JPH02140849U - - Google Patents

Info

Publication number
JPH02140849U
JPH02140849U JP1989049090U JP4909089U JPH02140849U JP H02140849 U JPH02140849 U JP H02140849U JP 1989049090 U JP1989049090 U JP 1989049090U JP 4909089 U JP4909089 U JP 4909089U JP H02140849 U JPH02140849 U JP H02140849U
Authority
JP
Japan
Prior art keywords
workpiece
rail
work
clamps
fixes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989049090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989049090U priority Critical patent/JPH02140849U/ja
Publication of JPH02140849U publication Critical patent/JPH02140849U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示すワイヤボンデ
イング装置の要部側面図、第２図は従来のボンデ
イング装置におけるワーク固定部を示す斜視図、
第３図は第２図の側面図である。 １……ワーク、４……レール部、５……クラン
パ、６……クランパバネ、１０……支点ボール、
１１……基台との結合ネジ、１２……バネ、１３
……傾斜自由度幅調整ネジ。 FIG. 1 is a side view of the main parts of a wire bonding device showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a work fixing part in a conventional bonding device.
FIG. 3 is a side view of FIG. 2. 1... Workpiece, 4... Rail section, 5... Clamper, 6... Clamper spring, 10... Fulcrum ball,
11... Screw for connecting to the base, 12... Spring, 13
...Inclination degree of freedom width adjustment screw.

Claims (1)

【実用新案登録請求の範囲】 ワークを搬送し位置決めするレール部と、ワー
クのボンデイング加工部近傍周辺を押さえ付け、
前記レールとの間にワークを挟み付け固定するワ
ーククランパを有するワイヤボンデイング装置に
おいて、 前記レール部底面中心部の少なくとも一部が球
面の支点で支持されていることを特徴としたワイ
ヤボンデイング装置。[Scope of claim for utility model registration] The rail part for transporting and positioning the workpiece and the area around the bonding processing part of the workpiece are pressed down,
A wire bonding apparatus having a work clamper that clamps and fixes a work between the rails, wherein at least a part of the center of the bottom surface of the rail is supported by a spherical fulcrum.
JP1989049090U 1989-04-25 1989-04-25 Pending JPH02140849U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989049090U JPH02140849U (en) 1989-04-25 1989-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989049090U JPH02140849U (en) 1989-04-25 1989-04-25

Publications (1)

Publication Number Publication Date
JPH02140849U true JPH02140849U (en) 1990-11-26

Family

ID=31566485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989049090U Pending JPH02140849U (en) 1989-04-25 1989-04-25

Country Status (1)

Country Link
JP (1) JPH02140849U (en)

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