JPH02138434U - - Google Patents
Info
- Publication number
- JPH02138434U JPH02138434U JP4807489U JP4807489U JPH02138434U JP H02138434 U JPH02138434 U JP H02138434U JP 4807489 U JP4807489 U JP 4807489U JP 4807489 U JP4807489 U JP 4807489U JP H02138434 U JPH02138434 U JP H02138434U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- reflectance pattern
- alignment mark
- directions
- center point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案に係る位置合せマーク第１実施
例を示す拡大平面図、第２図は同第２実施例を示
す拡大平面図、第３図は同第３実施例を示す拡大
平面図、第４図は同第４実施例を示す拡大平面図
、第５図は同第５実施例を示す拡大平面図、第６
図は同第６実施例を示す拡大平面図、第７図はビ
デオモニターのターゲツトエリアを示す説明図、
第８図はウエハの平面図、第９図は従来例の拡大
図である。
４……チツプ、５……ＳｉＯ２膜、６……位置
合せマーク、６ａ，６ｆ，６ｈ，６ｊ，６ｌ……
高反射率パターン、６ｂ，６ｄ，６ｅ，６ｇ，６
ｉ，６ｋ……低反射率パターン、６ｃ……高反射
率枠パターン。
FIG. 1 is an enlarged plan view showing the first embodiment of the alignment mark according to the present invention, FIG. 2 is an enlarged plan view showing the second embodiment, and FIG. 3 is an enlarged plan view showing the third embodiment. , FIG. 4 is an enlarged plan view showing the fourth embodiment, FIG. 5 is an enlarged plan view showing the fifth embodiment, and FIG.
The figure is an enlarged plan view showing the sixth embodiment, and FIG. 7 is an explanatory diagram showing the target area of the video monitor.
FIG. 8 is a plan view of the wafer, and FIG. 9 is an enlarged view of the conventional example. 4... Chip, 5... SiO 2 film, 6... Alignment mark, 6a, 6f, 6h, 6j, 6l...
High reflectance pattern, 6b, 6d, 6e, 6g, 6
i, 6k...Low reflectance pattern, 6c...High reflectance frame pattern.
Claims (1)
による低反射率パターンの組合わせにより形成そ
れた半導体装置の位置合せマークにおいて、 前記高反射率パターンは中心点からＸ，Ｙ方向
に延びる直線パターン部を有し、前記低反射率パ
ターンは前記中心点からＸ，Ｙ方向に延びる直線
パターン部を有することを特徴とする位置合せマ
ーク。 (2) 金属配線による高反射率パターンと絶縁膜
による低反射率パターンの組合わせにより形成そ
れた半導体装置の位置合せマークにおいて、 中心点からＸ，Ｙ方向に延びる直線パターンを
有する高反射率パターンと、 前記中心点からＸ，Ｙ方向に延びる直線パター
ンを有する低反射率パターンと、 前記高反射率パターンと低反射率パターンとを
囲繞する枠パターンを備えたことを特徴とする位
置合せマーク。[Claims for Utility Model Registration] (1) In an alignment mark for a semiconductor device formed by a combination of a high reflectance pattern made of metal wiring and a low reflectance pattern made of an insulating film, the high reflectance pattern is formed from a center point. An alignment mark having a linear pattern portion extending in the X and Y directions, wherein the low reflectance pattern has a linear pattern portion extending in the X and Y directions from the center point. (2) A high reflectance pattern that has a straight line pattern extending in the X and Y directions from the center point in an alignment mark for a misaligned semiconductor device formed by a combination of a high reflectance pattern made of metal wiring and a low reflectance pattern made of an insulating film. An alignment mark comprising: a low reflectance pattern having a straight line pattern extending from the center point in the X and Y directions; and a frame pattern surrounding the high reflectance pattern and the low reflectance pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4807489U JPH02138434U (en) | 1989-04-24 | 1989-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4807489U JPH02138434U (en) | 1989-04-24 | 1989-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138434U true JPH02138434U (en) | 1990-11-19 |
Family
ID=31564566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4807489U Pending JPH02138434U (en) | 1989-04-24 | 1989-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138434U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6081040A (en) * | 1997-03-17 | 2000-06-27 | Denso Corporation | Semiconductor device having alignment mark |
| JP2016103618A (en) * | 2014-11-29 | 2016-06-02 | 日亜化学工業株式会社 | Light-emitting device |
-
1989
- 1989-04-24 JP JP4807489U patent/JPH02138434U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6081040A (en) * | 1997-03-17 | 2000-06-27 | Denso Corporation | Semiconductor device having alignment mark |
| JP2016103618A (en) * | 2014-11-29 | 2016-06-02 | 日亜化学工業株式会社 | Light-emitting device |