JPH02148796A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH02148796A JPH02148796A JP30154988A JP30154988A JPH02148796A JP H02148796 A JPH02148796 A JP H02148796A JP 30154988 A JP30154988 A JP 30154988A JP 30154988 A JP30154988 A JP 30154988A JP H02148796 A JPH02148796 A JP H02148796A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- contact
- printed circuit
- circuit board
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （産業上の利用分野） る。[Detailed description of the invention] (Industrial application field) Ru.
（従来技術）
従来、電子部品等を組み付けるプリント基板には、第５
図、第６図に示すようなものが知られている。(Prior art) Conventionally, printed circuit boards on which electronic components are assembled have a fifth
6 and 6 are known.
このプリント基板は、絶縁板１の表面に金属箔を蒸着し
て成り、図示しない接触子によって互いに導通される一
対の接触導通部２ａ、２ｂが形成されており、一対の接
触導通部２ａ、２ｂからは端子部３ａ、３ｂに通ずる導
通部４ａ、４ｂが延びている。一対の接触導通部２ａ、
２ｂの周囲は、ハンダ槽（図示せず）に浸して端子部３
ａ、３ｂにハンダを付着させるときに、導通部４ａ、４
ｂにハンダが付着するのを防止するハンダレジスト５に
よって被覆されている。ハンダ槽にプリント基板を浸す
ときには接触導通部２ａ、２ｂには、第６図に示すよう
にマスキング部材としての粘着テープ６を付着させて接
触導通部２ａ、２ｂへのハンダの付着を防止している
（発明が解決しようとする課Ｍ）
しかしながら、この様な従来のプリント基板の場合、粘
着テープ６の端末部６ａが完全に接触導通部２ａ、２ｂ
の周囲を密封していないと、端末部６ａとノ＼ンダレジ
スト５の間からハンダ７が浸入して接触導通部２ａ、２
ｂ上にハンダ７が付着して固化してしまうという問題が
ある。このハンダ７を完全に除去するのは非常に煩雑で
あるため、この様なプリント基板は不良品とせざるをえ
ず、かかる従来のプリント基板の構造では製品の歩留ま
りが良くないという問題があった。This printed circuit board is made by depositing metal foil on the surface of an insulating plate 1, and has a pair of contact conductive parts 2a, 2b that are electrically connected to each other by a contactor (not shown). Conductive portions 4a and 4b that communicate with terminal portions 3a and 3b extend therefrom. a pair of contact conductive parts 2a,
The surrounding area of 2b is dipped in a solder bath (not shown) and connected to the terminal part 3.
When attaching solder to conductive parts 4a and 4b,
b is covered with a solder resist 5 that prevents solder from adhering to it. When the printed circuit board is immersed in the solder bath, an adhesive tape 6 as a masking member is attached to the contact conductive parts 2a and 2b as shown in FIG. 6 to prevent solder from adhering to the contact conductive parts 2a and 2b. (Problem M to be solved by the invention) However, in the case of such a conventional printed circuit board, the terminal portion 6a of the adhesive tape 6 is completely connected to the contact conductive portions 2a, 2b.
If the surroundings of the solder resist 5 are not sealed, the solder 7 will infiltrate between the terminal portion 6a and the solder resist 5 and cause the contact conduction portions 2a, 2.
There is a problem that the solder 7 adheres to the surface b and solidifies. Since it is very troublesome to completely remove the solder 7, such printed circuit boards have to be rejected as defective products, and the conventional printed circuit board structure has a problem in that the product yield is not good. .
（発明の目的）
本発明は、かかる従来のプリント基板の課題に着目して
発明されたものであり、プリント基板をハンダ槽に浸す
場合に接触導通部へのハンダ介Ｊ着を確実に防止するこ
とにより製品の歩留まりを向上できるプリント基板を提
供することを目的とする。(Purpose of the Invention) The present invention was invented by focusing on the problem of the conventional printed circuit board, and is intended to reliably prevent solder from adhering to the contact conduction portion when the printed circuit board is immersed in a solder bath. The purpose of this invention is to provide a printed circuit board that can improve the yield of products.
（課題を解決するための手段）
本発明に係るプリント基板は、上記課題を解決するため
に、接触子の当接により導通する複数箇所の接触導通部
が離間して形成され、ｉ８融状態のハンダを充填したハ
ンダ槽に浸漬されるときに導通部へのハンダの付着を防
止する第１のハンダレジストが形成され、前記接触導通
部の前記接触子の当接する部位はハンダ槽浸漬の際にマ
スキング部材により被覆されるプリント基板において、
前記互いに導通する複数箇所の接触導通部同士間に、前
記接触子の当接部位を囲むように掛渡されて前記マスキ
ング部材を付着させる第２のハンダレジストが設けられ
、前記第１のハンダレジストと第２ハンダレジストとの
間にはハンダを付着さゼる金属箔が形成されていること
を特徴とする。(Means for Solving the Problems) In order to solve the above-mentioned problems, the printed circuit board according to the present invention has a plurality of contact conduction parts that are electrically connected by contact with contacts and are formed in a spaced manner. A first solder resist is formed that prevents solder from adhering to the conductive portion when immersed in a solder bath filled with solder, and the portion of the contact conduction portion that the contact comes into contact with is immersed in the solder bath. In the printed circuit board covered with the masking member,
A second solder resist is provided between the plurality of contact conducting parts that are electrically conductive to each other so as to surround the contact area of the contact and to which the masking member is attached, and the second solder resist is provided with the first solder resist. A metal foil to which solder is attached is formed between the second solder resist and the second solder resist.
（作 用）
本発明に係るプリント基板の構成によれば、ハンダ槽に
プリント基板を浸漬する場合、第２のハンダレジストと
マスキング部材との密着と、第１、第２のハンダレジス
ト間の金属箔にハンダが付着するときのハンダの表面張
力により、接触導通部内の接触子が当接する部位にハン
ダが浸入することが防止される。(Function) According to the configuration of the printed circuit board according to the present invention, when the printed circuit board is immersed in a solder bath, the second solder resist and the masking member are in close contact with each other, and the metal between the first and second solder resists is The surface tension of the solder when the solder adheres to the foil prevents the solder from penetrating into the area in the contact conduction section where the contact comes into contact.
（実 施 例）
以下、本発明に係るプリント基板の実施例につき、図面
を参照にして説明する。(Embodiments) Hereinafter, embodiments of the printed circuit board according to the present invention will be described with reference to the drawings.
第１図〜第４図は本実施例に係るプリント基板を示した
図であり、プリント基板ｌＯは、絶縁板１１上に接触導
通部１２ａ、 １２ｂが形成されている。ｔ！触触導通
１２ａ、１２ｂは、金属箔を蒸着して形成され、端子１
３ａ、１３ｂに延びる導通部１４ａ、 １４ｂを有して
いる。プリント基板１０の表面にはハンダの付着を防止
できる第１のハンダレジスト１５が形成されている。第
１のハンダレジスト１５は、絶縁板１１の表面を被覆し
ており、端子部１３ａ、１３ｂと接触導通部１２ａ、１
２ｂとを除くように導通部１４ａ、１４ｂを被覆してい
る。1 to 4 are diagrams showing a printed circuit board according to this embodiment, and the printed circuit board 10 has contact conductive portions 12a and 12b formed on an insulating plate 11. T! The tactile conductors 12a and 12b are formed by vapor-depositing metal foil, and are connected to the terminal 1.
It has conductive parts 14a and 14b extending to 3a and 13b. A first solder resist 15 is formed on the surface of the printed circuit board 10 to prevent adhesion of solder. The first solder resist 15 covers the surface of the insulating plate 11, and connects the terminal portions 13a, 13b and the contact conductive portions 12a, 1.
The conductive parts 14a and 14b are covered except for the conductive parts 2b.
接触導通部１２ａ、 １２ｂの表面には、接触導通部１
２ａ１２ｂ同士を導通させる接触子の当接部位１２ｃ、
１２ｄを囲むように、第２のハンダレジスト１６が蒸着
により形成されており、第２のハンダレジスト１６は接
触導通部１２ａ、 １２ｂ間に掛渡されて形成されてい
る。この第２のハンダレジスト１６の上面１６ａには、
第３図に示すように、プリント基板１０をハンダ槽に浸
漬させるときにハンダの付着を防止するマスキング部材
としての粘着テープ１７が密着されるものであり、第２
のハンダレジスト１６はその上面１６ａの高さが全周に
わたって均一になるように形成されている。The contact conduction parts 1 are provided on the surfaces of the contact conduction parts 12a and 12b.
A contact portion 12c of a contact that connects 2a12b to each other,
A second solder resist 16 is formed by vapor deposition so as to surround 12d, and the second solder resist 16 is formed so as to span between the contact conducting parts 12a and 12b. On the upper surface 16a of this second solder resist 16,
As shown in FIG. 3, when the printed circuit board 10 is immersed in a solder bath, an adhesive tape 17 is attached as a masking member to prevent solder from adhering to the solder tank.
The solder resist 16 is formed so that the height of its upper surface 16a is uniform over the entire circumference.
接触導通部１２ａ、１２ｂ間に存在する絶縁板１１の中
間部１１ａでは、第２のハンダレジスト１６の絶縁板１
１からの厚さは接触導通部１２ａ、 １２ｂに付着され
る部位の厚さよりも若干厚く形成されている。In the middle part 11a of the insulating plate 11 existing between the contact conducting parts 12a and 12b, the insulating plate 1 of the second solder resist 16
1 is formed to be slightly thicker than the thickness of the portion attached to the contact conducting portions 12a and 12b.
本実施例では、第１のハンダレジスト１５と第２のハン
ダレジスト１６との間は接触導通部１２ａ、１２ｂによ
って形成される金属箔部分１８とされている。この金属
箔部分１８は、溶融状態のハンダ１９が付着するときに
表面張力でハンダ１９自身が丸く収縮しようとする作用
を利用したものである。即ち、溶融状態のハンダが充填
されたハンダ槽にプリント基板１０を浸漬させるときに
、この金属箔部分１８に溶融状態のハンダ１９が付着す
ると表面張力でハンダ１９自身が丸く球状に固まろうと
するため、第２ハンダレジスト１６と粘着テープ１７と
による密着という要因の他に、金属箔部分１８によるハ
ンダの吸着という要因によって、接触導通部１２ａ、１
２ｂの接触子当接部１２ｃ、１２ｄへのハンダ１９の浸
入が防Ｆ２でいる。勿論、第２ハンダレジスト１６と粘
着テープ１７との完全な密着でもハンダ１９の浸入を防
止できることは言うまでもない。In this embodiment, a metal foil portion 18 is formed between the first solder resist 15 and the second solder resist 16 by the contact conductive portions 12a and 12b. This metal foil portion 18 utilizes the effect that when molten solder 19 is attached, the solder 19 itself tends to contract into a round shape due to surface tension. That is, when the printed circuit board 10 is immersed in a solder tank filled with molten solder, if the molten solder 19 adheres to the metal foil portion 18, the solder 19 itself tends to harden into a rounded spherical shape due to surface tension. Therefore, in addition to the close contact between the second solder resist 16 and the adhesive tape 17, the adsorption of solder by the metal foil portion 18 causes contact conduction parts 12a, 1
The infiltration of solder 19 into the contact contact portions 12c and 12d of 2b is prevented F2. Of course, it goes without saying that even if the second solder resist 16 and the adhesive tape 17 are in perfect contact with each other, infiltration of the solder 19 can be prevented.
尚、本実施例では、金属箔部分１８を接触導通部１２ａ
、１２ｂを延在させることにより、金属箔形成を容易化
しているが、これに限らず、接触導通部１２ａ。In this embodiment, the metal foil portion 18 is connected to the contact conductive portion 12a.
, 12b facilitates metal foil formation, but the present invention is not limited to this.
１２ｂの中間部にハンダ１９が浸入しないように、輪郭
線に沿って第２のハンダレジスタ１６を形成し、金属箔
部分を別個の金属箔を用いて形成してもよいのは勿論で
あり、金属箔は、熱によって酸化しにくい金、銀、ロジ
ウムの鍍金して形成してもよい。Of course, the second solder resistor 16 may be formed along the contour line so that the solder 19 does not penetrate into the middle part of the solder 12b, and the metal foil portion may be formed using a separate metal foil. The metal foil may be formed by plating with gold, silver, or rhodium, which is not easily oxidized by heat.
本実施例に係るプリント基板ｌＯによれば、プリント基
板１０をハンダ槽内に浸漬する場合に、第２のハンダレ
ジスト１６とこれに付着される粘着テープ１７により、
接触導通部１２ａ、１２ｂの接触子が当接する部位１２
ｃ、１２ｄ内へのハンダの浸入が防止されるので、プリ
ント基板１０の生産歩留まりが向上する。According to the printed circuit board 10 according to the present embodiment, when the printed circuit board 10 is immersed in a solder tank, the second solder resist 16 and the adhesive tape 17 attached thereto can prevent
Portion 12 where the contacts of contact conduction parts 12a and 12b come into contact
Since solder is prevented from infiltrating into the insides of the printed circuit boards 12c and 12d, the production yield of the printed circuit board 10 is improved.
（発明の効果）
本発明に係るプリント基板は、以上説明したように構成
したので、プリント基板をハンダ槽に浸す場合に接触子
が当接する接触導通部へのハンダ付着を確実に防止でき
、プリント基板生産時の製品の歩留まりを向上できると
いう効果を奏する。(Effects of the Invention) Since the printed circuit board according to the present invention is configured as described above, it is possible to reliably prevent solder from adhering to the contact conduction portions that the contacts come into contact with when the printed circuit board is immersed in a solder bath, and This has the effect of improving the yield of products during substrate production.
第１図〜第４図は本発明のプリント基板の実施例を示す
図であり、
第１図は本実施例の平面構成図
第２図は第１図のＩＩ −ＩＩ線断面図第３図は第１図
のプリント基板に粘着テープを付着させてマスキングし
た場合の断面図
第４図は第２のハンダレジストによりハンダの浸入を防
止し、金属箔部分でこのハンダを付着させた状態の説明
図、
第５図は従来のプリント基板の平面構成図、第６図は従
来のプリント基板をハンダ槽に浸漬した後の第５図のＶ
［−Ｖｌ線断面図に粘着テープを付着した状態の説明図
である。
１０・・・プリント基板
１１・・・絶縁板
１２ａ、 １２ｂ・・・接触導通部
１３ａ、１３ｂ−・・端子
１４ａ、１４ｂ＝・導通部
１５・・・第１のハンダレジスト
１６・・・第２のハンダレジスト
１８・・・金属箔部分
１７・・・粘着テープ（マスキング部材）１９・・・ハ
ンダ1 to 4 are diagrams showing an embodiment of the printed circuit board of the present invention. FIG. 1 is a plan configuration diagram of this embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1. Figure 4 is a cross-sectional view of the printed circuit board shown in Figure 1, which is masked with adhesive tape; Figure 4 is an explanation of the state in which the second solder resist prevents solder from entering, and the solder is adhered to the metal foil portion. Figure 5 is a plan view of a conventional printed circuit board, and Figure 6 is a diagram of the conventional printed circuit board after it has been immersed in a solder bath.
[It is an explanatory view of a state in which an adhesive tape is attached to a cross-sectional view taken along the line -Vl. 10... Printed circuit board 11... Insulating plates 12a, 12b... Contact conductive parts 13a, 13b -... Terminals 14a, 14b = Conductive part 15... First solder resist 16... Second Solder resist 18...Metal foil portion 17...Adhesive tape (masking member) 19...Solder
Claims (1)
間して形成され、溶融状態のハンダを充填したハンダ槽
に浸漬されるときに導通部へのハンダの付着を防止する
第１のハンダレジストが形成され、前記接触導通部の前
記接触子の当接する部位はハンダ槽浸漬の際にマスキン
グ部材により被覆されるプリント基板において、 前記互いに導通する複数箇所の接触導通部同士間に、前
記接触子の当接部位を囲むように掛渡されて前記マスキ
ング部材を付着させる第２のハンダレジストが設けられ
、前記第１のハンダレジストと第２ハンダレジストとの
間にはハンダを付着させる金属箔が形成されていること
を特徴とするプリント基板。[Claims] A plurality of contact conducting portions that are electrically connected by contact with the contact are formed at a distance, and when immersed in a solder bath filled with molten solder, adhesion of solder to the conducting portions is prevented. In a printed circuit board on which a first solder resist is formed to prevent soldering, and a portion of the contact conduction portion that the contact comes into contact with is covered with a masking member during immersion in a solder bath, the plurality of contact conduction portions that are electrically conductive to each other are A second solder resist is provided between the first solder resist and the second solder resist, which is stretched around the contact area of the contact to which the masking member is attached, and between the first solder resist and the second solder resist. A printed circuit board characterized by forming a metal foil to which solder is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30154988A JPH0831683B2 (en) | 1988-11-29 | 1988-11-29 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30154988A JPH0831683B2 (en) | 1988-11-29 | 1988-11-29 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02148796A true JPH02148796A (en) | 1990-06-07 |
| JPH0831683B2 JPH0831683B2 (en) | 1996-03-27 |
Family
ID=17898277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30154988A Expired - Fee Related JPH0831683B2 (en) | 1988-11-29 | 1988-11-29 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831683B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022187019A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |
| JP2022187018A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |
-
1988
- 1988-11-29 JP JP30154988A patent/JPH0831683B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022187019A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |
| JP2022187018A (en) * | 2019-12-02 | 2022-12-15 | 株式会社大一商会 | game machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831683B2 (en) | 1996-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |