JPH02127034U - - Google Patents
Info
- Publication number
- JPH02127034U JPH02127034U JP1989036807U JP3680789U JPH02127034U JP H02127034 U JPH02127034 U JP H02127034U JP 1989036807 U JP1989036807 U JP 1989036807U JP 3680789 U JP3680789 U JP 3680789U JP H02127034 U JPH02127034 U JP H02127034U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chip
- conductive
- plated
- conductive lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989036807U JPH02127034U (da) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989036807U JPH02127034U (da) | 1989-03-30 | 1989-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127034U true JPH02127034U (da) | 1990-10-19 |
Family
ID=31543364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989036807U Pending JPH02127034U (da) | 1989-03-30 | 1989-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127034U (da) |
-
1989
- 1989-03-30 JP JP1989036807U patent/JPH02127034U/ja active Pending
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