JPH0211376U - - Google Patents
Info
- Publication number
- JPH0211376U JPH0211376U JP9016288U JP9016288U JPH0211376U JP H0211376 U JPH0211376 U JP H0211376U JP 9016288 U JP9016288 U JP 9016288U JP 9016288 U JP9016288 U JP 9016288U JP H0211376 U JPH0211376 U JP H0211376U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- copper foil
- flexible printed
- foil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案に係るプリント配線基板の略示
的平面図、第２図は同プリント配線基板の略示的
側面図、第３図は第１図ので示した部分の略示
的拡大図、第４図は同部分の略示的断面図、第５
図は使用状態を示す略示的側面図、第６図は従来
例を示す略示的平面図、第７図は同従来例の略示
的側面図、第８図は第６図ので示した部分の拡
大図である。
１１……ベースフイルム、１２……銅箔パター
ン、１３……接着剤、１４……ガラス繊維、１５
……レジスト材、１６……液晶表示素子、１７…
…駆動回路基板。
FIG. 1 is a schematic plan view of a printed wiring board according to the present invention, FIG. 2 is a schematic side view of the same printed wiring board, and FIG. 3 is a schematic enlarged view of the portion shown in FIG. 1. , FIG. 4 is a schematic sectional view of the same part, and FIG. 5 is a schematic sectional view of the same part.
6 is a schematic plan view showing the conventional example, FIG. 7 is a schematic side view of the conventional example, and FIG. 8 is the same as that shown in FIG. 6. It is an enlarged view of a part. 11...Base film, 12...Copper foil pattern, 13...Adhesive, 14...Glass fiber, 15
...Resist material, 16...Liquid crystal display element, 17...
...Drive circuit board.
Claims (1)
ーンを接着したフレキシブルプリント配線基板に
おいて、該基板の少なくとも片方の面に前記銅箔
パターンに対して直角方向にガラス繊維の長軸方
向を揃えて配列固着したことを特徴とするフレキ
シブルプリント配線基板。 In a flexible printed wiring board in which a linear copper foil pattern is adhered to a substrate made of a base film, glass fibers are arranged and fixed on at least one surface of the substrate with their long axes aligned in a direction perpendicular to the copper foil pattern. A flexible printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9016288U JPH0517907Y2 (en) | 1988-07-07 | 1988-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9016288U JPH0517907Y2 (en) | 1988-07-07 | 1988-07-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211376U true JPH0211376U (en) | 1990-01-24 |
| JPH0517907Y2 JPH0517907Y2 (en) | 1993-05-13 |
Family
ID=31314693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9016288U Expired - Lifetime JPH0517907Y2 (en) | 1988-07-07 | 1988-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517907Y2 (en) |
-
1988
- 1988-07-07 JP JP9016288U patent/JPH0517907Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517907Y2 (en) | 1993-05-13 |