JPH02111081U - - Google Patents

Info

Publication number
JPH02111081U
JPH02111081U JP1990007628U JP762890U JPH02111081U JP H02111081 U JPH02111081 U JP H02111081U JP 1990007628 U JP1990007628 U JP 1990007628U JP 762890 U JP762890 U JP 762890U JP H02111081 U JPH02111081 U JP H02111081U
Authority
JP
Japan
Prior art keywords
plates
end portion
end portions
contact element
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990007628U
Other languages
English (en)
Other versions
JP2500830Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPH02111081U publication Critical patent/JPH02111081U/ja
Application granted granted Critical
Publication of JP2500830Y2 publication Critical patent/JP2500830Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)

Description

【図面の簡単な説明】
第１図は第２図の線１―１に沿つて視た、本考
案による装置の断面図、第２図は第１図の線２―
２に沿つて視た、第１図に示す装置の下部分の平
面図、第３図はシートブランクから切り抜いた後
の、第１図と第２図とに示す装置の接点エレメン
トの予備形成材の配列を示す平面図、第４図は２
個の接点エレメントを拡大して示す側面図、およ
び第５図は検査装置に挿入するよう成形した接点
エレメントの側面図である。 図において、２１…下部プレート、２２…上部
プレート、４１…平坦部分、４２，４３…端部分
、４４…中央部分、４７，４８…拡大部分、５０
…接点エレメント、５２…中央部分。

Claims (1)

    【実用新案登録請求の範囲】
  1. 相互から一定の距離離れて配置され、かつ複数
    の整合孔を有する平行のプレートを含む集積回路
    ＩＣｓを検査する装置であつて、さらに弾性シー
    ト材から作られ、第１の真直の端部分が前記プレ
    ートの一方の孔に着座し、第２の真直の端部分が
    前記プレートの他方の整合孔に着座している複数
    の均等に方向づけられた接点エレメントと、前記
    プレートの一方の外側に向かつて所定の位置関係
    で運動するようにされたＩＣ用の圧力部材をさら
    に含み、前記接点エレメントの前記の第１の端部
    分が前記圧力部材に面し、かつ前記プレートの一
    方の外側を越えて僅かに突出し、検査すべきＩＣ
    の接触点のパターンに対応するパターンを形成し
    、一方前記第２の端部分が検査装置に接続するよ
    うにされており、前記プレートの間に来る前記接
    点エレメントの部分が前記端部分に対して偏位し
    ており、かつ前記第１の端部分に軸線方向の圧力
    が加えられると撓むようにされている検査装置に
    おいて、前記接点エレメント５０が平坦な帯片か
    ら形成され、４個所で折り曲げられて概ね均一な
    幅の部分４４を端部分から偏位させ、中央部分５
    ２を前記端部分に平行にさせ、前記端部分４２，
    ４３が前記中央部分４４に隣接して、関連のプレ
    ート２１，２２のスロツトと係合して接点エレメ
    ント５０を回転しないよう固定する拡大部分４７
    ，４８を有していることを特徴とする集積回路を
    検査する装置。
JP1990007628U 1989-02-02 1990-01-31 集積回路検査装置 Expired - Lifetime JP2500830Y2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3903060A DE3903060A1 (de) 1989-02-02 1989-02-02 Vorrichtung zum pruefen von integrierten schaltungsanordnungen
DE3903060.1 1989-02-02

Publications (2)

Publication Number Publication Date
JPH02111081U true JPH02111081U (ja) 1990-09-05
JP2500830Y2 JP2500830Y2 (ja) 1996-06-12

Family

ID=6373279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990007628U Expired - Lifetime JP2500830Y2 (ja) 1989-02-02 1990-01-31 集積回路検査装置

Country Status (3)

Country Link
US (1) US5055777A (ja)
JP (1) JP2500830Y2 (ja)
DE (1) DE3903060A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018203428A1 (ja) * 2017-05-02 2018-11-08 山一電機株式会社 コンタクト端子、コンタクトピンモジュール、および、それを備える半導体装置用ソケット

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247250A (en) * 1992-03-27 1993-09-21 Minnesota Mining And Manufacturing Company Integrated circuit test socket
JPH0677467B2 (ja) * 1992-12-25 1994-09-28 山一電機株式会社 Ｉｃソケット
US5489854A (en) * 1993-04-01 1996-02-06 Analog Devices, Inc. IC chip test socket with double-ended spring biased contacts
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
GB2291544B (en) * 1994-07-12 1996-10-02 Everett Charles Tech Electrical connectors
US6229320B1 (en) 1994-11-18 2001-05-08 Fujitsu Limited IC socket, a test method using the same and an IC socket mounting mechanism
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US5597317A (en) * 1995-08-11 1997-01-28 W. L. Gore & Associates, Inc. Surface mating electrical connector
US5729149A (en) * 1995-09-29 1998-03-17 Motorola, Inc. Apparatus for holding a testing substrate in a semiconductor wafer tester and method for using the same
US5791914A (en) * 1995-11-21 1998-08-11 Loranger International Corporation Electrical socket with floating guide plate
KR100212169B1 (ko) * 1996-02-13 1999-08-02 오쿠보 마사오 프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5939892A (en) * 1996-04-12 1999-08-17 Methode Electronics, Inc. Circuit board testing fixture
US5788524A (en) * 1996-07-22 1998-08-04 Itt Manufacturing Enterprises Inc. Test clip with standard interface
JPH10227830A (ja) * 1996-07-31 1998-08-25 Ando Electric Co Ltd Ｉｃテスタ用テストボード
JP3302576B2 (ja) * 1996-09-30 2002-07-15 アジレント・テクノロジー株式会社 コネクタ付きプローブカード及びｄｕｔ接続装置
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US5831160A (en) * 1997-05-22 1998-11-03 Hewlett-Packard Company Test fixture clamping system
US6160410A (en) * 1998-03-24 2000-12-12 Cypress Semiconductor Corporation Apparatus, method and kit for adjusting integrated circuit lead deflection upon a test socket conductor
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6359452B1 (en) * 1998-07-22 2002-03-19 Nortel Networks Limited Method and apparatus for testing an electronic assembly
US6887723B1 (en) 1998-12-04 2005-05-03 Formfactor, Inc. Method for processing an integrated circuit including placing dice into a carrier and testing
JP2001228192A (ja) * 2000-02-18 2001-08-24 Oht Inc 検査装置及び検査装置の保持具
JP2001326046A (ja) * 2000-05-17 2001-11-22 Enplas Corp コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
US6570398B2 (en) * 2001-09-24 2003-05-27 Texas Instruments Incorporated Socket apparatus particularly adapted for LGA type semiconductor devices
JP4365066B2 (ja) * 2002-04-11 2009-11-18 株式会社エンプラス 電気部品用ソケット
US7262615B2 (en) * 2005-10-31 2007-08-28 Freescale Semiconductor, Inc. Method and apparatus for testing a semiconductor structure having top-side and bottom-side connections
DE102006054735A1 (de) * 2005-12-05 2007-06-06 Feinmetall Gmbh Elektrische Kontakteinrichtung und elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings
US7491096B1 (en) * 2007-07-31 2009-02-17 Phoenix Contact Development & Manufacturing Inc. Modular terminal block
CN101458970A (zh) * 2007-12-14 2009-06-17 鸿富锦精密工业（深圳）有限公司 电路板测试夹具
EP2110673A1 (en) * 2008-04-17 2009-10-21 Technoprobe S.p.A Testing head having vertical probes provided with stopping means to avoid their upward and downward escape from respective guide holes
US20120139574A1 (en) * 2010-12-06 2012-06-07 International Business Machines Corporation Vertical probe tip rotational scrub and method
WO2016146499A1 (en) 2015-03-13 2016-09-22 Technoprobe S.P.A. Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions
JP2018179721A (ja) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス 電気的接続装置
DE102018111216B3 (de) * 2018-05-09 2019-10-17 Semikron Elektronik Gmbh & Co. Kg Schaltungsanordnung zur Strommessung in einer Leistungshalbleitergruppe und Leistungshalbleiterbaugruppe hiermit
TWI831307B (zh) * 2022-07-26 2024-02-01 思達科技股份有限公司 導板結構及探針陣列

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55114962A (en) * 1979-02-28 1980-09-04 Ricoh Co Ltd Surface potentiometer
DE3343274A1 (de) * 1983-11-30 1985-06-05 Feinmetall Gmbh, 7033 Herrenberg Kontaktiervorrichtung
ATE92191T1 (de) * 1987-03-31 1993-08-15 Siemens Ag Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018203428A1 (ja) * 2017-05-02 2018-11-08 山一電機株式会社 コンタクト端子、コンタクトピンモジュール、および、それを備える半導体装置用ソケット
JP2018189488A (ja) * 2017-05-02 2018-11-29 山一電機株式会社 コンタクト端子、コンタクトピンモジュール、および、それを備える半導体装置用ソケット
TWI696839B (zh) * 2017-05-02 2020-06-21 日商山一電機股份有限公司 接觸端子、觸針模組及具備該觸針模組的半導體裝置用插座

Also Published As

Publication number Publication date
DE3903060A1 (de) 1990-08-09
JP2500830Y2 (ja) 1996-06-12
US5055777A (en) 1991-10-08

Similar Documents

Publication Publication Date Title
JPH02111081U (ja)
KR20190034502A (ko) 전자 장치를 위한 프로브 카드
CA1271565A (en) Adaptor in apparatus for electronically testing printed circuit boards
GB2156532A (en) Apparatus for testing a printed circuit board
US12601759B2 (en) Cantilever probe card device and light scattering probe
ITTO970158A1 (it) Attrezzatura per la traslazione di segnali con spine cieche per l'ap- plicazione di forza.
TWI793607B (zh) 探針卡裝置及其拋棄式調整片
JPH0421973U (ja)
KR100794629B1 (ko) 전기 검사 장치와 그 제조 방법
KR0134906Y1 (ko) 반도체 테스트 프로브 카드 장치
ATE306673T1 (de) Kopplungs- und zentrierungssystem, insbesondere für die ausrichtung von gedruckten schaltungen in einem testverfahren
US6608497B1 (en) Apparatus and method for allowing testing of semiconductor devices at different temperatures
JPH0463135U (ja)
JPH037953Y2 (ja)
JPH0219745Y2 (ja)
JPS62176767U (ja)
JPH03104867U (ja)
JPH0564784U (ja) 圧力素子測定用圧力印加ステージ
JPS62259453A (ja) プロープカード
JPH01124574U (ja)
JPH0638440B2 (ja) プロ−ブカ−ド
JPH03109062U (ja)
KR19990033332A (ko) 차량 패널 검사용구
JPH04350579A (ja) プリント配線板の検査治具
JPH0463134U (ja)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term