JPH032654U - - Google Patents
Info
- Publication number
- JPH032654U JPH032654U JP1989063392U JP6339289U JPH032654U JP H032654 U JPH032654 U JP H032654U JP 1989063392 U JP1989063392 U JP 1989063392U JP 6339289 U JP6339289 U JP 6339289U JP H032654 U JPH032654 U JP H032654U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- end surface
- heat sink
- excluding
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に係るリードフレー
ムの斜視図、第２図は同実施例のリードフレーム
を用いて樹脂モールドされた半導体装置の第１図
Ａ−Ｂ−Ｃ−Ｄ線に沿つた断面図、第３図は本考
案の他の実施例に係るリードフレームの斜視図、
第４図は従来のリードフレームの斜視図、第５図
は従来のリードフレームを用いて樹脂モールドさ
れた半導体装置の第４図Ｅ−Ｆ−Ｇ−Ｈ線に沿つ
た断面図である。
１……半導体ペレツト、１１，２１……放熱板
、３，４……リード、１２，２２……吊ピン、１
０，２０……リードフレーム。
Fig. 1 is a perspective view of a lead frame according to an embodiment of the present invention, and Fig. 2 shows a semiconductor device resin-molded using the lead frame of the same embodiment, taken along line A-B-C-D in Fig. 1. 3 is a perspective view of a lead frame according to another embodiment of the present invention,
FIG. 4 is a perspective view of a conventional lead frame, and FIG. 5 is a sectional view taken along the line E-F-G-H in FIG. 4 of a semiconductor device resin-molded using the conventional lead frame. 1... Semiconductor pellet, 11, 21... Heat sink, 3, 4... Lead, 12, 22... Hanging pin, 1
0,20...Lead frame.
Claims (1)
ードが延設される一端面を除いた他端面に吊ピン
を連結してなるリードフレームにおいて、 上記吊ピンを放熱板より軟らかい金属で構成し
たことを特徴とするリードフレーム。[Claims for Utility Model Registration] In a lead frame in which a hanging pin is connected to the other end surface of a heat sink on which a semiconductor pellet is mounted, excluding one end surface on which the leads are extended, A lead frame characterized by being made of soft metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063392U JPH032654U (en) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063392U JPH032654U (en) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032654U true JPH032654U (en) | 1991-01-11 |
Family
ID=31593397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989063392U Pending JPH032654U (en) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032654U (en) |
-
1989
- 1989-05-30 JP JP1989063392U patent/JPH032654U/ja active Pending