JPH0487638U - - Google Patents
Info
- Publication number
- JPH0487638U JPH0487638U JP12972190U JP12972190U JPH0487638U JP H0487638 U JPH0487638 U JP H0487638U JP 12972190 U JP12972190 U JP 12972190U JP 12972190 U JP12972190 U JP 12972190U JP H0487638 U JPH0487638 U JP H0487638U
- Authority
- JP
- Japan
- Prior art keywords
- injection nozzle
- pure water
- pressure gas
- wafer
- gas injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
第１図は、この考案の実施例１の洗浄装置の概
略図を示す。第２図は、実施例２の洗浄装置の概
略図を示し、第３図および第４図は、実施例２の
洗浄装置の純水・高圧気体併合噴射ノズルの異な
る例の正面図を示す。第５図は、この考案の実施
例１の洗浄シーケンス図である。
１……ウエーハ、２……チヤツク部、３……純
水噴射ノズル、４……高圧気体噴射ノズル、５…
…純水・高圧気体噴射併合ノズル、７……純水噴
射ノズル穴、８……高圧気体噴射ノズル穴、９…
…純水噴射区間、１０……高圧気体噴射区間、１
１……高速回転区間。
FIG. 1 shows a schematic diagram of a cleaning device according to a first embodiment of this invention. FIG. 2 shows a schematic diagram of the cleaning device of Example 2, and FIGS. 3 and 4 show front views of different examples of the pure water/high-pressure gas combined injection nozzle of the cleaning device of Example 2. FIG. 5 is a cleaning sequence diagram of Embodiment 1 of this invention. DESCRIPTION OF SYMBOLS 1...Wafer, 2...Chuck part, 3...Pure water injection nozzle, 4...High pressure gas injection nozzle, 5...
...Pure water/high pressure gas injection combined nozzle, 7...Pure water injection nozzle hole, 8...High pressure gas injection nozzle hole, 9...
...Pure water injection section, 10...High pressure gas injection section, 1
1...High speed rotation section.
Claims (1)
部と、 前記ウエーハに純水を噴射する純水噴射ノズル
と、 前記ウエーハに高圧気体を噴射する高圧気体噴
射ノズルとを具備するウエーハ洗浄装置。 (2) 前記純水噴射ノズルと高圧気体噴射ノズル
が一体化された純水・高圧気体噴射併合ノズルを
具備する請求項(1)記載のウエーハ洗浄装置。[Scope of Claim for Utility Model Registration] (1) A chuck unit that vacuum-chucks and rotates a wafer, a pure water injection nozzle that injects pure water onto the wafer, and a high-pressure gas injection nozzle that injects high-pressure gas onto the wafer. A wafer cleaning device equipped with. (2) The wafer cleaning apparatus according to claim (1), further comprising a combined pure water/high pressure gas injection nozzle in which the pure water injection nozzle and the high pressure gas injection nozzle are integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12972190U JPH0487638U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12972190U JPH0487638U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487638U true JPH0487638U (en) | 1992-07-30 |
Family
ID=31877112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12972190U Pending JPH0487638U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487638U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07321082A (en) * | 1994-05-27 | 1995-12-08 | Nec Corp | Method and device for cleaning substrate |
| JP2015076468A (en) * | 2013-10-08 | 2015-04-20 | 株式会社ディスコ | Spinner cleaning device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110639A (en) * | 1986-10-28 | 1988-05-16 | Nec Corp | Manufacture of integrated circuit device |
| JPH02288230A (en) * | 1989-04-27 | 1990-11-28 | Nec Kyushu Ltd | Cleaning device for semiconductor substrate |
-
1990
- 1990-11-30 JP JP12972190U patent/JPH0487638U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110639A (en) * | 1986-10-28 | 1988-05-16 | Nec Corp | Manufacture of integrated circuit device |
| JPH02288230A (en) * | 1989-04-27 | 1990-11-28 | Nec Kyushu Ltd | Cleaning device for semiconductor substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07321082A (en) * | 1994-05-27 | 1995-12-08 | Nec Corp | Method and device for cleaning substrate |
| JP2015076468A (en) * | 2013-10-08 | 2015-04-20 | 株式会社ディスコ | Spinner cleaning device |
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