JPH02128440A - Wire boding - Google Patents

Wire boding

Info

Publication number
JPH02128440A
JPH02128440A JP63283341A JP28334188A JPH02128440A JP H02128440 A JPH02128440 A JP H02128440A JP 63283341 A JP63283341 A JP 63283341A JP 28334188 A JP28334188 A JP 28334188A JP H02128440 A JPH02128440 A JP H02128440A
Authority
JP
Japan
Prior art keywords
wire
bonding
aluminum
pellet
bonding method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63283341A
Other languages
Japanese (ja)
Inventor
Yoshihiro Tominaga
冨永　芳弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP63283341A priority Critical patent/JPH02128440A/en
Publication of JPH02128440A publication Critical patent/JPH02128440A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置のワイヤポンディング方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding method for semiconductor devices.

〔従来の技術〕[Conventional technology]

従来、この種の半導体装置のワイヤボンディング方法は
、第３図に示すように接合面部において加圧を行なった
状態で超音波振動を加えながらポンディングしていた。Conventionally, in a wire bonding method for this type of semiconductor device, bonding was performed while applying ultrasonic vibration while applying pressure at the bonding surface, as shown in FIG.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のワイヤボンディング方法は、加圧と超音
波振動のみからなるためワイヤとペレット側及びワイヤ
とステム側との密着性が劣る。すなわち、第２図に示す
ようにペレット６′とステッチ側９間をアルミワイヤ４
′で結線したのち、アルミワイヤの引張り強度破壊試験
を行なった時にペレット側又は、ステム側の接合面部の
界面からアルミワイヤーが剥れるという問題があって安
定した結線が得られないという欠点がある。Since the conventional wire bonding method described above consists only of pressurization and ultrasonic vibration, the adhesion between the wire and the pellet side and between the wire and the stem side is poor. That is, as shown in FIG. 2, an aluminum wire 4 is connected between the pellet 6' and the stitch side 9.
’, when the aluminum wire is subjected to a tensile strength destructive test, there is a problem that the aluminum wire peels off from the interface of the joint surface on the pellet side or the stem side, making it impossible to obtain a stable connection. .

〔課題を解決するための手段〕[Means to solve the problem]

本発明のワイヤポンディング方法は、半導体装置上の接
合面とボンディングワイヤとを加圧を行なった状態で超
音波を加えながら接合するワイヤポンディング方法にお
いて、前記接合面及び前記ボンディングワイヤにホット
エアーを吹き付けながら接合することを特徴とする。The wire bonding method of the present invention is a wire bonding method in which a bonding surface on a semiconductor device and a bonding wire are bonded while applying ultrasonic waves under pressure. It is characterized by joining while spraying.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例の説明図である。ペレット上
のアルミニウムからなる接合面部と、アルミニウムのボ
ンディングワイヤ４とを接合する際に、接合面部５にア
ルミワイヤ４を接触させ上下から加圧すると共に、水平
方向に振動させる。FIG. 1 is an explanatory diagram of an embodiment of the present invention. When bonding the bonding surface made of aluminum on the pellet and the aluminum bonding wire 4, the aluminum wire 4 is brought into contact with the bonding surface 5 and pressurized from above and below, and vibrated in the horizontal direction.

この時上方から、１００℃乃至２００℃のホットエアー
１を吹きつけながら両者を接合する。アルミニウム表面
にうすい酸化物が生じたとしても超音波振動により除去
される。At this time, the two are bonded while blowing hot air 1 at 100° C. to 200° C. from above. Even if a thin oxide is formed on the aluminum surface, it is removed by ultrasonic vibration.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、ペレット側及びステッチ
側にアルミワイヤーを接合する際にホットエアー（１０
０〜２００℃）を吹き付けながら行なうことで下地面（
ペレットのアルミ、ステッチ側のアルミ又はＡｕメツキ
）との金属結合反応が起こって接合強度が強化されてア
ルミワイヤーがペレット上及び、ステッチ側から剥れる
という問題がなくなり安定した結線を得る効果がある。As explained above, the present invention uses hot air (10
By spraying heat (0 to 200℃), the underlying surface (
A metal bonding reaction occurs between the aluminum on the pellet and the aluminum (aluminum or Au plating on the stitch side), which strengthens the bond and eliminates the problem of the aluminum wire peeling off from the pellet and the stitch side, resulting in a stable connection. .

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の説明図、第２図は引張り強
度測定方法の説明図、第３図は、従来のポンディング方
法の説明図である。 １・・・・・・ホットエアー　２，２′・・団・ポンデ
ィングツール、３．３’・・・・・・ホーン、４．４’
・・・・・・アルミワイヤー　５，５′・・・・・・接
合部、６，６′・・・・・・ペレット側、７コ・・・・
・セラミック、８・・・・・・引張す強度試験機、９・
・・・・・ステッチ側のポンディング面。 代理人　弁理士　　内　原　　　晋FIG. 1 is an explanatory diagram of an embodiment of the present invention, FIG. 2 is an explanatory diagram of a tensile strength measuring method, and FIG. 3 is an explanatory diagram of a conventional bonding method. 1...Hot air 2,2'...Group/pounding tool, 3.3'...Horn, 4.4'
...Aluminum wire 5,5'...Joint part, 6,6'...Pellet side, 7 pieces...
・Ceramic, 8...Tensile strength tester, 9.
...Ponding surface on the stitch side. Agent Patent Attorney Susumu Uchihara

Claims (1)

【特許請求の範囲】[Claims] 半導体装置上の接合面とボンディングワイヤとを加圧を
行なった状態で超音波を加えながら接合するワイヤボン
ディング方法において、前記接合面及び前記ボンディン
グワイヤにホットエアーを吹き付けながら接合すること
を特徴とするワイヤボンディング方法。A wire bonding method in which a bonding surface on a semiconductor device and a bonding wire are bonded while applying ultrasonic waves under pressure, characterized in that bonding is performed while blowing hot air to the bonding surface and the bonding wire. Wire bonding method.
JP63283341A 1988-11-08 1988-11-08 Wire boding Pending JPH02128440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63283341A JPH02128440A (en) 1988-11-08 1988-11-08 Wire boding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63283341A JPH02128440A (en) 1988-11-08 1988-11-08 Wire boding

Publications (1)

Publication Number Publication Date
JPH02128440A true JPH02128440A (en) 1990-05-16

Family

ID=17664231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63283341A Pending JPH02128440A (en) 1988-11-08 1988-11-08 Wire boding

Country Status (1)

Country Link
JP (1) JPH02128440A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099383A1 (en) * 2011-12-27 2013-07-04 株式会社カイジョー Wire bonding device and wire bonding method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099383A1 (en) * 2011-12-27 2013-07-04 株式会社カイジョー Wire bonding device and wire bonding method
JP2013135111A (en) * 2011-12-27 2013-07-08 Kaijo Corp Wire bonding device and wire bonding method
CN103814433A (en) * 2011-12-27 2014-05-21 株式会社华祥 Wire bonding device and wire bonding method
KR101511893B1 (en) * 2011-12-27 2015-04-13 가부시끼가이샤가이죠 Wire bonding device and wire bonding method
CN103814433B (en) * 2011-12-27 2017-03-01 株式会社华祥 Lead wire connecting apparatus and lead connecting method

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