JPS6435755U - - Google Patents

Info

Publication number
JPS6435755U
JPS6435755U JP1987130613U JP13061387U JPS6435755U JP S6435755 U JPS6435755 U JP S6435755U JP 1987130613 U JP1987130613 U JP 1987130613U JP 13061387 U JP13061387 U JP 13061387U JP S6435755 U JPS6435755 U JP S6435755U
Authority
JP
Japan
Prior art keywords
pellet
semiconductor device
mounting portion
semiconductor
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987130613U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987130613U priority Critical patent/JPS6435755U/ja
Publication of JPS6435755U publication Critical patent/JPS6435755U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例の封止樹脂（２点
鎖線の囲み）を透視して示した平面図、同図ｂは
同図ａのＡ―Ａ断面図である。第２図ａは従来の
半導体装置の封止樹脂を透視して示した平面図、
同図ｂは同図ａのＡ―Ａ断面図である。 １，１１……ペレツト支持体、２，１２……放
熱部、３，１３……ペレツト搭載部、４，１４…
…支持体リード部、５……外部リード、６……半
導体ペレツト、７……ボンデイングワイヤ、８…
…貫通孔、９……封止樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツト搭載部とその一端側に支持体リ
    ード部、他端側に放熱部を有するペレツト支持体
    の前記ペレツト搭載部に半導体ペレツトを搭載し
    樹脂封止した半導体装置において、前記ペレツト
    搭載部は前記放熱部より上方に出ばつた凸形に形
    成され、かつ、凹んでいるその底面が上面側と共
    に前記封止樹脂により包まれていることを特徴と
    する半導体装置。
JP1987130613U 1987-08-26 1987-08-26 Pending JPS6435755U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987130613U JPS6435755U (ja) 1987-08-26 1987-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987130613U JPS6435755U (ja) 1987-08-26 1987-08-26

Publications (1)

Publication Number Publication Date
JPS6435755U true JPS6435755U (ja) 1989-03-03

Family

ID=31385941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987130613U Pending JPS6435755U (ja) 1987-08-26 1987-08-26

Country Status (1)

Country Link
JP (1) JPS6435755U (ja)

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