JPH02118931U - - Google Patents

Info

Publication number
JPH02118931U
JPH02118931U JP1989027335U JP2733589U JPH02118931U JP H02118931 U JPH02118931 U JP H02118931U JP 1989027335 U JP1989027335 U JP 1989027335U JP 2733589 U JP2733589 U JP 2733589U JP H02118931 U JPH02118931 U JP H02118931U
Authority
JP
Japan
Prior art keywords
electrode structure
semiconductor device
electrode
film
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989027335U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989027335U priority Critical patent/JPH02118931U/ja
Publication of JPH02118931U publication Critical patent/JPH02118931U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す半導体素子の電
極製造工程断面図、第２図は従来のＴＡＢ用半導
体素子の電極構造を示す断面図、第３図はそのＴ
ＡＢ用半導体素子の実装工程図である。 ２１……半導体基板、２２……絶縁膜、２３…
…内部配線路、２４……保護膜、２５……開孔部
、２６……チタン膜、２７……白金膜、２８……
銅メツキ膜、２９……半田メツキ膜、３０……金
膜。

Claims (1)

  1. 【実用新案登録請求の範囲】 ＴＡＢ方式に用いる半導体素子の電極構造にお
    いて、 電極として半田と金を組み合わせた接続媒体か
    らなる薄膜を具備すること特徴とする半導体素子
    の電極構造。
JP1989027335U 1989-03-13 1989-03-13 Pending JPH02118931U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989027335U JPH02118931U (ja) 1989-03-13 1989-03-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989027335U JPH02118931U (ja) 1989-03-13 1989-03-13

Publications (1)

Publication Number Publication Date
JPH02118931U true JPH02118931U (ja) 1990-09-25

Family

ID=31249737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989027335U Pending JPH02118931U (ja) 1989-03-13 1989-03-13

Country Status (1)

Country Link
JP (1) JPH02118931U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4932150A (ja) * 1972-07-27 1974-03-23
JPS54159173A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Construction of bump electrode
JPS54160166A (en) * 1978-06-09 1979-12-18 Hitachi Ltd Electrode forming method for semiconductor device
JPS637640A (ja) * 1986-06-27 1988-01-13 Toshiba Corp 半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4932150A (ja) * 1972-07-27 1974-03-23
JPS54159173A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Construction of bump electrode
JPS54160166A (en) * 1978-06-09 1979-12-18 Hitachi Ltd Electrode forming method for semiconductor device
JPS637640A (ja) * 1986-06-27 1988-01-13 Toshiba Corp 半導体装置の製造方法

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