JPH0214855Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention is based on a grip that holds the printed circuit board above a belt conveyor that carries a printed circuit board on which chip components are placed on solder paste that has been applied in advance. This invention relates to a soldering device equipped with a conveyance chain for holding and conveying the soldering device.

[Conventional technology]

Conventionally used reflow soldering equipment and vapor phase soldering equipment temporarily attach chip components to printed circuit boards with solder paste or adhesive, and then place them on a conveying device such as a conveyor belt or conveyor chain. In reflow soldering equipment, the heat source generated by the heater is far infrared rays, heat rays, laser, etc., and in vapor phase soldering equipment, the soldering equipment is heated to a temperature of 215°C or higher, for example. Soldering is performed by melting the solder paste with the vapor of a heat transfer liquid (for example, Fluorinert, a fluorine-based inert liquid: a trademark of Sumitomo 3M Limited), and after soldering is completed, it is allowed to cool naturally. The chip components were attached to the printed circuit board by solidifying the chips.

[Problem that the invention attempts to solve]

Conventional soldering equipment as described above is suitable for small-volume production soldering when printed circuit boards are placed on a belt conveyor for soldering. Soldering equipment that performs soldering by holding it in place is suitable for mass-produced soldering and for soldering when chip components are attached to the top or bottom of a printed circuit board, but it is suitable for low-volume production soldering. It is not suitable for processing, and furthermore, if a printed circuit board comes off the holding claws due to thermal deformation, etc. and falls, the fallen printed circuit board cannot be removed unless the transport chain stops running. If the PCB comes into contact with the heating device that melts the solder paste on the PCB, it may cause an accident to the soldering equipment. There was a problem with causing this.

This invention was made to solve the above problems, and it enables two types of soldering processing, mass production type and small quantity production type, and also allows the printed circuit board to be placed under the soldering machine during the soldering process. To provide a soldering device which prevents it from becoming impossible to take out if it is dropped.

[Means for solving problems]

The soldering device according to this invention includes a belt conveyor on which a printed circuit board is placed and conveyed, and a pair of conveyors that run parallel to the running direction of the belt conveyor and above the belt conveyor with both sides parallel to each other. It is equipped with a chain and holding claws that hold the printed circuit board on the conveyance chain.

[Effect]

In this invention, the printed circuit board can be soldered simultaneously with one soldering device by conveying it in two systems: conveying by a belt conveyor and conveying by a conveying chain.

In addition, even if the printed circuit board held by the holding claws of the upper conveyor chain comes off during the soldering process of the printed circuit board, it can be caught on the lower belt conveyor and easily taken out. Prevent it from falling below the device.

〔Example〕

Figures 1, 2a and 2b show an embodiment of this invention. Figure 1 is a schematic configuration diagram of a soldering device, and Figures 2a and 2b are plane views showing the main parts of Figure 1. Figure and front view. In these figures, 1 is a printed circuit board, 2 is a chip component, 3 is a solder paste applied in advance to the printed circuit board 1, 11 is the entire soldering device, 12 is a heater,
As a heat source for melting the solder paste 3, far infrared rays, heat rays, laser, etc. are generated. 13 is a cooler that cools and solidifies the melted solder paste 3; 14 is a belt conveyor on which the printed circuit board 1 is placed and conveyed; 15 is a driving roller that runs the belt conveyor 14; 16 is a roller for driving the belt conveyor 14; a driven roller; 17 is a drive shaft of the driving roller 15; 18 is a driven shaft of the driven roller 16; 1;
9 is a pair of conveyor chains, and a belt conveyor 14
It is installed above the machine and rotates in the vertical direction. 19A is the fixed side conveyance chain, 19B
is a movable conveyance chain that faces the fixed conveyance chain 19A and is movable in a direction perpendicular to the traveling direction, and the fixed conveyance chain 19A and the movable conveyance chain 19B are parallel in opposing parts. Run. 20 is a holding claw attached to the conveyance chain 19; 21A is a drive sprocket for the fixed conveyance chain 19A; 21B is a drive sprocket for the movable conveyance chain 19B;
22A is a fixed side driven sprocket, 22B is a movable side driven sprocket, and 23 is a drive shaft, which fixes the drive sprocket 21A. Reference numeral 24 denotes a long key fixed to the drive shaft 23, which is fitted so as to drive and move the drive sprocket 21B. 25 is a driven shaft, and 26 is a guide piece, to which the movable side sprockets 21B and 22B are rotatably attached. 27 is a driving device for the belt conveyor 14 and the conveyance chain 19, which includes a motor 28, a sprocket 29, and a roller chain 3.
Consists of 0. 31 is a screw rod on the drive side, and 32 is a screw rod on the driven side, both of which are screwed together with the guide piece 26. 33 and 34 are sprockets for the screw rods 31 and 32, 35 is a roller chain, and 36 is a handle for driving the screw rod 31 on the drive side.

Next, the operation will be explained.

When soldering is performed by placing the printed circuit board 1 on the belt conveyor 14, the motor 28 is driven to cause the belt conveyor 14 to travel, and then the printed circuit board 1 is placed and driven. Next, the solder paste 3 is melted by the heat source generated from the heater 12, and then cooled by the cooler 13 to solidify, thereby fixing the chip component 2 to the printed circuit board 1.

Furthermore, when soldering is performed while holding the printed circuit board 1 on the holding claws 20 of the conveyance chain 19,
First, turn the handle 36 to tighten each screw rod 31, 3.
2 to move the guide piece 26 and hold the retaining claw 20.
The interval is set at a position corresponding to the holding width of the printed circuit board 1. Next, after driving the motor 28 to run the conveyance chain 19, the printed circuit board 1 is held by the holding claws 20 and conveyed. After this, the process of melting the solder paste 3 on the printed circuit board 1 with a heater 12 and then cooling it with a cooler 13 and fixing it is as follows:
This is the same as in the case of the belt conveyor 14 described above.

3 and 4 a and b show other embodiments of this invention, in which FIG. 3 is a schematic configuration diagram of a soldering device, and FIGS. 4 a and b are plan views of the main parts of FIG. 3. Figure and side view. In these figures, Figure 1, Figure 2
The same reference numerals as in FIGS. 1 and 2 indicate the same parts, 41 indicates the entire soldering device, and 42 indicates a conveyor chain, which is provided above the belt conveyor 14. The difference is that it rotates horizontally. 42A is a fixed side conveyance chain, 42B is a movable side conveyance chain,
43 is a holding claw of the conveyance chain 42, 44A is a drive sprocket of the fixed conveyance chain 42A, and 44B is the movable conveyance chain 42B.
45A is a fixed side driven sprocket, 45B is a movable side driven sprocket,
46A is a drive gear that rotates the fixed side drive sprocket 44A, and is fixed to the drive shaft 23. 46B is the drive sprocket 4 on the movable side.
4B, and is movably fitted to the drive shaft 23. 47A is a fixed side driven gear, 47B is a movable side driven gear, and 48 is a housing on which the driven gears 47A, 47B are rotatably mounted, and the threaded rods 31, 32 are screwed together.

Next, the operation will be explained.

The difference from FIG. 1 and FIGS. 2a and 2b is that when the motor 28 is driven, the drive sprockets 44A and 44B rotate horizontally via the drive gears 46A and 46B, so that the conveyance chain 42 runs.
The other operations are the same as those shown in FIGS. 1 and 2 a and b, so their explanation will be omitted.

Note that this invention is not limited to a reflow type soldering device that uses the heater 12, but can also be a vapor phase soldering device that melts the solder paste 3 using vapor of a heat transfer liquid. Good too.

In addition, both of the conveyance chains 19 and 42 may be movable to adjust the distance therebetween, or either one of them may be movable, or both may be fixed.

[Effect of idea]

As explained above, this idea consists of a belt conveyor on which a printed circuit board is placed and conveyed, and a pair of conveyor chains that run parallel to the running direction of this belt conveyor and above the belt conveyor with their portions on both sides parallel to each other. This conveyance chain is equipped with a holding claw that holds the printed circuit board, so it is possible to solder the printed circuit board by conveying it in two ways. When soldering to circuit boards or printed circuit boards with chip components attached to the top or bottom, it can be done using a conveyor chain, so a single soldering machine can solder various printed circuit boards, increasing productivity. can be improved.
In addition, even if the printed circuit board held by the holding claws of the conveyance chain detaches from the holding claws due to thermal deformation and falls, it will be caught by the belt conveyor below.
Since the printed circuit board does not fall below the soldering device or onto the heater, it is possible to save the trouble of stopping the conveyance chain and picking it up, which has the advantage of preventing accidents caused by falling printed circuit boards.

[Brief explanation of the drawing]

Figures 1, 2a and 2b show an embodiment of this invention. Figure 1 is a schematic configuration diagram of a soldering device, and Figures 2a and 2b are plan views showing the main parts of Figure 1. The figure, front view, FIG. 3, and FIG. 4 a and b show other embodiments of this invention. FIG. 3 is a schematic configuration diagram of a soldering device, and FIG. FIG. In the figure, 1 is a printed circuit board, 2 is a chip component, and 3
1 is a soldering paste, 11 is a soldering device, 12 is
is a heater, 13 is a cooler, 14 is a belt conveyor, 15 and 16 are rollers, 17 and 23 are drive shafts,
18, 25 are driven shafts, 19 is a conveyance chain, 20
is a holding claw, 21A and 21B are drive sprockets,
22A and 22B are driven sprockets, 26 is a guide piece, 27 is a drive device, 31 and 32 are screw rods, 3
3 and 34 are sprockets, 35 is a roller chain, and 36 is a handle.

Claims (1)

[Scope of utility model registration request] A heater that generates a heat source that heats solder paste applied in advance to a printed circuit board on which chip components are disposed above its melting point to melt the solder paste, and a heater that generates a heat source that melts the solder paste, and cools the melted solder paste to melt the chip component. A soldering device comprising a cooler fixed to the printed circuit board, a belt conveyor on which the printed circuit board is placed and conveyed, and a belt conveyor parallel to the running direction of the belt conveyor,
A soldering device comprising: a pair of conveyance chains whose opposite sides run parallel to each other above the belt conveyor; and holding claws which hold the printed circuit board on the conveyance chains.