JPH0214779B2 - - Google Patents

Info

Publication number
JPH0214779B2
JPH0214779B2 JP57199203A JP19920382A JPH0214779B2 JP H0214779 B2 JPH0214779 B2 JP H0214779B2 JP 57199203 A JP57199203 A JP 57199203A JP 19920382 A JP19920382 A JP 19920382A JP H0214779 B2 JPH0214779 B2 JP H0214779B2
Authority
JP
Japan
Prior art keywords
metal
substrate
protrusion
protrusions
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57199203A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5988860A (ja
Inventor
Kenzo Hatada
Isamu Kitahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57199203A priority Critical patent/JPS5988860A/ja
Publication of JPS5988860A publication Critical patent/JPS5988860A/ja
Publication of JPH0214779B2 publication Critical patent/JPH0214779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP57199203A 1982-11-12 1982-11-12 金属リ−ドへの金属突起物形成方法 Granted JPS5988860A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57199203A JPS5988860A (ja) 1982-11-12 1982-11-12 金属リ−ドへの金属突起物形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57199203A JPS5988860A (ja) 1982-11-12 1982-11-12 金属リ−ドへの金属突起物形成方法

Publications (2)

Publication Number Publication Date
JPS5988860A JPS5988860A (ja) 1984-05-22
JPH0214779B2 true JPH0214779B2 (cs) 1990-04-10

Family

ID=16403851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57199203A Granted JPS5988860A (ja) 1982-11-12 1982-11-12 金属リ−ドへの金属突起物形成方法

Country Status (1)

Country Link
JP (1) JPS5988860A (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
EP1439397A3 (en) * 1994-11-15 2009-09-02 FormFactor, Inc. Method of performing a burn-in
DE69635083T2 (de) * 1995-05-26 2006-05-18 Formfactor, Inc., Livermore Herstellung von verbindungen und ansatzstücken unter verwendung eines opfersubstrats
US6441315B1 (en) 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US7084650B2 (en) 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
US7528618B2 (en) 2006-05-02 2009-05-05 Formfactor, Inc. Extended probe tips

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147680A (en) * 1980-04-16 1981-11-16 Kurita Water Ind Ltd Treatment of waste water

Also Published As

Publication number Publication date
JPS5988860A (ja) 1984-05-22

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