JPH021557U - - Google Patents

Info

Publication number
JPH021557U
JPH021557U JP7760588U JP7760588U JPH021557U JP H021557 U JPH021557 U JP H021557U JP 7760588 U JP7760588 U JP 7760588U JP 7760588 U JP7760588 U JP 7760588U JP H021557 U JPH021557 U JP H021557U
Authority
JP
Japan
Prior art keywords
solder
opening
resistant
soldering
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7760588U
Other languages
English (en)
Other versions
JPH0536302Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988077605U priority Critical patent/JPH0536302Y2/ja
Publication of JPH021557U publication Critical patent/JPH021557U/ja
Application granted granted Critical
Publication of JPH0536302Y2 publication Critical patent/JPH0536302Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の耐半田マスクプレートの斜視
図である。 図中の数字はそれぞれ次のものを表わす。１…
…耐半田マスクプレート、２……額縁状支持体、
３……耐半田プレート薄体、４……開口部、５…
…非開口部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 開口部と非開口部とを持つ耐半田性の薄体
    からなる、配線基板に重ねて溶融半田に浸漬し半
    田付けするための耐半田マスクプレート。 (2) 額縁状の耐半田性支持体に、耐半田性の薄
    体を固定し、該薄板に開口部と非開口部とを設け
    、かつ額縁内に配線基板が位置ずれを起すことな
    く保持できるように構成した、半田付け用耐半田
    マスクプレート。 (3) 開口部として、半田付け用の開口部と、配
    線基板面からの耐半田性薄体の距離を調節するた
    めの開口部とを有する実用新案登録請求の範囲第
    １項または第２項のいずれかに記載の耐半田マス
    クプレート。
JP1988077605U 1988-06-11 1988-06-11 Expired - Lifetime JPH0536302Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988077605U JPH0536302Y2 (ja) 1988-06-11 1988-06-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988077605U JPH0536302Y2 (ja) 1988-06-11 1988-06-11

Publications (2)

Publication Number Publication Date
JPH021557U true JPH021557U (ja) 1990-01-08
JPH0536302Y2 JPH0536302Y2 (ja) 1993-09-14

Family

ID=31302582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988077605U Expired - Lifetime JPH0536302Y2 (ja) 1988-06-11 1988-06-11

Country Status (1)

Country Link
JP (1) JPH0536302Y2 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51110021U (ja) * 1975-03-05 1976-09-06
JPS52140152U (ja) * 1976-04-19 1977-10-24
JPS5352264A (en) * 1976-10-25 1978-05-12 Hitachi Ltd Soldering method
JPS5375476A (en) * 1976-12-17 1978-07-04 Fujitsu Ltd Method of soldering printed board
JPH01290293A (ja) * 1988-05-18 1989-11-22 Matsushita Electric Ind Co Ltd 半田付け装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51110021U (ja) * 1975-03-05 1976-09-06
JPS52140152U (ja) * 1976-04-19 1977-10-24
JPS5352264A (en) * 1976-10-25 1978-05-12 Hitachi Ltd Soldering method
JPS5375476A (en) * 1976-12-17 1978-07-04 Fujitsu Ltd Method of soldering printed board
JPH01290293A (ja) * 1988-05-18 1989-11-22 Matsushita Electric Ind Co Ltd 半田付け装置

Also Published As

Publication number Publication date
JPH0536302Y2 (ja) 1993-09-14

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