JPH02138061U - - Google Patents
Info
- Publication number
- JPH02138061U JPH02138061U JP4843189U JP4843189U JPH02138061U JP H02138061 U JPH02138061 U JP H02138061U JP 4843189 U JP4843189 U JP 4843189U JP 4843189 U JP4843189 U JP 4843189U JP H02138061 U JPH02138061 U JP H02138061U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- reflow soldering
- base material
- heating
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4843189U JPH02138061U (2) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4843189U JPH02138061U (2) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138061U true JPH02138061U (2) | 1990-11-19 |
Family
ID=31565231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4843189U Pending JPH02138061U (2) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138061U (2) |
-
1989
- 1989-04-25 JP JP4843189U patent/JPH02138061U/ja active Pending
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