JPH02155248A - Structure of tab - Google Patents

Abstract

PURPOSE:To simplify structure, and to improve heat resistance by forming a dummy bump regardless to the operation of a semiconductor device to the device, conducting ILB to a conductor one-layer tape including even the dummy bump and cutting leads from the conductor one-layer tape with the exception of a lead to which ILB is performed to the dummy bump. CONSTITUTION:A semiconductor device 1 has main bumps 3 electrically continuous with circuit patterns 2 and dummy bumps 4 regardless to the operation of the device, inner leads 6a and dummy leads 6b are shaped in conformity with the positions of bumps in a TAB tape 5, and these semiconductor device and TAB tape 5 are thermocompression-bonded. Only the inner leads 6a coupled with the main bumps 3 are cut with the exception of the dummy leads 6b connected to the dummy bumps 4, and each lead of the inner leads 6a is bonded with a tester. Accordingly, the semiconductor device 1 can be screened electrically while the semiconductor device 1 is supported to the conductor one-layer tape 5 through said dummy leads 6b using the dummy leads 6b as hanging leads and the tape can be carried under the state of the long-sized tape.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to the structure of a TAB using a single layer conductor tape.

[Conventional technology]

Conventionally, TA performs electrical sorting on this type of long tape.
In the structure B, as shown in FIG. 9, the conductor pattern 26 is lined with an insulating base tape 25. 27 is a resist, and 28 is a semiconductor device.

[Problem to be solved by the invention]

Since the conventional TAB tape mentioned above has a structure in which a conductor is lined with an insulating material, the structure of the TAB tape is complicated and the maximum temperature at which it can be used is increased.

An object of the present invention is to provide a TAB structure that solves the above problems.

[Differences between the invention and the prior art]

Compared to the structure of the conventional TAB described above, the present invention is different in that it has a simple structure and high heat resistance.

[Means to solve the problem]

In order to achieve the above object, the TAB structure according to the present invention includes a semiconductor device including a main bump electrically connected to a circuit operating section and a dummy bump separated and independent from the circuit operating section, and an inner lead and a dummy lead. The inner lead and dummy lead of the single layer conductor tape are respectively coupled to the main bump and the dummy bump of the semiconductor device, and only the dummy lead coupled to the dummy bump is separated from the single layer conductor tape. It is something.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

(Embodiment 1) FIG. 1 is an exploded perspective view showing Embodiment 1 of the present invention. A semiconductor device 1 includes main bumps 3 electrically connected to a circuit pattern 2, and dummy bumps 4 unrelated to the operation of the device. The main bumps 3 and dummy bumps 4 are mainly made of gold, and have a bottom area of 100μm diameter and 25μI diameter.
It is of a height.

The TAB tape 5 has inner leads 6a and dummy leads 6b formed in advance in accordance with the positions of the main bang 3 and dummy bumps 4, and is plated with gold to a thickness of 1 μm.

FIG. 2 shows the semiconductor device 1 and the TAB tape 5 bonded together by thermocompression. In this state, each ILB has a connection strength of 40 g or more, but since each lead 6a and 6b is conductive, electrical selection cannot be performed.
As shown in the figure, excluding the dummy leads 6b connected to the dummy bumps 4, only the inner leads 6a connected to the main bump 3 are cut, and each lead of the inner leads 6a is individually connected to a tester. Device 1
dummy lead 6b.
The semiconductor device 1 is supported by the single-layer conductor tape 5 via the dummy lead 6b by using it as a suspension lead, thereby making it possible to transport the semiconductor device 1 in the form of a long tape.

Therefore, even during electrical sorting, the semiconductor device 1
is TAB by dummy bump 4 and dummy lead 6b.
Since it is connected to the automatic TA shown in Figure 4,
A handler equipped with a B-tape feeding mechanism makes it possible to perform electrical sorting on one reel fully automatically. That is, the TAB tape 5 in the form of a long tape having the semiconductor devices 1 is passed between the pair of reels 12 and 12, and while the TAB tape 5 is fed by the conveying device 14, the contact head is attached to each semiconductor device 1. Reference numeral 11 designates a spacer, which is brought into contact with the spacer 9 and subjected to arithmetic processing by the computer 13, and defective products are marked with a defective punch 10 and electrically sorted.

(Example 2) FIG. 5 and FIG. 6 are diagrams showing a second embodiment of the present invention.

The semiconductor device 15 includes a main bump 17 electrically connected to the circuit pattern 16 and a dummy bump 1 unrelated to the operation of the device.
8, and a heat transfer wiring 19 for dissipating heat from the circuit pattern in the center. Further, the TAB tape 20 has an inner lead 21a, a dummy lead 21b, and a heat dissipation part 22 formed integrally.

The semiconductor device 15 and the TAB tape 20 are bonded by thermocompression ILB,
FIG. 7 shows a state in which only the inner lead 21a is cut to enable electrical selection.

The selected TABs are placed in the heat dissipation section 2 as shown in Figure 8.
By cutting the tape 20 individually, the conveying portion of the tape 20 can be used as the heat dissipating section 22.1 In this embodiment, the dummy bumps 18 are used for heat dissipation of the semiconductor device 1, and the conveying section can be used as the heat dissipating section 22. It has the advantage of being able to be used efficiently.

〔Effect of the invention〕

As explained above, the present invention provides a dummy bump that is unrelated to the operation of the device on a semiconductor device, and cuts the leads from the single-layer conductor tape, excluding the dummy bumps including the dummy bumps and the leads that have been ILBLed to the single-layer conductor tape. This has the effect that electrical sorting can be performed using a long tape shape.

In addition, by placing the dummy bang and the wiring connected to it near the heat generating part of the semiconductor device, it is possible to improve the heat dissipation performance of the semiconductor device.Moreover, the heat dissipation pattern on the single-layer conductor tape is placed over the tape transport section. By doing so, there is an effect that the conductor single layer tape can be used efficiently.

[Brief explanation of the drawing]

1 to 3 are perspective views showing Embodiment 1 of the present invention;
The figure is a front view showing TAB sorting equipment, Figures 5 to 8 are front views showing Embodiment 2 of the present invention, and Figure 9 is a front view showing a conventional TAB
It is a perspective view showing B. , 15... Semiconductor device 3, 17... Main bang,
18...Dummy bump, 20...Conductor single layer tape a, 21a...Inner lead b, 21b...Dummy lead

Claims (1)

[Claims] (1) A semiconductor device having a main bump electrically connected to a circuit operating part and a dummy bump separated and independent from the circuit operating part, and a conductor single-layer tape having an inner lead and a dummy lead. A TAB structure characterized in that an inner lead and a dummy lead are respectively coupled to a main bump and a dummy bump of a semiconductor device, and only the dummy lead coupled to the dummy bump is separated from the conductor single layer tape.