JPH0343733U - - Google Patents
Info
- Publication number
- JPH0343733U JPH0343733U JP1989104690U JP10469089U JPH0343733U JP H0343733 U JPH0343733 U JP H0343733U JP 1989104690 U JP1989104690 U JP 1989104690U JP 10469089 U JP10469089 U JP 10469089U JP H0343733 U JPH0343733 U JP H0343733U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- metal substrate
- bonding pad
- electrode
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案による半導体素子の実装構造の
一実施例を示す断面図である。第２図は従来の半
導体素子の実装構造の一例を示す断面図である。 １１……半導体素子、１２……金属基板、１３
……金属基材、１５……導電パターン、１５ａ…
…電極端子、１６……金属細線。
一実施例を示す断面図である。第２図は従来の半
導体素子の実装構造の一例を示す断面図である。 １１……半導体素子、１２……金属基板、１３
……金属基材、１５……導電パターン、１５ａ…
…電極端子、１６……金属細線。
補正 平２．５．２９
図面の簡単な説明を次のように補正する。
明細書第７頁末行の「１６……金属細線」の後
に、『１４……絶縁層、１７……導電性接着剤』
を追加する。
に、『１４……絶縁層、１７……導電性接着剤』
を追加する。
Claims (1)
- 金属基板の金属基材を露出させて設けたボンデ
イングパツドと、該ボンデイングパツド上にダイ
ボンデイングされた半導体素子と、上記金属基板
上に形成された所定の回路パターンでなる電極と
を具備しており、該電極と半導体素子とがワイヤ
ボンデイングまたはタブにより電気的に接続され
ていることを特徴とする半導体素子の実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989104690U JPH0343733U (ja) | 1989-09-06 | 1989-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989104690U JPH0343733U (ja) | 1989-09-06 | 1989-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0343733U true JPH0343733U (ja) | 1991-04-24 |
Family
ID=31653477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989104690U Pending JPH0343733U (ja) | 1989-09-06 | 1989-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343733U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01168045A (ja) * | 1987-12-23 | 1989-07-03 | Tokuyama Soda Co Ltd | 気密封止回路装置 |
-
1989
- 1989-09-06 JP JP1989104690U patent/JPH0343733U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01168045A (ja) * | 1987-12-23 | 1989-07-03 | Tokuyama Soda Co Ltd | 気密封止回路装置 |