JPH0459143U - - Google Patents
Info
- Publication number
- JPH0459143U JPH0459143U JP10198590U JP10198590U JPH0459143U JP H0459143 U JPH0459143 U JP H0459143U JP 10198590 U JP10198590 U JP 10198590U JP 10198590 U JP10198590 U JP 10198590U JP H0459143 U JPH0459143 U JP H0459143U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor chip
- substrate
- electrodes
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例による基板の電極部
の平面図、第２図は同実施例による電極部の縦断
断面図、第３図は本考案の他の実施例によるマザ
ー半導体装置の電極部の平面図、第４図は同実施
例による電極部の縦断断面図、第５図は従来例に
よる半導体装置の電極部の縦断断面図である。
１……半導体チツプ、２……第１の電極、６…
…基板、７……第２の電極、１１……半田バンプ
、１２，１４……半田が付着しない箇所。
FIG. 1 is a plan view of an electrode section of a substrate according to an embodiment of the present invention, FIG. 2 is a longitudinal sectional view of an electrode section according to the same embodiment, and FIG. 3 is a diagram of a mother semiconductor device according to another embodiment of the present invention. FIG. 4 is a plan view of the electrode portion, FIG. 4 is a longitudinal sectional view of the electrode portion according to the same embodiment, and FIG. 5 is a longitudinal sectional view of the electrode portion of the semiconductor device according to the conventional example. 1... Semiconductor chip, 2... First electrode, 6...
...Substrate, 7...Second electrode, 11...Solder bump, 12, 14...Places where solder does not adhere.
Claims (1)
及び基板の第２の電極を半田バンプ接続する半導
体チツプの基板への電極接続構造において、 前記第１の電極及び前記第２の電極のそれぞれ
の外辺の形状及び大きさを略同一とするとともに
、 前記両電極のいずれか一方の一部に半田が付着
しない箇所を設けてなることを特徴とする半導体
チツプの基板への電極接続構造。[Claims for Utility Model Registration] An electrode connection structure of a semiconductor chip to a substrate in which a first electrode of a semiconductor chip and a second electrode of a substrate facing each other are connected by solder bumps, comprising: A substrate for a semiconductor chip, characterized in that the shape and size of the outer edges of each of the second electrodes are substantially the same, and a portion of either one of the electrodes is provided with a portion to which solder does not adhere. Electrode connection structure to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10198590U JPH0459143U (en) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10198590U JPH0459143U (en) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459143U true JPH0459143U (en) | 1992-05-21 |
Family
ID=31845872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10198590U Pending JPH0459143U (en) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459143U (en) |
-
1990
- 1990-09-27 JP JP10198590U patent/JPH0459143U/ja active Pending