JPH0211351U - - Google Patents
Info
- Publication number
- JPH0211351U JPH0211351U JP1988089697U JP8969788U JPH0211351U JP H0211351 U JPH0211351 U JP H0211351U JP 1988089697 U JP1988089697 U JP 1988089697U JP 8969788 U JP8969788 U JP 8969788U JP H0211351 U JPH0211351 U JP H0211351U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor device
- resin
- space
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の樹脂封止型半導体装置の樹脂
封止を透視した平面図、第２図は第１図のＡ−Ａ
断面図、第３図は従来の樹脂封止型半導体装置の
樹脂封止を透視した平面図、第４図は第３図Ｂ−
Ｂ断面図である。 １……半導体素子、２……外部接続用電極、３
……ボンデイングワイヤ、４……インナーリード
、５……リードフレーム、６……放熱板、７……
封止樹脂。
封止を透視した平面図、第２図は第１図のＡ−Ａ
断面図、第３図は従来の樹脂封止型半導体装置の
樹脂封止を透視した平面図、第４図は第３図Ｂ−
Ｂ断面図である。 １……半導体素子、２……外部接続用電極、３
……ボンデイングワイヤ、４……インナーリード
、５……リードフレーム、６……放熱板、７……
封止樹脂。
Claims (1)
- 半導体装置用リードフレームの半導体素子を搭
載する中央部分に空所を設け、前記空所に半導体
素子が配置され、この半導体素子の外部接続用電
極とインナーリードとの間をボンデイングワイヤ
で接続して、前記半導体素子を前記リードフレー
ムに保持する樹脂封止型半導体装置に於いて、前
記半導体素子裏面に固着される放熱板を備えるこ
とを特徴とする樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089697U JPH0211351U (ja) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089697U JPH0211351U (ja) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211351U true JPH0211351U (ja) | 1990-01-24 |
Family
ID=31314242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988089697U Pending JPH0211351U (ja) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211351U (ja) |
-
1988
- 1988-07-05 JP JP1988089697U patent/JPH0211351U/ja active Pending