JPH028151U - - Google Patents
Info
- Publication number
- JPH028151U JPH028151U JP8519588U JP8519588U JPH028151U JP H028151 U JPH028151 U JP H028151U JP 8519588 U JP8519588 U JP 8519588U JP 8519588 U JP8519588 U JP 8519588U JP H028151 U JPH028151 U JP H028151U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- integrated circuit
- base
- semiconductor integrated
- cage side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は本考案の一実施例に外付け部品及び他のＩＣ
を取付けた状態の一例を示す斜視図である。
１ａ，１ｂ，１ｃ……ＩＣ、１１ａ，１１ｂ，
１１ｃ……パツケージ、１２ａ，１２ｂ，１２ｃ
……リード、１２１ａ，１２１ｂ……半田溜め、
２ａ，２ｂ……外付け部品、２２ａ，２２ｂ……
リード、３……半田。なお図中同一符号は同一ま
たは相当するものを示す。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure shows one embodiment of the present invention with external components and other ICs.
It is a perspective view showing an example of the state where it is attached. 1a, 1b, 1c...IC, 11a, 11b,
11c...Package, 12a, 12b, 12c
...Lead, 121a, 121b...Solder reservoir,
2a, 2b...external parts, 22a, 22b...
Lead, 3...Solder. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
え、外付け部品をリードのパツケージ側根元近く
に容易に取付けることができ、他の半導体集積回
路装置を重ねて容易に取付けることができる半導
体集積回路装置。 This semiconductor integrated circuit device is equipped with a solder reservoir near the base of the lead on the package cage side, allows external components to be easily mounted near the base of the lead on the package cage side, and allows other semiconductor integrated circuit devices to be easily stacked and mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8519588U JPH028151U (en) | 1988-06-29 | 1988-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8519588U JPH028151U (en) | 1988-06-29 | 1988-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028151U true JPH028151U (en) | 1990-01-19 |
Family
ID=31309870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8519588U Pending JPH028151U (en) | 1988-06-29 | 1988-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028151U (en) |
-
1988
- 1988-06-29 JP JP8519588U patent/JPH028151U/ja active Pending