JPH0426547U - - Google Patents
Info
- Publication number
- JPH0426547U JPH0426547U JP1990068116U JP6811690U JPH0426547U JP H0426547 U JPH0426547 U JP H0426547U JP 1990068116 U JP1990068116 U JP 1990068116U JP 6811690 U JP6811690 U JP 6811690U JP H0426547 U JPH0426547 U JP H0426547U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- semiconductor device
- fixing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの実施例の一実施例の放熱板に凹部
構造を採用した樹脂封止型半導体装置の断面図で
ある。第２図は従来の樹脂封止型半導体装置の断
面図である。
１……放熱板、１ａ……リード、１ｂ……凹部
、２……ハンダ、３……半導体素子、３ａ……表
面電極部、４……金属導線、５……樹脂。
FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device in which a concave structure is adopted for the heat sink of this embodiment. FIG. 2 is a sectional view of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1... Heat sink, 1a... Lead, 1b... Recessed part, 2... Solder, 3... Semiconductor element, 3a... Surface electrode part, 4... Metal conductor wire, 5... Resin.
Claims (1)
の凹部を有することを特徴とする樹脂封止型半導
体装置。 A resin-sealed semiconductor device characterized in that a heat sink for fixing a semiconductor element has a concave portion having the same shape as the element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990068116U JPH0426547U (en) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990068116U JPH0426547U (en) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426547U true JPH0426547U (en) | 1992-03-03 |
Family
ID=31602279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990068116U Pending JPH0426547U (en) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426547U (en) |
-
1990
- 1990-06-27 JP JP1990068116U patent/JPH0426547U/ja active Pending