JPH02122419U - - Google Patents
Info
- Publication number
- JPH02122419U JPH02122419U JP3247589U JP3247589U JPH02122419U JP H02122419 U JPH02122419 U JP H02122419U JP 3247589 U JP3247589 U JP 3247589U JP 3247589 U JP3247589 U JP 3247589U JP H02122419 U JPH02122419 U JP H02122419U
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- metal layer
- exterior frame
- storage space
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、この考案の実施例を示した部分断面
斜視図、第２図はこの実施例によるチツプ形コン
デンサをプリント基板に実装した状態を示す部分
断面図である。
１……コンデンサ、２……外装枠、３……リー
ド線、４……収納空間、５……壁部、６……溝部
、７……金属層、８……半田層、９……プリント
基板、１０……半田。
FIG. 1 is a partially sectional perspective view showing an embodiment of this invention, and FIG. 2 is a partially sectional view showing a chip capacitor according to this embodiment mounted on a printed circuit board. 1... Capacitor, 2... Exterior frame, 3... Lead wire, 4... Storage space, 5... Wall, 6... Groove, 7... Metal layer, 8... Solder layer, 9... Print Board, 10...solder.
Claims (1)
する外装枠にコンデンサを収納するとともに、外
装枠底面の一部に半田付け可能な金属層を設け、
かつ金属層表面に半田層を被覆したことを特徴と
するチツプ形コンデンサ。 The capacitor is housed in an exterior frame that has a storage space that matches the external shape of the capacitor, and a solderable metal layer is provided on a part of the bottom of the exterior frame.
A chip-type capacitor characterized in that the surface of the metal layer is coated with a solder layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3247589U JPH02122419U (en) | 1989-03-22 | 1989-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3247589U JPH02122419U (en) | 1989-03-22 | 1989-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122419U true JPH02122419U (en) | 1990-10-08 |
Family
ID=31258985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3247589U Pending JPH02122419U (en) | 1989-03-22 | 1989-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122419U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5550992U (en) * | 1978-10-02 | 1980-04-03 | ||
| JPS6030530B2 (en) * | 1978-09-28 | 1985-07-17 | ザ グツドイア− タイヤ アンド ラバ− コンパニ− | Mandrel assembly for filler net hose |
-
1989
- 1989-03-22 JP JP3247589U patent/JPH02122419U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530B2 (en) * | 1978-09-28 | 1985-07-17 | ザ グツドイア− タイヤ アンド ラバ− コンパニ− | Mandrel assembly for filler net hose |
| JPS5550992U (en) * | 1978-10-02 | 1980-04-03 |