JPH0448624U - - Google Patents

Info

Publication number
JPH0448624U
JPH0448624U JP1990090782U JP9078290U JPH0448624U JP H0448624 U JPH0448624 U JP H0448624U JP 1990090782 U JP1990090782 U JP 1990090782U JP 9078290 U JP9078290 U JP 9078290U JP H0448624 U JPH0448624 U JP H0448624U
Authority
JP
Japan
Prior art keywords
semiconductor element
wiring board
conductor pattern
recess
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990090782U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990090782U priority Critical patent/JPH0448624U/ja
Publication of JPH0448624U publication Critical patent/JPH0448624U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
図は本考案の一実施例を示し、第１図は配線基
板の平面図、第２図はその断面図、第３図は半導
体素子の取付け状態を示す断面図である。 １……セラミツク基板、２……導体パターン、
２ａ……凹部、３……半導体素子、４……ハンダ
材。

Claims (1)

  1. 【実用新案登録請求の範囲】 セラミツク基板上に取着した導体パターン上に
    、半導体素子を実装した配線基板において、 該導体パターン上に、該半導体素子と略同じ平
    面形状を持ち該半導体素子を挿入可能な凹部が設
    けられ、該凹部内で該半導体素子がハンダ付けさ
    れていることを特徴とする配線基板。
JP1990090782U 1990-08-29 1990-08-29 Pending JPH0448624U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990090782U JPH0448624U (ja) 1990-08-29 1990-08-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990090782U JPH0448624U (ja) 1990-08-29 1990-08-29

Publications (1)

Publication Number Publication Date
JPH0448624U true JPH0448624U (ja) 1992-04-24

Family

ID=31825804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990090782U Pending JPH0448624U (ja) 1990-08-29 1990-08-29

Country Status (1)

Country Link
JP (1) JPH0448624U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009094293A (ja) * 2007-10-09 2009-04-30 Toyota Motor Corp 半導体装置
JP2014053384A (ja) * 2012-09-05 2014-03-20 Toshiba Corp 半導体装置およびその製造方法
JP2022108915A (ja) * 2021-01-14 2022-07-27 住友電気工業株式会社 半導体装置
JP2023092147A (ja) * 2021-12-21 2023-07-03 株式会社デンソー 放熱基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009094293A (ja) * 2007-10-09 2009-04-30 Toyota Motor Corp 半導体装置
JP2014053384A (ja) * 2012-09-05 2014-03-20 Toshiba Corp 半導体装置およびその製造方法
JP2022108915A (ja) * 2021-01-14 2022-07-27 住友電気工業株式会社 半導体装置
JP2023092147A (ja) * 2021-12-21 2023-07-03 株式会社デンソー 放熱基板

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