもすぐれている。しかし
ながら、前述のように固形であるので、作業性が劣ると
いう欠点がある。この欠点を改良するために低分子量の
液状エポキシ樹脂を配合する。The bisphenol-type epoxy resin used in the present invention, which is solid at room temperature, has excellent electrical properties, especially high voltage properties, and is flexible and has excellent heat-seal resistance. However, as mentioned above, since it is solid, it has the disadvantage of poor workability. In order to improve this drawback, a low molecular weight liquid epoxy resin is blended.
液状エポキシ樹脂は、その他電気特性などがすぐれてい
るのが好ましい。この液状エポキシ樹脂の配合量は作業
性が満足されれば少量の方が好ましいが、通常固形エポ
キシ樹脂と液状エポキシ樹脂の割合は重量比で２０ ：
８０〜８０ ： ２０である。固形エポキシ樹脂の割
合が２０部未満では可撓性、高電圧特性が劣化し、８０
部を越えると作業性が悪く自動化が困難となる。The liquid epoxy resin preferably has other excellent electrical properties. A small amount of liquid epoxy resin is preferable if workability is satisfied, but usually the ratio of solid epoxy resin to liquid epoxy resin is 20:
80-80:20. If the proportion of solid epoxy resin is less than 20 parts, flexibility and high voltage characteristics will deteriorate, and
If the number of parts exceeds the number of parts, work efficiency will be poor and automation will be difficult.
ポリカルボン酸無水物は常温で液状であれば特に限定さ
れない。The polycarboxylic anhydride is not particularly limited as long as it is liquid at room temperature.
例えば、メチルへキサヒドロ無水フタル酸、メチルテト
ラヒドロ無水フタル酸、脂環式酸無水物、無水メチルナ
ジック酸等を例示することができる。Examples include methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, alicyclic acid anhydride, and methylnadic anhydride.
また常温で固体の無水フタル酸、テトラヒドロ無水フタ
ル酸等は他の酸無水物と、常温で液状の共融混合物を形
成せしめることにより使用することができる。Furthermore, phthalic anhydride, tetrahydrophthalic anhydride, etc. which are solid at room temperature can be used by forming a eutectic mixture which is liquid at room temperature with other acid anhydrides.
本発明において、高電圧特性を向上させるために無機充
填材を配合するのが好ましい、この無機充填材は特に限
定されないが、例えば、シリカ、アルミナ、水酸化アル
ミニウム、タルク、マイカ、炭酸カルシウム等を例示す
ることができる。無機充填材の含有量は通常前記エポキ
シ樹脂組成物に対して１０〜６０重量％である。In the present invention, it is preferable to incorporate an inorganic filler in order to improve high voltage characteristics.This inorganic filler is not particularly limited, but includes, for example, silica, alumina, aluminum hydroxide, talc, mica, calcium carbonate, etc. I can give an example. The content of the inorganic filler is usually 10 to 60% by weight based on the epoxy resin composition.
１０重世％未満では、高電圧特性の向上効果が小さく、
６０重量％を越えると粘度が高いため注型作業性が悪く
なり、自動化が困難となる。If it is less than 10%, the effect of improving high voltage characteristics is small;
If it exceeds 60% by weight, the viscosity is high, resulting in poor casting workability and difficulty in automation.
第１表に示す配合組成にて無機充填材含有エボ〜
キシ組成物を１Ｎ整した。混合後直ちに粘度（６０°Ｃ
）を測定した。A 1N inorganic filler-containing epoxy composition was prepared using the formulation shown in Table 1. Immediately after mixing, the viscosity (60°C
) was measured.
次に、得られた組成物を１００℃２時間、次いで１５０
°Ｃ２時間加熱硬化させた。この硬化物について高電圧
特性及びヒートショック性を測定した。Next, the obtained composition was heated at 100°C for 2 hours, then at 150°C.
It was heated and cured at °C for 2 hours. The high voltage properties and heat shock properties of this cured product were measured.
これらをまとめて第１表に示す。These are summarized in Table 1.
第 １ 表
Ｍ ｅ ＩＩ ＩＩ Ｐ＾：メチルテトラヒドロフタル
酸無水物２Ｅ４ＭＺ ： ２−エチル−４−メチルイミ
ダゾール（測定方法の説明）
高電圧特性：８０°Ｃ４０ＫＶで絶縁破壊を生じるまで
の時間を測定し、１０００時間以上を良好とした。Table 1 M e II II P^: Methyltetrahydrophthalic anhydride 2E4MZ: 2-ethyl-4-methylimidazole (Description of measurement method) High voltage characteristics: Measure the time until dielectric breakdown occurs at 80°C and 40KV. , 1000 hours or more was considered good.
ヒートショック性；−３０°Ｃ１３０分→１２０℃、３
０分のサイクルを５０回くり返し、
クランクの有無を調べた。Heat shock resistance: -30°C 130 minutes → 120°C, 3
The zero minute cycle was repeated 50 times and the presence or absence of a crank was examined.
Ｏクランクなし
得られた結果をみると、実施例の樹脂組成物は、粘度が
低く、得られた硬化物はヒートショック性、高電圧特性
も優れている。Looking at the results obtained without an O-crank, the resin compositions of Examples have low viscosity, and the obtained cured products have excellent heat shock resistance and high voltage characteristics.
比較例１の樹脂組成物は粘度は低く作業性はよいが、ヒ
ートショック性及び高電圧特性が劣っている。The resin composition of Comparative Example 1 has low viscosity and good workability, but is poor in heat shock resistance and high voltage characteristics.
比較例２の樹脂組成物はヒートショック性、高電圧特性
が優れているものの、粘度が非常に高く、自動化が困難
である。Although the resin composition of Comparative Example 2 has excellent heat shock properties and high voltage properties, it has a very high viscosity and is difficult to automate.
本発明は高分子量のビスフェノールＡ型エポキシ樹脂を
主成分のひとつとして用いているために高電圧特性、耐
ヒートシヨツク性に優れかつ、常温で液状のエポキシ樹
脂と組み合わせて使用し、かつ常温で液状の酸無水物を
使用しているため、注型作業性もすぐれており、自動化
ラインで作業することができる。Since the present invention uses a high molecular weight bisphenol A type epoxy resin as one of the main components, it has excellent high voltage characteristics and heat shock resistance, and can be used in combination with an epoxy resin that is liquid at room temperature. Because it uses an acid anhydride, it has excellent casting workability and can be worked on an automated line.
Claims (1)
スフェノールＡ型エポキシ樹脂とエポキシ当量２５０以
下の常温で液状のエポキシ樹脂とが２０：８０〜８０：
２０（重量比）であるエポキシ樹脂、および常温で液状
のポリカルボン酸無水物を主成分とすることを特徴とす
るエポキシ樹脂組成物。(1) Bisphenol A type epoxy resin that is solid at room temperature with an epoxy equivalent of 400 to 1000 and epoxy resin that is liquid at room temperature and has an epoxy equivalent of 250 or less in a ratio of 20:80 to 80:
20 (weight ratio) and a polycarboxylic acid anhydride that is liquid at room temperature as main components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25494288A JPH02103220A (en) | 1988-10-12 | 1988-10-12 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25494288A JPH02103220A (en) | 1988-10-12 | 1988-10-12 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02103220A true JPH02103220A (en) | 1990-04-16 |
Family
ID=17271999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25494288A Pending JPH02103220A (en) | 1988-10-12 | 1988-10-12 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02103220A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001172495A (en) * | 1999-12-21 | 2001-06-26 | Toto Resin Kako Kk | Epoxy resin composition for casting |
| WO2013143097A1 (en) | 2012-03-29 | 2013-10-03 | Dow Global Technologies Llc | Curable compositions |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236199A (en) * | 1975-09-16 | 1977-03-19 | Westinghouse Electric Corp | Resin composite of no solvent use for impregnation |
| JPS53125500A (en) * | 1977-04-05 | 1978-11-01 | Westinghouse Electric Corp | Solventless resin compound for impregnation |
| JPS5512175A (en) * | 1978-07-13 | 1980-01-28 | Matsushita Electric Ind Co Ltd | Resist ink |
| JPS5676448A (en) * | 1979-11-29 | 1981-06-24 | Hitachi Chem Co Ltd | Epoxy resin composition |
-
1988
- 1988-10-12 JP JP25494288A patent/JPH02103220A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236199A (en) * | 1975-09-16 | 1977-03-19 | Westinghouse Electric Corp | Resin composite of no solvent use for impregnation |
| JPS53125500A (en) * | 1977-04-05 | 1978-11-01 | Westinghouse Electric Corp | Solventless resin compound for impregnation |
| JPS5512175A (en) * | 1978-07-13 | 1980-01-28 | Matsushita Electric Ind Co Ltd | Resist ink |
| JPS5676448A (en) * | 1979-11-29 | 1981-06-24 | Hitachi Chem Co Ltd | Epoxy resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001172495A (en) * | 1999-12-21 | 2001-06-26 | Toto Resin Kako Kk | Epoxy resin composition for casting |
| WO2013143097A1 (en) | 2012-03-29 | 2013-10-03 | Dow Global Technologies Llc | Curable compositions |
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