JPH02146833U - - Google Patents
Info
- Publication number
- JPH02146833U JPH02146833U JP5289989U JP5289989U JPH02146833U JP H02146833 U JPH02146833 U JP H02146833U JP 5289989 U JP5289989 U JP 5289989U JP 5289989 U JP5289989 U JP 5289989U JP H02146833 U JPH02146833 U JP H02146833U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead part
- view
- resin
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図〜第８図は本考案によるＩＣパツケージ
用のモールド金型の実施例を示すものであつて、
第１図は第１実施例における分解斜視図、第２図
はモールド成形時の要部の断面図、第３図は第２
図−線での拡大断面図、第４図は第２実施例
における分解斜視図、第５図はモールド成形時の
要部の断面図、第６図は第５図−線での拡大
断面図、第７図は第２実施例の変形例における下
型の斜視図、第８図はモールド成形時の要部の拡
大断面図である。第９図〜第１１図はＴＡＢ方式
ＩＣパツケージの一従来例を示すものであつて、
第９図はＩＣパツケージの一部切欠き平面図、第
１０図はモールド成形時の要部の断面図、第１１
図は第１０図−線での拡大断面図である
。
なお図面に用いた符号において、１……テープ
キヤリヤ、３……リードパターン、８……インナ
ーリード部、９……アウターリード部、９ａ……
基部、１０……ＩＣチツプ、２０，４０……モー
ルド金型、２１，４１……上型、２２，４２……
下型、２３，２４，４３，４４……挟持面、２５
，２６，４５，４６……キヤビテイ、３０……弾
性シート、３７，５７……樹脂モールド、３８，
５８……〓間、５０……弾性パツキン、５２……
段部、６２……溝部、１３９……滲み出し、であ
る。
1 to 8 show examples of the molding die for IC packages according to the present invention,
Figure 1 is an exploded perspective view of the first embodiment, Figure 2 is a sectional view of the main parts during mold forming, and Figure 3 is the second embodiment.
Fig. 4 is an exploded perspective view of the second embodiment; Fig. 5 is a sectional view of main parts during mold forming; Fig. 6 is an enlarged sectional view taken along Fig. 5 - line. , FIG. 7 is a perspective view of the lower die in a modification of the second embodiment, and FIG. 8 is an enlarged sectional view of the main part during mold forming. Figures 9 to 11 show a conventional example of a TAB type IC package.
Fig. 9 is a partially cutaway plan view of the IC package, Fig. 10 is a sectional view of the main parts during molding, and Fig. 11 is a partially cutaway plan view of the IC package.
The figure is an enlarged sectional view taken along the line of FIG. 10. In the symbols used in the drawings, 1...tape carrier, 3...lead pattern, 8...inner lead part, 9...outer lead part, 9a...
Base, 10...IC chip, 20,40...Mold die, 21,41...Upper mold, 22,42...
Lower mold, 23, 24, 43, 44... clamping surface, 25
, 26, 45, 46... Cavity, 30... Elastic sheet, 37, 57... Resin mold, 38,
58...= between, 50...elastic packing, 52...
Step portion, 62...Groove portion, 139...Seepage.
Claims (1)
された領域を有する多数の導電性リードパターン
が形成されたテープキヤリヤの前記インナーリー
ド部にボンデイングされたＩＣチツプを、前記各
アウターリード部の基部を含めて樹脂封止するた
めのモールド金型であつて、 上型と下型とからなり、これら上下型は前記各
アウターリード部を挟み込む挟持面とこの挟持面
の内方で樹脂が注入されるキヤビテイとを有し、 前記上型または下型の少なくとも一方の挟持面
に、それら上下型の型締めにより弾性変形して前
記各アウターリード部間の〓間に入り込む弾性シ
ール部材を設けたことを特徴とするＩＣパツケー
ジ用のモールド金型。[Claims for Utility Model Registration] An IC chip bonded to the inner lead part of a tape carrier on which a large number of conductive lead patterns having areas separated into an inner lead part and an outer lead part are formed, This is a mold for resin sealing including the base of the lead part, and consists of an upper mold and a lower mold. a cavity into which resin is injected, and an elastic sealing member, which is elastically deformed by clamping of the upper and lower molds and enters between the outer lead parts, on the clamping surface of at least one of the upper mold and the lower mold. A mold for an IC package, characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5289989U JPH02146833U (en) | 1989-05-08 | 1989-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5289989U JPH02146833U (en) | 1989-05-08 | 1989-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146833U true JPH02146833U (en) | 1990-12-13 |
Family
ID=31573602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5289989U Pending JPH02146833U (en) | 1989-05-08 | 1989-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146833U (en) |
-
1989
- 1989-05-08 JP JP5289989U patent/JPH02146833U/ja active Pending
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