JPH0212955A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH0212955A JPH0212955A JP16432688A JP16432688A JPH0212955A JP H0212955 A JPH0212955 A JP H0212955A JP 16432688 A JP16432688 A JP 16432688A JP 16432688 A JP16432688 A JP 16432688A JP H0212955 A JPH0212955 A JP H0212955A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- island
- flow
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000004886 process control Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はリードフレームに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to lead frames.
従来のこの種のリードフレームは第２図に示すようにア
イランド１ａに特殊な構造を設けてなく、フラットかデ
インプル形状となっていた。In the conventional lead frame of this kind, as shown in FIG. 2, the island 1a has no special structure and has a flat or dimpled shape.
上述した従来のリードフレームは、アイランド１ａは平
坦な構造であるため、樹脂注入時にモールド樹脂の注入
口Ｇ（以下ゲート部という）近くの金属細線が樹脂の流
速により流され、金属細線相互のタッチによるショート
や載置素子へのタッチによるショートあるいは金属細線
の断線等の事故につながり、品質やコスト共大巾に悪化
させる。In the conventional lead frame described above, since the island 1a has a flat structure, the thin metal wires near the injection port G (hereinafter referred to as the gate section) of the mold resin are flowed away by the flow velocity of the resin during resin injection, and the thin metal wires do not touch each other. This can lead to accidents such as short-circuits caused by touching the mounting element, short-circuits caused by touching the mounted element, or breakage of thin metal wires, which greatly deteriorates both quality and cost.
さらにモールド成形条件の巾を小さくさせ、工程管理を
難しくするという欠点があった。Furthermore, there is a drawback that the range of molding conditions is narrowed, making process control difficult.
本発明のリードフレームは、半導体チップを載置するア
イランドを有するリードフレームにおいて、前記アイラ
ンドの樹脂注入口に対応する辺近傍に突起部を設けて構
成されている。The lead frame of the present invention is configured such that the lead frame has an island on which a semiconductor chip is placed, and a protrusion is provided near the side of the island corresponding to the resin injection port.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）及び（ｂ）は本発明の一実施例の平面図及
びＡ−Ａ’線断面図である。FIGS. 1(a) and 1(b) are a plan view and a sectional view taken along the line AA' of an embodiment of the present invention.
リードフレームのアイランド１は吊りピン２で支持され
ており内部リード３を含めて樹脂封止する際にゲート部
Ｇに対応した辺上に、モールド樹脂の急激な流入を制御
するため突起部４を設けている。The island 1 of the lead frame is supported by a hanging pin 2, and when resin-sealing the island 1 including the internal leads 3, a protrusion 4 is placed on the side corresponding to the gate part G in order to control the rapid inflow of molding resin. It is set up.
この構造はアイランド外片のパンチング・折曲げ等を行
って容易に製作可能である。This structure can be easily manufactured by punching, bending, etc. the outer piece of the island.
以上説明したように本発明は、リードフレームのアイラ
ンドのゲート部近くにモールド樹脂の流れを制御するた
めの突起部を設ける事により、封入時のモールド樹脂の
流れを制御出来る。As described above, the present invention can control the flow of mold resin during encapsulation by providing a protrusion for controlling the flow of mold resin near the gate of the island of the lead frame.
その結果、モールド樹脂の流速による金属細線の断線、
タッチ及びエッヂタッチ等の事故が防止出来るとともに
モールド成形条件′の幅も広く取れ、工程管理を容易に
するという効果がある。As a result, disconnection of the thin metal wire due to the flow velocity of the molding resin,
Accidents such as touching and edge touching can be prevented, and the range of molding conditions can be widened, making process control easier.
第１図（ａ）及び（ｂ）は本発明の平面図及びＡ−Ａ’
線断面図、第２図は従来のリードフレームの平面図であ
る。
１・・・リードフレーム、２・・・吊りピン、３・・・
内部リード、
４・・・突起部、
Ｇ・・・樹脂注入口。FIGS. 1(a) and 1(b) are plan views of the present invention and A-A'
The line sectional view and FIG. 2 are plan views of a conventional lead frame. 1...Lead frame, 2...Hanging pin, 3...
Internal lead, 4...Protrusion, G...Resin injection port.
Claims (1)
ームにおいて、前記アイランドの樹脂注入口に対応する
辺近傍に突起部を設けた事を特徴とするリードフレーム
。A lead frame having an island on which a semiconductor chip is placed, characterized in that a protrusion is provided near a side of the island corresponding to a resin injection port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16432688A JPH0212955A (en) | 1988-06-30 | 1988-06-30 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16432688A JPH0212955A (en) | 1988-06-30 | 1988-06-30 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212955A true JPH0212955A (en) | 1990-01-17 |
Family
ID=15791038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16432688A Pending JPH0212955A (en) | 1988-06-30 | 1988-06-30 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212955A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04750A (en) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | Lead frame for semiconductor device |
-
1988
- 1988-06-30 JP JP16432688A patent/JPH0212955A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04750A (en) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | Lead frame for semiconductor device |
| EP0676807A1 (en) * | 1990-04-18 | 1995-10-11 | Kabushiki Kaisha Toshiba | Lead frame for semiconductor device |
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