JPH0210883A - How to control the drawing machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for controlling a drawing machine for drawing a circuit forming material at a plurality of locations on a circuit forming substrate using a drawing machine having a plurality of nozzles.

2. Description of the Related Art Conventionally, when drawing a circuit-forming material at multiple locations on a circuit-forming substrate using a drawing machine having a plurality of nozzles, a drawing processing procedure was manually created by a skilled person.

Problems to be Solved by the Invention The above method is difficult to automate due to the need to consider the nozzle switching time, and requires manual work by skilled workers, so it is not always possible to control the drawing machine image using the shortest drawing-like work procedure. In addition, the drawing patterns drawn by adjacent drawing machines overlap, and it takes a lot of work time to check this, so it takes a lot of time to create a work program. The problem was that it required time.

Means for Solving the Problem Therefore, in order to solve this problem, the present invention aims to reduce the time required for switching between the plurality of nozzles to an equivalent time when drawing circuit forming material on a plurality of locations on a circuit formation substrate using a plurality of nozzles. The drawing processing procedure is determined so that the total nozzle movement distance is the shortest, and the drawing processing procedure is determined so that the total nozzle movement distance is averaged among the plurality of drawing machines. The processing procedure is determined, and the overlapping of drawing patterns drawn by adjacent drawing machines is checked by the coordinates of two vertices of the pattern to perform drawing.

Effects According to the present invention, a work program that requires the shortest drawing work time is created in consideration of the nozzle switching time, and the program algorithm can be simplified.

In addition, when drawing using multiple drawing devices, it is possible to average the drawing work time using a unified drawing time parameter, and furthermore, the overlap of adjacent drawing patterns can be determined by comparing the coordinates of two points. Therefore, it is possible to perform drawing using a plurality of drawing machines with a shortened overall working time.

Embodiments Embodiments (1) As an embodiment, a process of determining the order of drawing on a substrate when drawing and processing a resistance paste on a substrate will be described.

FIG. 1 shows a substrate on which resistive paste has been drawn. 1st
The order of drawing the resistor paste shown in the figure will be explained using a simplified model pattern as shown in FIG.

(1) First step (1) Determination of module representative coordinates In the board shown in FIG. 2, the center coordinates of each module are taken as representative coordinates. In the figure, 1 is the substrate, 2 is the module divided into four, 3 is the processing resistance paste, and 4 is the coordinate origin. Let each module 2 be M1 to M4, and the center coordinates of each are Mm (Xn, ye), ( m-1~4.n=1.2, e
= 1, 2), Ml (15, 10), M2
(45°10), M3 (15,30), M4 (4
5,30).

(2) Creation of evaluation value matrix Create an evaluation value matrix using the distance between the center coordinates of each module. However, the distance is not the straight line distance between two points, but the distance between each of the X and Y coordinates is determined, and the larger one is taken as the evaluation value, taking into account the control operation of the main table. The evaluation value matrix obtained using this method is shown in FIG.

(3) Determining the machining start module The machining start module is determined by the minimum sum of the X and Y values of the representative coordinates. In the example shown in FIG. 2, Ml is the processing start module.

(4) Determining the next processing module In the evaluation value matrix shown in FIG. 3, select the one with the shortest distance from Ml in the first row. Therefore, in this case, M3 is selected. At this point, M1 and M3 are removed from the next selection elements, and the evaluation value matrix becomes as shown in FIG.

Next, the module located at the shortest distance from M3 is selected using the same procedure. However, now, from the perspective of M3, M2
．． Both M4 and M4 are equidistant in terms of evaluation values. in this case,
The difference in straight-line movement distance between the coordinate system and the one obtained as the evaluation value is compared, and the smaller one is selected. In the example of FIG. 2, M4 is selected. Therefore, the order of module levels determined in this example is M1→M3→M4→M2.

(II) Second Step Next, referring to FIG. 2 as an example, the process of attaching two types of nozzles to one head and determining the order in which to draw and process the A and 82 types of bases will be described.

(1) Determining the representative coordinates of the machining point The center coordinates of the resistors RIA-R8B and R18 to R8B shown in FIG. 2 are determined as the representative coordinates of the machining point.

(2) Creation of evaluation value matrix The four modules on the board shown in Figure 2 are all drawn with the same pattern, and if offset distances are added in each direction of X and Y from the origin 4, they will overlap. do. Here, we focus on the module Mu and create an evaluation value matrix. However, as in the first step, the distance is not the straight line distance between two points from the drawing end point to the next drawing start point, but X.

The distance between each Y coordinate is determined, and the larger value is taken as the evaluation value. Furthermore, when different types of resistive pastes are moved, the operating time required for switching the nozzle is added to the moving distance. In addition, the distance between nozzles is also taken into account as the moving distance. FIG. 5 shows the center coordinates of each resistor drawing of module l, and FIG. 6 shows the distance between nozzles. FIG. 7 shows an evaluation value matrix created under the above conditions. The signs in the absolute expressions in the elements of the matrix in FIG. 7 indicate the influence of the inter-nozzle distance on movement in the X direction. FIG. 8 shows an evaluation value matrix in which the values of both A and B are substituted in this example.

(3) Determination of machining start machining point The module level order obtained in step 1 is Mn
(Xn, Yn), Mn+1 (Xn+l, Y
n1)... (n-1 ~ number of modules), then X n ''
l X n > 0, or Yn+l −Yn >
When O, (x-1-y) is the minimum, Xn+l -Xn< O, or Yn+l - Yn< Q
The machining start point is determined based on the conditions that (x+y) is the maximum and (x+y=representative coordinates of the resistance inside the module). Therefore, with this method,
The starting resistance for each module is Ml=RIA,
M2=R4A, M3=R5A, M4=R7A.

(4) Determining the next machining point Using the evaluation value matrix created in (2),
), the next machining point is determined until there are no machining points in the module (. In this example, the following results are obtained.

In Ml, RIA → R2A → RIB → R4A in R2BM2 + R3A - R30 → R4BM3 in R5A-4-ROM +R5B - R in R68M4? A +R8A +R70→R8B (5) Determining the overall processing order Add the order for each module obtained in the first step and the result obtained in (4) to determine the overall drawing processing order. In this example, the order is shown in FIG. However, in this example, 4
This figure shows a case in which each module is subjected to drawing processing using a drawing machine on a stand.

Embodiment (2) As an embodiment of the second invention, a process in which a plurality of drawing machines having two nozzles in one head are drawn and one plate C and B are completed by being processed by all the drawing machines ( Figure 10) is shown. Further, the drawing processing conditions at this time are shown in FIG. Conditions 1 and 2 shown in the figure are each 1; required number of nozzles≧number of heads 2: required number of nozzles x number of heads.

The line balance of the drawing machine process is achieved by applying the algorithm shown in FIGS. 12a and 12b. FIG. 13 shows the distribution under condition 1, and FIG. 14 shows the distribution under condition 2. 1st
Referring to FIG. 3, the process from the pre-processing state to the post-processing state will be explained.

(2) Assigning the head with the highest resistance number to the first nozzle in order from the head located upstream in the process.2) Next, assigning the head with the lowest number of resistance to the second nozzle of the head located upstream. State O in the figure 3) Find the sum of the number of resistances for each head, and allocate the resistance from the largest head to the smallest head so as to take the average of the largest and smallest. The state shown in the figure becomes ■.

4) Repeat step 3) until there are no more second nozzles to allocate or the difference between the maximum and minimum resistance values for each head becomes 1 or less. The state shown in the figure is ■.

Also in FIG. 14, according to the algorithms shown in FIGS. 12a and 12b, distribution with good line balance is performed in steps 1) to 3) shown in the example of FIG. 13.

Example (3) FIG. 15 shows the area occupied by the already drawn circuit forming material. Further, FIG. 16 shows the area occupied by the circuit forming material to be drawn next. C9B for drawing n circuit forming materials, overlapping of the upper patterns,
That is, when performing an adjacency check, the current m (1<m<n)
In the case of the th drawing process, it is assumed that the 1st to m-1th drawing patterns occupy the area shown in FIG. On the other hand, an adjacency check is performed on the condition that the area shown in FIG. 16 is occupied by the m-th drawing process. At this time, it is assumed that the m-th drawing is in one of the four positional relationships (a) to ω) shown in FIG. 17 with respect to the drawings 1 to m=1, and the following (1) When any of the conditional expressions .about.(4) is satisfied, it is determined that they are adjacent.

(Xs≦Xs'≦Xe)n(Ys≦Y el≦Ye)
...(1) (Xs≦Xe'≦Xe)'n(Ys≦Ye'≦Ye)・
...(2) (X s≦Xe'≦Xe)n (YsSYs'≦Ye)
...(3) (Xs≦Xs'≦Xe)n (Ys≦Ys'≦Ye
)...(4) Effects of the Invention As explained in the above embodiments of the present invention, when drawing a circuit forming material at multiple locations on a circuit forming substrate using a plurality of nozzles, the amount of time required to switch between the plurality of nozzles is By replacing the time with the equivalent moving distance of one nozzle, the drawing processing procedure is determined so that the total moving distance of the nozzle is the shortest, and further, the total moving distance of the nozzle is averaged over the plurality of drawing machines. The drawing processing procedure is determined in such a way that the drawing process is performed, and the overlap of drawing patterns drawn by adjacent drawing machines is checked by the coordinates of the two vertices of the pattern. A work program that minimizes the drawing work time is created taking into consideration the nozzle switching time, and the program algorithm can be simplified.

In addition, when drawing using multiple drawing devices, it is possible to average the drawing work time using a unified drawing time parameter, and furthermore, the overlap of adjacent drawing patterns can be determined by comparing the coordinates of two points. Therefore, I decided to do this, so comparison drawings are possible with a relatively simple program,
This eliminates the need for skilled workers to perform drawings using a plurality of drawing machines, reducing overall working time.

[Brief explanation of the drawing]

1 to 9 show a first embodiment of the present invention, and a first embodiment of the present invention is shown in FIG.
The figure is an explanatory diagram of a pattern processed by a drawing machine to which the present invention is applied, Fig. 2 is a plan view of a processed pattern on a model board for explaining the present invention, and Figs. 3 and 4 are processing orders. A diagram showing the evaluation value matrix created in the decision process,
FIG. 5 is a detailed dimensional diagram of the board module shown in FIG. 2, FIG. 6 is an explanatory diagram showing the distance between nozzles when a drawing machine has two nozzles in one head, and FIGS. FIG. 8 is an explanatory diagram of an evaluation value matrix created by taking into consideration the distance between nozzles and the nozzle switching time converted to distance when determining the processing order, and FIG. 9 is an explanatory diagram of an evaluation value matrix to which the present invention is applied. A plan view showing an example of a drawing pattern, and FIGS. 10 to 14 are diagrams for explaining the second embodiment of the present invention, and FIG.
FIG. 11 is a diagram showing the model drawing process, and FIG. 12a is a diagram showing the conditions for processing the substrate to be processed in the drawing process.
b is a flowchart of the distribution algorithm, FIGS. 13 and 14 are diagrams showing the distribution process of the processing process, and FIG. 15 is a flowchart of the distribution algorithm.
17 are diagrams for explaining the third embodiment of the present invention, and FIG. 15 shows two representative areas for checking the area and adjacency on the substrate occupied by the circuit forming material that has already been drawn. FIGS. 16 and 17 are explanatory diagrams showing the coordinates, and two representative coordinates for the area on the substrate to be secured for the circuit forming material to be drawn and the adjacency check.

Claims (3)

[Claims] (1) When drawing circuit forming material on multiple locations on a circuit forming substrate using multiple nozzles, the time required for switching between the multiple nozzles is equivalently replaced with the nozzle moving distance, and the total nozzle moving distance A drawing machine control method that determines the drawing processing procedure and performs drawing so that the time is the shortest. (2) When drawing circuit-forming materials on multiple locations on a circuit-forming substrate using multiple drawing machines having multiple nozzles, the time required to switch between the multiple nozzles is equivalently replaced by the nozzle movement distance. A drawing machine control method for determining a drawing processing procedure and performing drawing so that a total moving distance of a nozzle is averaged in the plurality of drawing machines. (3) When drawing circuit-forming materials on multiple locations on a circuit-forming substrate using multiple drawing machines having multiple nozzles, the time required to switch between the multiple nozzles is equivalently replaced by the nozzle movement distance. Then, the drawing processing procedure is determined so that the total moving distance of the nozzle is averaged among the plurality of drawing machines, and the overlap of the drawing patterns drawn by adjacent drawing machines is determined by two vertices that are the relative angles of each drawing pattern. A drawing machine control method comprising a step of making a determination using the coordinates of.