JPH02108342U - - Google Patents

Info

Publication number
JPH02108342U
JPH02108342U JP1989016300U JP1630089U JPH02108342U JP H02108342 U JPH02108342 U JP H02108342U JP 1989016300 U JP1989016300 U JP 1989016300U JP 1630089 U JP1630089 U JP 1630089U JP H02108342 U JPH02108342 U JP H02108342U
Authority
JP
Japan
Prior art keywords
side wall
substrate
electronic component
cold plate
cooling liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989016300U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989016300U priority Critical patent/JPH02108342U/ja
Publication of JPH02108342U publication Critical patent/JPH02108342U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る冷却構造体の一部破断断
面図。 １０……基台、１２……コールドプレート、１
４……側壁、１６……上部側壁、１８……下部側
壁、２０……スペーサ部材、２４……伸縮可能密
封部材、２６……基板、２８……電子部品、３０
……ベローズ。 FIG. 1 is a partially cutaway sectional view of a cooling structure according to the present invention. 10... Base, 12... Cold plate, 1
4... Side wall, 16... Upper side wall, 18... Lower side wall, 20... Spacer member, 24... Expandable sealing member, 26... Board, 28... Electronic component, 30
...Bellows.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基台１０と、冷却液３６を流すコールドプレー
ト１２と、側壁１４とによつて囲繞、密封された
領域内で、基板２６に実装された電子部品２８が
前記コールドプレート１２と連通したベローズ３
０内を流れる前記冷却液３６によつて冷却される
電子部品２８の冷却構造において、前記側壁１４
が上部側壁１６と、下部側壁１８と、前記基板２
６の厚さ寸法に対応した高さ寸法Ｈ１を有するス
ペーサ部材２０と、前記上部側壁１６と下部側壁
１８との間に亘つて設けられ、上下方向に伸縮す
る密封部材２４とを具備したことを特徴とする電
子部品の冷却構造。 A bellows 3 in which an electronic component 28 mounted on a substrate 26 communicates with the cold plate 12 in an area surrounded and sealed by the base 10, the cold plate 12 through which the cooling liquid 36 flows, and the side wall 14.
In the cooling structure for the electronic component 28 that is cooled by the cooling liquid 36 flowing inside the side wall 14
is the upper side wall 16, the lower side wall 18, and the substrate 2.
A spacer member 20 having a height dimension H1 corresponding to the thickness dimension of 6, and a sealing member 24 that is provided between the upper side wall 16 and the lower side wall 18 and expands and contracts in the vertical direction. Features a cooling structure for electronic components.
JP1989016300U 1989-02-16 1989-02-16 Pending JPH02108342U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989016300U JPH02108342U (en) 1989-02-16 1989-02-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989016300U JPH02108342U (en) 1989-02-16 1989-02-16

Publications (1)

Publication Number Publication Date
JPH02108342U true JPH02108342U (en) 1990-08-29

Family

ID=31229112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989016300U Pending JPH02108342U (en) 1989-02-16 1989-02-16

Country Status (1)

Country Link
JP (1) JPH02108342U (en)

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