JPH0365245U - - Google Patents

Info

Publication number
JPH0365245U
JPH0365245U JP1989127257U JP12725789U JPH0365245U JP H0365245 U JPH0365245 U JP H0365245U JP 1989127257 U JP1989127257 U JP 1989127257U JP 12725789 U JP12725789 U JP 12725789U JP H0365245 U JPH0365245 U JP H0365245U
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor
wire
semiconductor device
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989127257U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989127257U priority Critical patent/JPH0365245U/ja
Publication of JPH0365245U publication Critical patent/JPH0365245U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体チツ
プと外部端子を中空細線で接続した半導装置の部
分断面図、第２図は第１図の金の中空ワイヤの断
面図、第３図は従来の金ワイヤで接続した半導体
装置の部分断面図である。図において、１は基板
、２は半導体、３は半導体２の電極、４は中空の
金の細線、５は外部リード端子の外部電極である
。なお、図中、同一符号は同一、または相当部分
を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体の電極と電極間、および電極と外部端子
    を接続するための金の細線に、中空の細線を使用
    した事を特徴とする半導体装置。
JP1989127257U 1989-10-31 1989-10-31 Pending JPH0365245U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989127257U JPH0365245U (ja) 1989-10-31 1989-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989127257U JPH0365245U (ja) 1989-10-31 1989-10-31

Publications (1)

Publication Number Publication Date
JPH0365245U true JPH0365245U (ja) 1991-06-25

Family

ID=31675021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989127257U Pending JPH0365245U (ja) 1989-10-31 1989-10-31

Country Status (1)

Country Link
JP (1) JPH0365245U (ja)

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