JPH02122068U - - Google Patents
Info
- Publication number
- JPH02122068U JPH02122068U JP3238189U JP3238189U JPH02122068U JP H02122068 U JPH02122068 U JP H02122068U JP 3238189 U JP3238189 U JP 3238189U JP 3238189 U JP3238189 U JP 3238189U JP H02122068 U JPH02122068 U JP H02122068U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- setting table
- wafer setting
- processing liquid
- serves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図はこの考案の一実施例の半導体製造装置
の断面図、第２図はその効果を説明する半導体ウ
エーハ位置とバンプ電極高さの関係図である。第
３図は従来の噴流式メツキ装置の断面図、第４図
はその解決すべき課題について説明するための半
導体ウエーハ位置とバンプ電極高さの関係図であ
る。
１１……半導体ウエーハセツト台、１２……半
導体ウエーハ、１４……処理液（メツキ液）噴射
ノズル、１５……処理液（メツキ液）。
FIG. 1 is a cross-sectional view of a semiconductor manufacturing apparatus according to an embodiment of this invention, and FIG. 2 is a diagram showing the relationship between the semiconductor wafer position and bump electrode height to explain the effect thereof. FIG. 3 is a sectional view of a conventional jet plating apparatus, and FIG. 4 is a diagram showing the relationship between the position of a semiconductor wafer and the height of bump electrodes to explain the problem to be solved. 11... Semiconductor wafer setting table, 12... Semiconductor wafer, 14... Processing liquid (plating liquid) injection nozzle, 15... Processing liquid (plating liquid).
Claims (1)
、 前記半導体ウエーハセツト台の上方に配置され
た他方の電極を兼ねる処理液噴射ノズルと、 前記半導体ウエーハセツト台と処理液噴射ノズ
ル間に接続される電源とを備えたことを特徴とす
る半導体製造装置。[Claims for Utility Model Registration] A semiconductor wafer setting table that also serves as one electrode, a processing liquid injection nozzle that is arranged above the semiconductor wafer setting table and that also serves as the other electrode, and the semiconductor wafer setting table and the processing liquid injection A semiconductor manufacturing device comprising: a power source connected between nozzles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3238189U JPH02122068U (en) | 1989-03-22 | 1989-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3238189U JPH02122068U (en) | 1989-03-22 | 1989-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122068U true JPH02122068U (en) | 1990-10-04 |
Family
ID=31258837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3238189U Pending JPH02122068U (en) | 1989-03-22 | 1989-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122068U (en) |
-
1989
- 1989-03-22 JP JP3238189U patent/JPH02122068U/ja active Pending