JPH01112053U - - Google Patents
Info
- Publication number
- JPH01112053U JPH01112053U JP676088U JP676088U JPH01112053U JP H01112053 U JPH01112053 U JP H01112053U JP 676088 U JP676088 U JP 676088U JP 676088 U JP676088 U JP 676088U JP H01112053 U JPH01112053 U JP H01112053U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- resin
- sealed
- mounting surface
- electrode body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示し、ａが断面図
、ｂが側面図、ｃが平面図、第２図、第３図はそ
れぞれ本考案の別の実施例の断面図である。 １：ダイオードチツプ、２，５，６：電極体、
３：樹脂、４：実装面。
、ｂが側面図、ｃが平面図、第２図、第３図はそ
れぞれ本考案の別の実施例の断面図である。 １：ダイオードチツプ、２，５，６：電極体、
３：樹脂、４：実装面。
Claims (1)
- 半導体素体の両主面にそれぞれ固着される面と
該面に垂直な実装面とを有する電極体を備え、該
実装面を露出させて前記半導体素体が樹脂により
封止されたことを特徴とする樹脂封止型半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP676088U JPH01112053U (ja) | 1988-01-22 | 1988-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP676088U JPH01112053U (ja) | 1988-01-22 | 1988-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01112053U true JPH01112053U (ja) | 1989-07-27 |
Family
ID=31211199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP676088U Pending JPH01112053U (ja) | 1988-01-22 | 1988-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01112053U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6917103B2 (en) | 2001-12-27 | 2005-07-12 | Denso Corporation | Molded semiconductor power device having heat sinks exposed on one surface |
-
1988
- 1988-01-22 JP JP676088U patent/JPH01112053U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6917103B2 (en) | 2001-12-27 | 2005-07-12 | Denso Corporation | Molded semiconductor power device having heat sinks exposed on one surface |