JPH02140864U - - Google Patents
Info
- Publication number
- JPH02140864U JPH02140864U JP4911989U JP4911989U JPH02140864U JP H02140864 U JPH02140864 U JP H02140864U JP 4911989 U JP4911989 U JP 4911989U JP 4911989 U JP4911989 U JP 4911989U JP H02140864 U JPH02140864 U JP H02140864U
- Authority
- JP
- Japan
- Prior art keywords
- submount material
- view
- photodiode
- plan
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図ａは、本考案の一実施例の平面図、第１
図ｂは、第１図ａのＡ−Ａ′線断面図、第２図ａ
は、本考案の実施例２の平面図、第２図ｂは第２
図ａのＡ−Ａ′線断面図、第３図ａは従来のサブ
マウント材の平面図、第３図ｂは第３図ａのＡ−
Ａ′線断面図、第４図ａは従来のサブマウント材
（目印有）の平面図、第４図ｂは第４図ａのＡ−
Ａ′線断面図である。
１……金、２……チタン及白金、３……アルミ
ナ、４……溝、５……モニタ用ホトダイオードを
マウントさせる部分の中央（同心円の中心）、６
……モニタ用ホトダイオードをマウントさせるた
めの位置を示す目印。
Figure 1a is a plan view of one embodiment of the present invention;
Figure b is a sectional view taken along line A-A' in Figure 1a, and Figure 2a is
is a plan view of the second embodiment of the present invention, and FIG. 2b is a plan view of the second embodiment of the present invention.
A sectional view taken along line A-A' in Figure a, Figure 3 a is a plan view of a conventional submount material, and Figure 3 b is a cross-sectional view taken along line A-A in Figure 3 a.
4a is a plan view of a conventional submount material (with markings), and 4b is a cross-sectional view taken along line A'
It is a sectional view taken along the line A'. 1... Gold, 2... Titanium and platinum, 3... Alumina, 4... Groove, 5... Center of the part where the monitor photodiode is mounted (center of concentric circles), 6
...A mark indicating the position to mount the monitor photodiode.
Claims (1)
において、表面に凹凸を規則的に有することを特
徴とする半導体レーザのモニタ用ホトダイオード
のサブマウント材。 A submount material for a photodiode for monitoring a semiconductor laser, the submount material having a metal coating on the surface of an insulating substrate, the submount material having regular irregularities on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4911989U JPH02140864U (en) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4911989U JPH02140864U (en) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140864U true JPH02140864U (en) | 1990-11-26 |
Family
ID=31566543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4911989U Pending JPH02140864U (en) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140864U (en) |
-
1989
- 1989-04-25 JP JP4911989U patent/JPH02140864U/ja active Pending