JPH0361337U - - Google Patents
Info
- Publication number
- JPH0361337U JPH0361337U JP1989121454U JP12145489U JPH0361337U JP H0361337 U JPH0361337 U JP H0361337U JP 1989121454 U JP1989121454 U JP 1989121454U JP 12145489 U JP12145489 U JP 12145489U JP H0361337 U JPH0361337 U JP H0361337U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- air bearing
- pads
- contact
- clamping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
図は本考案の実施例を示すものであつて、第１
図はクランプ装置の平面図、第２図は同正面図、
第３図及び第４図は側面図、第５図はクランプ中
のパツドの平面図、第６図ａ，ｂはワイヤリング
された半導体チツプの側面図、第７図は従来のク
ランプ装置の側面図である。
５，８……パツド、１０……エア軸受、１２…
…軸棒、１５……ボイスコイル装置。
The figure shows an embodiment of the present invention.
The figure is a plan view of the clamp device, the second figure is a front view of the same,
Figures 3 and 4 are side views, Figure 5 is a plan view of the pad being clamped, Figures 6a and b are side views of the wired semiconductor chip, and Figure 7 is a side view of a conventional clamping device. It is. 5, 8...Pad, 10...Air bearing, 12...
...Axis rod, 15...Voice coil device.
Claims (1)
れらのパツドの間にボンデイング用ワイヤをクラ
ンプするようにしたクランプ装置において、上記
一方のパツドの背面にエア軸受を設け、このエア
軸受に設けられた摺動自在な軸棒の先端部にこの
パツドを装着するとともに、この軸棒を摺動させ
てこのパツドを上記他方のパツドに接離させるボ
イスコイル装置を設けたことを特徴とするワイヤ
ボンダーにおけるワイヤのクランプ装置。 In a clamping device in which one pad is brought into contact with and separated from the other pad, and a bonding wire is clamped between these pads, an air bearing is provided on the back surface of one of the pads, and an air bearing is provided on the air bearing. A wire bonder characterized in that this pad is attached to the tip of a freely slidable shaft rod, and a voice coil device is provided for sliding this shaft rod to bring this pad into contact with and separating from the other pad. wire clamping device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989121454U JPH0361337U (en) | 1989-10-17 | 1989-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989121454U JPH0361337U (en) | 1989-10-17 | 1989-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361337U true JPH0361337U (en) | 1991-06-17 |
Family
ID=31669486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989121454U Pending JPH0361337U (en) | 1989-10-17 | 1989-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361337U (en) |
-
1989
- 1989-10-17 JP JP1989121454U patent/JPH0361337U/ja active Pending