JPH02140841U - - Google Patents

Info

Publication number
JPH02140841U
JPH02140841U JP5017089U JP5017089U JPH02140841U JP H02140841 U JPH02140841 U JP H02140841U JP 5017089 U JP5017089 U JP 5017089U JP 5017089 U JP5017089 U JP 5017089U JP H02140841 U JPH02140841 U JP H02140841U
Authority
JP
Japan
Prior art keywords
plate
semiconductor device
hook
device processing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5017089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5017089U priority Critical patent/JPH02140841U/ja
Publication of JPH02140841U publication Critical patent/JPH02140841U/ja
Pending legal-status Critical Current

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Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る一実施例の要部を示す正
面図、第2図は第1図のA−A矢視図、第3図は
第1図のB−B矢視図、第4図は従来例を示す断
面図である。 1……真空容器、3……チヤンバ、5……ベー
スプレート、27……電極板、40……フツクプ
レート、42……板バネを示す。
FIG. 1 is a front view showing essential parts of an embodiment of the present invention, FIG. 2 is a view taken along the line A-A in FIG. 1, and FIG. FIG. 4 is a sectional view showing a conventional example. 1... Vacuum vessel, 3... Chamber, 5... Base plate, 27... Electrode plate, 40... Hook plate, 42... Leaf spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空容器に独立気密の小室を形成する半導体デ
バイス処理装置のチヤンバ構造に於いて、ベース
プレートに対向する基板、該基板に取付けられる
ガス板を兼ねる電極板のうちいずれか一方にフツ
クプレートを設け、いずれか他方の該フツクプレ
ートに対峙する位置にU字状に形成した板バネを
設け、前記フツクプレートと板バネとを係合可能
としたことを特徴とする半導体デバイス処理装置
のチヤンバ構造。
In the chamber structure of semiconductor device processing equipment in which an independent airtight chamber is formed in a vacuum container, a hook plate is provided on either a substrate facing the base plate or an electrode plate attached to the substrate that also serves as a gas plate. A chamber structure for a semiconductor device processing apparatus, characterized in that a U-shaped plate spring is provided at a position facing the other hook plate, and the hook plate and the plate spring can be engaged with each other.
JP5017089U 1989-04-27 1989-04-27 Pending JPH02140841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5017089U JPH02140841U (en) 1989-04-27 1989-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5017089U JPH02140841U (en) 1989-04-27 1989-04-27

Publications (1)

Publication Number Publication Date
JPH02140841U true JPH02140841U (en) 1990-11-26

Family

ID=31568491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5017089U Pending JPH02140841U (en) 1989-04-27 1989-04-27

Country Status (1)

Country Link
JP (1) JPH02140841U (en)

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