JPH02109401A - Absorbing structure of undesired mode for microwave integrated circuit - Google Patents

Abstract

PURPOSE:To improve the degassing performance and the vibration proof performance by vapor-depositing a resistance film to at least one face of a dielectric substrate and welding an element whose resistance film part is vapor-deposited with a conductive film overlappingly to a groove provided to the inside of a cover of a case. CONSTITUTION:An absorbing resistance film 2 is vapor-deposited on at least one face of a dielectric substrate 1 and an element 10 whose part of film 2 is vapor-deposited with a conductor film 3 overlappingly is formed. Then the element 10 is soldered to a groove 6 provided to the inside of a cover 5 of a case 4 to solve a problem of vibration proof against the vibration of launching of a rocket. Since the film 2 is welded to a circuit board 1 with gold, tin or solder and no organic material such as an adhesives is not required, the problem of degassing is solved. Then if a slight microwave is leaked in space in the case 4 from a microwave integrated circuit 7, an undesired mode is stimulated, but the undesired mode wave is absorbed by the film 2. Thus, the degassing performance and vibration proof performance are improved.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a microwave integrated circuit in which a microwave circuit is provided on the surface of a dielectric substrate. Regarding the absorption structure of

3. Detailed Description of the Invention [Summary] Regarding an absorption structure for unnecessary modes of a microwave integrated circuit, the present invention relates to an absorption structure for unnecessary modes in a microwave integrated circuit, and to reduce the amount of gas generated from the constituent members of the absorption structure to a sufficiently small value compared to a specified value, [Technology] When a microwave integrated circuit (e.g. an amplifier circuit) with a microwave circuit provided on the surface of a dielectric substrate is housed and mounted in a housing, an unnecessary mode depending on the structure of the housing occurs, and as a result, unexpected Resonance or feedback that does not occur may occur. In order to prevent these, a special structure is required to absorb unnecessary modes.

The absorption structure of unnecessary modes in conventional microwave integrated circuits is
As shown in the structural diagram of FIG. 4, in order to absorb unnecessary modes, a radio wave absorber 8 such as rubber ferrite is fixed to the inside of the lid 5 of the housing 4 with adhesive or double-sided adhesive tape 9. Ta.

Problem to be solved by the invention C] However, when the above-mentioned microwave integrated circuit is used in a space environment, the circuit material must satisfy the required standards for degassing, which limits the amount of gas generated. In addition, it must have a vibration-resistant structure that can withstand vibrations during the launch of the rocket it is mounted on, but as mentioned above, conventional examples use adhesives and adhesives, so it is not necessarily possible to meet these required standards. The problem was that I was not satisfied.

An object of the present invention is to solve the problems of degassing and vibration resistance of microwave integrated circuits.

[Means to solve the problem]

This problem is solved by attaching an element 10, in which a resistive film 2 is deposited on at least one surface of a dielectric substrate l, and a conductive film 3 is deposited over a portion of the resistive film, to a lid of a housing 4, as shown in FIG. This problem is solved by the structure of the present invention in which gold-tin or solder is welded to the groove 6 provided inside the groove 5.

In the principle diagram of FIG. 1 showing the unnecessary mode absorption structure of the microwave integrated circuit of the present invention, ■ is the dielectric inside the casing 4 equipped with the lid 5! +7i.

Reference numeral 2 denotes a resistive film for absorbing unwanted modes, which is deposited on at least one surface of the dielectric substrate 1.

Reference numeral 3 denotes a conductive film deposited over a portion of the resistive film 2 to form the element 10.

4 is a housing that houses the microwave integrated circuit.

5 is a lid of the housing 4.

6 is a groove provided inside the lid 5 of the housing 4.

10 is a conductor II! in a part of the resistive film 2! This is an element in which 3 layers are deposited one on top of the other.

And an ff6 in which the element 10 is provided inside the lid 5 of the housing 4
The structure is such that it is welded to the surface using gold-tin or solder.

[Effect]

The unnecessary mode absorption structure of the microwave integrated circuit of the present invention is constructed by vacuum-depositing an absorbing resistive film 2 on at least one surface of a dielectric substrate 1, and furthermore, a portion of the absorbing resistive film 2 is
An element 10 is formed by depositing body films 3 overlappingly, and the element 10 is
Since it is welded by soldering or the like to the groove 6 provided inside the lid 5 of the casing 4, there is no problem with vibration resistance against the vibrations during the launch of the mounted rocket. In addition, in order to fix the absorbing resistive film 2 to the circuit board 1, it is welded with gold-tin or solder, and there is no need to use organic materials such as adhesives. problem is resolved.

〔Example〕

FIG. 2 is a structural diagram showing an unnecessary mode absorption structure of a microwave integrated circuit according to a first embodiment of the present invention, and FIG. 3 is a structural diagram of a second embodiment of the present invention.

In FIG. 2, the dielectric base Fi,i is made of, for example, alumina, and a resistive film 2 is formed on at least one surface thereof by vacuum evaporation technology.

The resistive film 2 is made of tantalum nitride TatN, for example, and a conductive film 3 is further deposited over a portion of the resistive film 2 to form the element 10.

The conductor 11!3 is made of nickel chromium NiCr and gold A, for example.
gold-tin is deposited over a part of the resistor 11!2 to form an element 10, and the groove 6 provided inside the lid 5 of the housing 4 in which the element 10 houses the microwave integrated circuit 7 is coated with gold and tin. , or welded and fixed with solder.

A small amount of microwave is transmitted from the microwave integrated circuit 7 to the housing 4.
This leaks into the internal space and induces an unnecessary mode, but this unnecessary mode is absorbed by the resistive film 2 of the element 10.

Therefore, the unnecessary mode absorption structure of the microwave integrated circuit of the embodiment shown in FIG.
A 2N film is vacuum deposited on at least one surface of the alumina plate of the dielectric substrate 1, and a conductor film of nickel chromium NiCr and gold Au as the conductor film 3 is superimposed on a part of the resistive film 2 for absorption. The element 10 is formed by vapor-depositing the element 10.
Since it is soldered or otherwise welded to the groove 6 provided inside the lid 5 of the casing 4, there is no problem with the vibration resistance against the vibration of the loading location/node during launch.

In addition, since the tantalum nitride Ta and N films of the absorbing resistive film 2 are fixed to the circuit board 1 by welding with gold tin or solder and no organic materials such as adhesives are used, there is no gas generation and degassing properties. There is no problem because it absorbs unnecessary modes and prevents parasitic resonance and unexpected feedback.

In the second embodiment shown in FIG.
First, the conductor film 13 side is fixed to the groove 6 provided inside the lid 5 with gold tin, and then the four-layer film 13 and the conductor film 14 are bridged by soldering the chip resistor 12 to form the conductor. 20 is formed. The assembly procedure of this embodiment takes into consideration that the melting temperature of solder is lower than that of gold tin.

〔Effect of the invention〕

As explained above, according to the present invention, the effect of absorbing unnecessary modes is the same as that of the conventional example, but since organic materials such as adhesives and adhesives are not used, there is an effect of improving degassing performance, and As a method of fixing the element, a groove is provided and gold-tin or solder is welded to the groove, so that the effect of improving vibration resistance can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a principle diagram showing the unnecessary mode absorption structure of the microwave integrated circuit of the present invention, FIG. 2 is a structural diagram showing the unnecessary mode absorption structure of the microwave integrated circuit of the first embodiment of the present invention, FIG. 3 is a structural diagram showing an unnecessary mode absorption structure of a microwave integrated circuit according to a second embodiment of the present invention, and FIG. 4 is a structural diagram of an unnecessary mode absorption structure of a conventional microwave integrated circuit. In the figure, 1 is a dielectric substrate, 2 is a resistive film, 3 is a conductive film, 4 is a housing,
5 is a lid, 6 is a groove, 7 is a microwave integrated circuit, and 10 is an element. 6 units ＼ Kiro Moe / + 74') r J integrated circuit hand rod 7-1 Me ro throat dew straight r configuration poor 1, principle diagram 1 Figure 75, full moon / l rise 1n fruit filling Structural diagram Figure 134 Salary warehouse No. 2 sword on the September side 'Jitsukata shrine building'・10 my 20 o 1 Hayabusa accumulation times wet attraction force
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Claims (1)

[Claims] In a mounting structure in which a microwave integrated circuit (7) is housed in a casing (4) equipped with a lid (5), a dielectric substrate (1) is provided.
), a resistive film (2) is deposited on at least one surface of the casing (4), and a conductive film (3) is deposited on a portion of the resistive film (2). (5) An unnecessary mode absorption structure for a microwave integrated circuit, characterized by being welded to a groove (6) provided inside.