JPH02106361A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH02106361A JPH02106361A JP63259113A JP25911388A JPH02106361A JP H02106361 A JPH02106361 A JP H02106361A JP 63259113 A JP63259113 A JP 63259113A JP 25911388 A JP25911388 A JP 25911388A JP H02106361 A JPH02106361 A JP H02106361A
- Authority
- JP
- Japan
- Prior art keywords
- pcb
- pcbs
- circuit
- print head
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Structure Of Printed Boards (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は各種電子機器内に使用されるプリント基板に関
する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a printed circuit board used in various electronic devices.
〔従来の技術]
現在プリント基板は電子機器を制御する為の各種回路素
子を取付ける為に不可欠な部品の1つである。このプリ
ント基板は1つの電子機器内に複数枚使用されることが
普通である。[Prior Art] Printed circuit boards are currently one of the essential parts for mounting various circuit elements for controlling electronic equipment. It is common for a plurality of printed circuit boards to be used in one electronic device.
第5図は後述する液晶プリンタの印字ヘッド部に使用さ
れている3枚のプリント基板の配設構成を示すものであ
る。また、第6図は第5図の模式的断面図を示し、第7
図は第5図の側面図を示す。FIG. 5 shows the arrangement of three printed circuit boards used in a print head section of a liquid crystal printer, which will be described later. Moreover, FIG. 6 shows a schematic cross-sectional view of FIG.
The figure shows a side view of FIG.
液晶プリンタに使用される印字ヘッド1は液晶プリンタ
内の図示しない感光体へ画像データに基づく露光を行う
装置であり、液晶シャッタ2に形成された多数のマイク
ロシャンクを開閉制御し、光伝送ロンド3を介して出射
される図示しないハロゲンランプからの光を選択透過し
結像レンズアレイ4により感光体に露光を行う装置であ
る。この印字ヘッド1には3枚のプリント基板(以下P
CBで示す)5〜7が使用されている。このPCB5〜
7は上述の液晶シャッタ2、光伝送ロッド3、結像レン
ズアレイ4と共にランプユニット8やヘッドベース9に
直接またはスペーサ10a、10b等を介して取付けら
れている。A print head 1 used in a liquid crystal printer is a device that exposes a photoreceptor (not shown) inside the liquid crystal printer to light based on image data. This device selectively transmits light emitted from a halogen lamp (not shown) through the imaging lens array 4 and exposes the photoreceptor to the light. This print head 1 has three printed circuit boards (hereinafter P
5 to 7 (indicated by CB) are used. This PCB5~
7 is attached to the lamp unit 8 and head base 9 together with the above-mentioned liquid crystal shutter 2, light transmission rod 3, and imaging lens array 4, either directly or via spacers 10a, 10b, etc.
PCB5は印字ヘッド1の動作制御用の回路基板であり
、必要とする回路素子が多数取付けられ、例えばハロゲ
ンランプの光量制御や、液晶シャッタ2の温度制御等を
行う。PCB6と7は液晶シャッタ2とヒートシール6
′または7′を介して接続され、上述のマイクロシャッ
タを開閉制御する駆動信号を供給する回路素子が取付け
られた基板である。そして、各PCB5〜7は図示しな
い接続コネクタ及びリード線等により各々電気的に接続
され信号の授受が行われている。このようなPCBの取
付けは印字ヘッド1に限らず、他の電子機器内の装置で
も同様に行われている。The PCB 5 is a circuit board for controlling the operation of the print head 1, and is equipped with a large number of necessary circuit elements, for example controlling the light amount of a halogen lamp and controlling the temperature of the liquid crystal shutter 2. PCB6 and 7 are LCD shutter 2 and heat seal 6
This is a board on which a circuit element is attached, which is connected to the micro-shutter via the micro-shutter. The PCBs 5 to 7 are electrically connected to each other by connectors, lead wires, etc. (not shown), and signals are exchanged. Such PCB attachment is not limited to the print head 1, but is similarly performed in devices within other electronic devices.
近年電子機器は小型化の傾向にあり、例えば上述の液晶
プリンタでも同様に小型化が要求されている。この為印
字ヘッド1等をコンパクトに構成する必要があり、例え
ば上述の様なPCB5〜7の取付は方法では以下のよう
な問題が発生する。In recent years, electronic devices have tended to become smaller, and for example, the above-mentioned liquid crystal printers are also required to be smaller. For this reason, it is necessary to construct the print head 1 etc. compactly, and for example, the following problems occur when mounting the PCBs 5 to 7 as described above.
イ) 第5図、第7図に特に示すように高さの高い(外
形の大きい)回路素子(例えば電解コンデンサ)11が
PCBS上に取付けられると(搭載されると)、印字ヘ
ッド1は図示しないケースで覆われる為、印字ヘッドl
自体の外形が大きくなり、その結果液晶プリンタの小型
化に逆行することになる。b) As particularly shown in FIGS. 5 and 7, when a high-height (large-outline) circuit element (for example, an electrolytic capacitor) 11 is mounted (mounted) on the PCBS, the print head 1 is The print head is not covered by the case.
The external size of the printer itself becomes larger, which goes against the trend of miniaturization of liquid crystal printers.
口) 3枚のPCB5〜7を各々液晶ヘッド1の所定位
置に個々に取付ける為、PCB5〜7の取付けに時間を
要し、印字ヘッド1の効率良い組立作業ができない。Since the three PCBs 5 to 7 are each individually attached to a predetermined position of the liquid crystal head 1, it takes time to attach the PCBs 5 to 7, making it impossible to assemble the print head 1 efficiently.
以上の問題は、液晶プリンタ(印字ヘッド)に限らず他
の電子機器でも同様に存在する問題である。The above problems are not limited to liquid crystal printers (print heads) but also exist in other electronic devices.
〔発明の目的]
本発明は上述の従来の欠点に鑑み、電子機器を小型化す
ると共に組立作業を節単に行うことを可能としたPCB
を提供することを目的とする。[Object of the Invention] In view of the above-mentioned conventional drawbacks, the present invention provides a PCB that makes it possible to miniaturize electronic equipment and simplify assembly work.
The purpose is to provide
上記目的は、本発明によれば、電子部品の搭載される2
以上の回路群と、該各回路群を折曲あるいは切断する分
割部と、該分割部間に架橋された導電部材とを有するプ
リント基板を提供することによって達成される。According to the present invention, the above object is achieved by
This is achieved by providing a printed circuit board that includes the above circuit groups, dividing portions for bending or cutting each of the circuit groups, and a conductive member bridged between the dividing portions.
以下、本発明の実施例を添付図面に従って詳述する。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
本実施例のPCB及びPCBの製造方法によって製造さ
れるPCBは後述する第2図に示す液晶プリンタ34の
印字ヘッド18に取付けられ使用されるものである。The PCB of this embodiment and the PCB manufactured by the PCB manufacturing method are used by being attached to the print head 18 of a liquid crystal printer 34 shown in FIG. 2, which will be described later.
第1図は印字ヘッドに取付けられる2枚のPCBが一体
に作成された状態を示す図である。この2枚のPCB1
3.14には印字ヘッド18の動作制御用の回路素子及
びマイクロシャッタの開閉制御用の回路素子が取付けら
れている。また、PCB13.14にはPCB13,1
4間の分割部15を架橋する中継ジャンパ16が取付け
られている。この2枚のPCB]3,14の一体形成は
分割部15が切削され、プリント配線及び多数の孔が設
けられた大きなプリント板に同図(a)に示す抵抗、コ
ンデンサ、IC等の各種の回路素子12゜17を差し込
み、例えば半田層にジャブ漬けすることにより作成され
る。このようにして作成されたPCB13.14を第1
図(b)の印字ヘッド18に取付ける時には例えばPC
B 14を矢印A方向に折曲げ、分割部15を境にPC
B13.14を割る(分割する)。そして同図(b)に
示す如く、印字ヘッド18に設けられたPCB取付板1
9に取付ける。この時PCB 13はPCB取付板19
にスペーサ20を介してナラ1−21’ (後述する
第3図)により締着され、PCB14はPCB取付板1
9にネジ21により締着される。FIG. 1 is a diagram showing a state in which two PCBs attached to a print head are manufactured as one piece. These two PCB1
Attached to 3.14 are circuit elements for controlling the operation of the print head 18 and circuit elements for controlling opening and closing of the micro shutter. Also, PCB13.14 has PCB13,1
A relay jumper 16 is attached to bridge the divided portion 15 between the four. These two PCBs] 3 and 14 are integrally formed by cutting out the dividing part 15 and installing various types of resistors, capacitors, ICs, etc. shown in Figure (a) on a large printed board with printed wiring and numerous holes. It is created by inserting the circuit elements 12 and 17 and, for example, dipping them into a solder layer. PCB13.14 created in this way is
For example, when installing the print head 18 in Figure (b),
Fold B 14 in the direction of arrow A, and connect the PC with the dividing part 15 as the border.
B13. Divide (divide) 14. As shown in FIG. 1(b), the PCB mounting plate 1 provided on the print head 18
Attach to 9. At this time, PCB 13 is PCB mounting plate 19
The PCB 14 is fastened to the PCB mounting plate 1 through the spacer 20 by the oak 1-21' (see FIG. 3, which will be described later).
9 with screws 21.
PCB13.14が取付けられた印字へ・ンド18の斜
視図が第3図である。第1図(b)、第3図に示す如く
、両PCB13.14は中継ジャンパ16により接続さ
れている為、分割後各々のPCB13と14間をコネク
タやリード線で接続する必要もなく、しかも上述の如く
一体で簡単に取付けできる。FIG. 3 is a perspective view of the print head 18 with the PCBs 13, 14 attached. As shown in Fig. 1(b) and Fig. 3, both PCBs 13 and 14 are connected by relay jumper 16, so there is no need to connect each PCB 13 and 14 with connectors or lead wires after division. As mentioned above, it can be easily installed in one piece.
また、本実施例で使用する印字ヘッド18は第4図に示
す内部構造を有する。即ち印字ヘッド1日は光源ユニッ
ト22と、ヘッドベース23で構成され、上述のPCB
13.14は塵芥の侵入を防止する為カバー24で覆わ
れている。光源ユニット22内には図示しないハロゲン
ランプからの光を液晶シャッタパネル25へ照射する為
の光伝送ロッド26が設けられ、ヘッドベース23内に
は液晶シャッタパネル25に形成された図示しないマイ
クロシャッタを透過した光が入射する結像レンズアレイ
27がスペーサ28により圧接固定されている。また、
液晶シャッタパネル25の一端からマイクロシャッタの
駆動回路29aを取付けたTABフィルム29が接続さ
れている。このTABフィルム29の他端は中継基板3
0に接続され、中継基板30と上述のPCB 13はコ
ネクタ31,32、リード線33で接続されている。Further, the print head 18 used in this embodiment has an internal structure shown in FIG. That is, the print head consists of a light source unit 22 and a head base 23, and is connected to the above-mentioned PCB.
13 and 14 are covered with a cover 24 to prevent dust from entering. A light transmission rod 26 is provided in the light source unit 22 for irradiating light from a halogen lamp (not shown) to the liquid crystal shutter panel 25, and a micro shutter (not shown) formed in the liquid crystal shutter panel 25 is provided in the head base 23. An imaging lens array 27 on which the transmitted light enters is fixed by a spacer 28 under pressure. Also,
A TAB film 29 to which a micro-shutter drive circuit 29a is attached is connected to one end of the liquid crystal shutter panel 25. The other end of this TAB film 29 is the relay board 3
0, and the relay board 30 and the above-mentioned PCB 13 are connected by connectors 31, 32 and lead wires 33.
従って、印字ヘッド18は液晶シャッタパネル25の左
側(第4図に対して)にTABフィルム29が配設され
、さらに左側に中継基板30が配設されている構成で°
あり、この為、印字ヘッド18の左側上部には大きなス
ペースBが形成されている。本実施例では印字ヘッド1
8の左側に取付けられるPCB14に第1図(b)に示
す如(高さの高い(サイズの大きな)回路素子17を配
設することにより、大きなスペースBを有効利用してい
る。Therefore, the print head 18 has a configuration in which the TAB film 29 is disposed on the left side of the liquid crystal shutter panel 25 (with respect to FIG. 4), and the relay board 30 is further disposed on the left side.
Therefore, a large space B is formed at the upper left side of the print head 18. In this embodiment, print head 1
As shown in FIG. 1(b), a large space B is effectively utilized by arranging a tall (large size) circuit element 17 on a PCB 14 attached to the left side of the PCB 8.
また、PCB13に高さの低い(サイズの小さい)回路
素子12を配設することにより印字ヘッド18を小さく
構成できる。従って、第2図に示す如く液晶プリンタ3
4内の感光体ドラム35周面近傍の帯電器36、現像器
37、転写器38、クリーナ39と共に上述の印字ヘッ
ド18を配設すると、印字ヘッド18は上述の如く小さ
く構成されている為、例えば液晶プリンタ34の高さを
低くでき、液晶プリンタ34を小型化できる。Further, by arranging the circuit element 12 having a low height (small size) on the PCB 13, the print head 18 can be configured to be small. Therefore, as shown in FIG.
When the print head 18 described above is arranged together with the charger 36, developer 37, transfer device 38, and cleaner 39 near the circumferential surface of the photoreceptor drum 35 in the photoreceptor drum 35, the print head 18 is configured to be small as described above. For example, the height of the liquid crystal printer 34 can be reduced, and the size of the liquid crystal printer 34 can be reduced.
尚、上記液晶プリンタ34は給紙コロ40により給紙カ
セット41内の用紙を転写器38の方向へ搬送し、転写
器3日により感光体ドラム35に形成された例えばトナ
ー像を用紙へ転写し、定着器42によりトナー像を用紙
へ熱定着して画像形成を行う。The liquid crystal printer 34 uses a paper feed roller 40 to transport the paper in the paper cassette 41 toward the transfer device 38, and the transfer device transfers, for example, a toner image formed on the photoreceptor drum 35 onto the paper. , a fixing device 42 thermally fixes the toner image onto a sheet of paper to form an image.
以上のように本実施例は、PCB13に比較的高さの低
い回路素子12を取付け、PCB14に高さの高い回路
素子17を取付けることで上述の如く印字ヘッド18内
のスペースを有効利用し印字ヘッド18を小型化するも
のである
また、本実施例の如く中継ジャンパ16を用いて2枚の
PCB13.14を一体として製造することによりプリ
ント基板を効率よく使用できる。As described above, in this embodiment, the relatively low-height circuit element 12 is mounted on the PCB 13, and the high-height circuit element 17 is mounted on the PCB 14, so that the space within the print head 18 can be effectively utilized as described above. The head 18 can be made smaller. In addition, by manufacturing two PCBs 13 and 14 as one piece using the relay jumper 16 as in this embodiment, the printed circuit board can be used efficiently.
尚、本実施例では上述の如く分割部15を割って使用し
たが折曲げる構成としても良い。また、本実施例として
はPCB13.14を液晶プリンタ34の印字ヘッド1
8に適用した例を示したが、上記印字ヘッド18の如く
高密度実装、小型化が要求される他の装置にも適用でき
ることは勿論である。In this embodiment, the divided portion 15 is split as described above, but it may be bent. Further, in this embodiment, the PCB 13.14 is used as the print head 1 of the liquid crystal printer 34.
Although an example in which the present invention is applied to the print head 18 is shown, it is of course applicable to other devices that require high-density packaging and miniaturization, such as the print head 18 described above.
以上詳細に説明したように本発明によれば、液晶プリン
タ等の電子機器を小型化することができる。As described above in detail, according to the present invention, electronic devices such as liquid crystal printers can be downsized.
また、装置へのPCBの取付けも簡単に行え組立作業を
容易に行うことができる。Furthermore, the PCB can be easily attached to the device, and assembly work can be easily performed.
さらに、中継ジャンパで予め分割または折曲されるPC
B間を接続してお(ことにより、PCB間の電気接続に
コネクタ、リード線等を使用する必要がなくなり、部品
の削減によるコストダウンを図ることができる。In addition, PCs that are split or bent in advance with relay jumpers
By connecting PCBs, there is no need to use connectors, lead wires, etc. for electrical connections between PCBs, and costs can be reduced by reducing the number of parts.
第1図(a)は一実施例のPCBの製造方法を説明する
図、
第1図Φ)は一実施例のPCBの製造方法により製造さ
れたPCBを印字ヘッドに取付ける例を説明する図、
第2図は上記印字ヘッドが配設された液晶プリンタの概
略構成図、
第3図は第1図(b)の斜視図、
第4図は上記印字ヘッドの模式的断面図、第5図は従来
の印字ヘッドの斜視図、
第6図は従来の印字ヘッドの模式的断面図、第7図は従
来の印字ヘッドへPCBを取付けた状態を示す構成図で
ある。
12.17・・・回路素子、
13.14・・・PCB。
15・・・分割部、
16・・・中継ジャンパ、
18・・・印字ヘッド、
19・・・PCB取付は基板、
20・・・スペーサ、
21・・・ネジ、
21’ ・・・ナツト。
特許出願人 カシオ計算機株式会社
第
図
第
図FIG. 1(a) is a diagram illustrating a method for manufacturing a PCB according to an embodiment, FIG. Fig. 2 is a schematic configuration diagram of a liquid crystal printer equipped with the above print head, Fig. 3 is a perspective view of Fig. 1 (b), Fig. 4 is a schematic sectional view of the above print head, and Fig. 5 is a FIG. 6 is a perspective view of a conventional print head, FIG. 6 is a schematic sectional view of the conventional print head, and FIG. 7 is a configuration diagram showing a state in which a PCB is attached to the conventional print head. 12.17...Circuit element, 13.14...PCB. 15...Division part, 16...Relay jumper, 18...Print head, 19...PCB mounting board, 20...Spacer, 21...Screw, 21'...Nut. Patent applicant: Casio Computer Co., Ltd.
Claims (3)
路群を折曲あるいは切断する分割部と、該分割部間に架
橋された導電部材とを有するプリント基板。(1) A printed circuit board having two or more circuit groups on which electronic components are mounted, a dividing portion for bending or cutting each circuit group, and a conductive member bridged between the dividing portions.
予め一枚の基板に折曲あるいは切断可能な分割部と、該
分割部を境に電子部品の搭載される2以上の回路群とを
設けると共に、前記回路群間を導電部材で接続した後前
記分割部を折曲あるいは切断することを特徴とするプリ
ント基板の製造方法。(2) A divided part that can be bent or cut into a single board in advance so that it can be attached in accordance with the shape of a predetermined installation part, and two or more circuits on which electronic components are mounted with the divided part as a border. 1. A method of manufacturing a printed circuit board, characterized in that the divided portions are bent or cut after connecting the circuit groups with a conductive member.
され、大きさの異なる電子部品が搭載された2以上の回
路部を有するプリント基板が使用され、該プリント基板
の中で小さな回路素子を搭載した回路部が配設スペース
の狭い第1の配設部に設けられ、大きな回路素子を搭載
した回路部が配設スペースの広い第2の配設部に設けら
れていることを特徴とする電子機器。(3) A printed circuit board is used that has two or more circuit sections on which electrically conductive members are bridged between bent or cut divided sections and electronic components of different sizes are mounted, and a small circuit element is used in the printed circuit board. The circuit section mounted with the large circuit element is provided in the first arrangement section, which has a narrow arrangement space, and the circuit section, which carries the large circuit element, is provided in the second arrangement section, which has a large arrangement space. electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63259113A JPH02106361A (en) | 1988-10-14 | 1988-10-14 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63259113A JPH02106361A (en) | 1988-10-14 | 1988-10-14 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106361A true JPH02106361A (en) | 1990-04-18 |
Family
ID=17329497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63259113A Pending JPH02106361A (en) | 1988-10-14 | 1988-10-14 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106361A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04123777A (en) * | 1990-09-13 | 1992-04-23 | Hirose Electric Co Ltd | Connector device and manufacture thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5761890B2 (en) * | 1977-01-14 | 1982-12-27 | Toyota Motor Co Ltd |
-
1988
- 1988-10-14 JP JP63259113A patent/JPH02106361A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5761890B2 (en) * | 1977-01-14 | 1982-12-27 | Toyota Motor Co Ltd |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04123777A (en) * | 1990-09-13 | 1992-04-23 | Hirose Electric Co Ltd | Connector device and manufacture thereof |
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