JPH0215464U - - Google Patents
Info
- Publication number
- JPH0215464U JPH0215464U JP2766288U JP2766288U JPH0215464U JP H0215464 U JPH0215464 U JP H0215464U JP 2766288 U JP2766288 U JP 2766288U JP 2766288 U JP2766288 U JP 2766288U JP H0215464 U JPH0215464 U JP H0215464U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- accommodates
- container
- lead pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図はこの考案の一実施例を示す素子を収納
したエンボスキヤリアテープの斜視図、第２図は
第１図の横断面図、第３図は従来のエンボスキヤ
リアテープの斜視図、第４図は第３図の横断面図
である。
図において、１はエンボスキヤリアテープ、２
は素子、３は凹部、１ａは逃げ溝、１ｂは底部、
２ａは素子２のパツケージ、２ｂは素子２のリー
ドピンである。なお、図中、同一符号は同一、ま
たは相当部分を示す。
FIG. 1 is a perspective view of an embossed carrier tape containing elements showing an embodiment of this invention, FIG. 2 is a cross-sectional view of FIG. 1, FIG. 3 is a perspective view of a conventional embossed carrier tape, and FIG. The figure is a cross-sectional view of FIG. 3. In the figure, 1 is embossed carrier tape, 2
is the element, 3 is the recess, 1a is the relief groove, 1b is the bottom,
2a is a package of the element 2, and 2b is a lead pin of the element 2. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
キヤリアテープの半導体集積回路素子を収納する
凹部の底部にリードピンの下面が直接容器の凹部
に接触しないように半導体集積回路素子のパツケ
ージで支持し、リードピン部分を逃げるように形
成したことを特徴とする電子部品の収納多連容器
。 At the bottom of the concave portion of the embossed carrier tape that accommodates the semiconductor integrated circuit devices that accommodates a large number of semiconductor integrated circuit devices, the lead pin portion is supported by the package cage of the semiconductor integrated circuit device so that the bottom surface of the lead pin does not come into direct contact with the concave portion of the container. A multi-container for storing electronic components characterized by being formed so as to escape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2766288U JPH0215464U (en) | 1988-03-01 | 1988-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2766288U JPH0215464U (en) | 1988-03-01 | 1988-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215464U true JPH0215464U (en) | 1990-01-31 |
Family
ID=31250345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2766288U Pending JPH0215464U (en) | 1988-03-01 | 1988-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215464U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952697B2 (en) * | 1979-03-31 | 1984-12-21 | 小名浜製錬株式会社 | How to operate a copper refining furnace |
| JPS60113998A (en) * | 1983-11-26 | 1985-06-20 | 松下電器産業株式会社 | electronic parts assembly |
| JPS61127474A (en) * | 1984-11-20 | 1986-06-14 | 松下電器産業株式会社 | Molded shape for conveying electronic part |
-
1988
- 1988-03-01 JP JP2766288U patent/JPH0215464U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952697B2 (en) * | 1979-03-31 | 1984-12-21 | 小名浜製錬株式会社 | How to operate a copper refining furnace |
| JPS60113998A (en) * | 1983-11-26 | 1985-06-20 | 松下電器産業株式会社 | electronic parts assembly |
| JPS61127474A (en) * | 1984-11-20 | 1986-06-14 | 松下電器産業株式会社 | Molded shape for conveying electronic part |