JPH02165406A - Thin-film magnetic head - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a thin film magnetic head.

(Prior Art) In recent years, there have been increasing demands for higher density, smaller size (multi-track), and mass production of magnetic heads used in magnetic recording and reproducing devices. Accordingly, thin film magnetic heads formed using thin film technology are used.

Examples of such thin film magnetic heads include the following.

FIG. 3 is a side sectional view showing a conventional magnetic head.

In the figure, 1 indicates a substrate made of Afi 2 03 Tic or the like. On this substrate l, a first magnetic layer 2, which serves as a lower magnetic core, is formed of a magnetic material such as permalloy by a plating method. On the first magnetic layer 2, a 5to2
An insulating intermediate layer 3 is formed by, etc. On the first insulating intermediate layer 3, an insulating layer 5 made of hardened resist or the like is formed with a coil 4 made of Cu or the like formed by plating. A second magnetic layer 6 is formed on the insulating layer 5 and serves as an upper magnetic core in contact with the first magnetic layer 2 and the insulating intermediate layer 3.
is formed by the Metsuki method. A protective layer 7 made of A.degree. C. 203 or the like is formed on the substrate 1 including the second magnetic layer 6.

In such a thin film magnetic head for both recording and playback, the number of turns of the coil is increased in order to increase the playback output. In this way, increase the number of turns of the coil (
In this case, the resistance in the coil usually increases and impedance noise increases, so the aspect ratio of the coil is increased to reduce the resistance of the coil.

The method for forming the above-mentioned coil with a large aspect ratio is as follows:
The selective plating method is superior and is widely used in thin film magnetic head processes.

However, in the coil formed by the selective plating method, the coil 4 has a reverse tapered shape as shown in FIG.
If a sputtered thin film such as the above is used, even if the bias sputtering method is used to improve the step coverage of the insulating layer, as shown in FIG.
is formed and does not function as an insulating layer.

Therefore, it is conceivable to use a coated organic insulating material such as a resist with good step coverage for the insulating layer of the thin film magnetic head.

However, the above-mentioned conventional thin-film magnetic head uses a hardened resist, which is an organic insulating material, for the insulating layer, but it has poor reliability and has a softening point around 230°C, so sputtering and annealing are difficult. etc. (20
0°C to 450°C) process cannot be carried out.

Therefore, amorphous magnetic thin films with a high saturation magnetic flux density, which is necessary for increasing the density of recording media, are formed by sputtering and exhibit excellent soft magnetic properties only after being annealed in a rotating magnetic field, but they cannot be used. Have difficulty.

In this way, conventional thin-film magnetic heads cannot use sputtered magnetic thin films with high saturation magnetic flux density.
For this reason, since a permalloy magnetic thin film is used by the plating method, which is a low-temperature process, and annealing treatment cannot be performed, there is a limit to the improvement of its characteristics.

(Problems to be Solved by the Invention) As mentioned above, conventional thin-film magnetic heads have no choice but to use coated organic materials such as resist as the insulating layer, which not only has poor reliability but also deteriorates magnetic properties. Since a good sputtered magnetic thin film cannot be used, there is a problem in that it is difficult to support high recording density.

The present invention is intended to solve the above-mentioned conventional problems,
It is an object of the present invention to provide a thin film magnetic head with good reliability and good characteristics that can support high recording density.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides a lower magnetic core formed on a substrate, a conductive coil formed on the lower magnetic core, and a part of the conductive coil. In the thin film magnetic head, the thin film magnetic head includes an upper magnetic core formed on the lower magnetic core and covered with an insulating layer, the insulating layer being formed of an organic insulating material and an inorganic insulating material.

Further, the present invention is characterized in that an organic insulating material is formed in contact with a side wall of the conductive coil, and an inorganic insulating material is formed to cover the conductive coil and the organic insulating material.

Further, in the present invention, a resist material is used as the inorganic insulating material, and 5i02 is used as the organic insulating material.

(Function) In the present invention, the insulating layer is formed of an inorganic insulating material and an organic insulating material, and most of the insulating layer is made of a highly reliable and heat resistant material.
To provide a thin film magnetic head with good characteristics capable of supporting high recording density by using a sputtered thin film having high reliability and good magnetic properties since it is formed of an inorganic insulating material such as No. 102. Can be done.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a side sectional view showing a thin film magnetic head according to an embodiment of the present invention.

In the figure, 11 indicates a substrate such as AJ2 TiC. On this substrate 11, there is a first
A magnetic thin film 12 is formed. First magnetic thin film 12
An insulating intermediate layer 13 made of 8102 or the like is formed thereon to form a gap portion. A coil 14 made of Cu or the like is formed on the insulating intermediate layer 13 by a plating method. An organic insulating portion 15 such as a resist is formed in the reverse tapered portion of the umbrella portion of the side wall of the coil 14 . Further, on the insulating intermediate layer 13 including the coil 14 and the organic insulating portion 15, an inorganic insulating thin film 16 such as 5i02 is formed by sputtering.

A second magnetic thin film 17 is formed on the inorganic insulating thin film 16 in contact with the first magnetic source [12 and the insulating intermediate layer 13 to serve as an upper magnetic core. A protection N118 is formed on the substrate 11' including the second magnetic thin film 17.

Next, an example of the manufacturing process of the coil, insulating part, and insulating thin film in the above-mentioned thin-film magnetic head is shown in FIGS.
This will be explained using f).

First, as shown in FIG. 2(a), the first magnetic thin film 12
On top of the insulating intermediate layer 13 formed above, a plating base 21 made of Cu or the like, which will serve as a conductor during electrolytic plating, is formed by sputtering or the like. Next, as shown in FIG. 2(b), a resist 22 that will serve as a frame during plating is formed using photolithography, and then hard baked at about 200° C. for about 30 minutes. And Figure 2 (C
), the coil 23 is formed by electrodepositing a conductor such as Cu by electrolytic plating. After this, the second
As shown in Figure (d), by irradiating the entire surface with an oxygen ion beam for about 30 minutes, the resist 22, which is an organic insulating material, is selectively etched. At this time, a portion of the resist 22 remains in the reverse tapered portion of the umbrella portion of the side wall of the coil 23, and a portion of the upper portion of the coil 23 is oxidized to form an oxide layer 24. Next, as shown in FIG. 2(e), the oxide layer 24 on the plating base 21 and the coil 23 is etched using an Ar ion beam. After this, the second
As shown in Figure (f), an inorganic insulating film 2 is formed by sputtering an inorganic insulating material such as 8102 by bias sputtering.
form 5. After coating the concave portion H of the inorganic insulating film 25 with a resist (not shown), the entire surface is irradiated with an Ar ion beam at a beam incidence angle of about 75°, and the resist and the convex bone M of the inorganic insulating film 25 are coated at the same rate. By etching the surface of the inorganic insulating film 25 to make it flat, an inorganic insulating thin film is formed.

The manufacturing process for other parts of the thin film magnetic head in this embodiment is the same as the conventional manufacturing process, and the explanation thereof will be omitted.

Therefore, the thin-film magnetic head of this embodiment minimizes the use of organic insulating material as an insulating layer and sufficiently seals the coil with an inorganic insulating material as an insulating layer, resulting in high reliability. A thin film magnetic head can be provided. In addition, it is possible to use a sputtered magnetic thin film with good magnetic properties, and by further performing an annealing treatment, it is possible to provide a thin film magnetic head that can handle higher recording density.

[Effects of the Invention] As explained above, in the thin film magnetic head of the present invention, the insulating layer is formed of an inorganic insulating material and an organic insulating material, and most of the insulating layer is made of a material such as Sio2, which has excellent reliability and heat resistance. Since it is made of an inorganic insulating material, it has high reliability and by using a sputtered thin film with good magnetic properties, it is possible to provide a thin film magnetic head with good properties that can support high recording density.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing a thin film magnetic head according to an embodiment of the present invention, FIGS. 2(a) to (f) are views showing an example of the manufacturing process of the thin film magnetic head of FIG. 1, and FIG. 4 is a side sectional view showing a conventional thin film magnetic head, and FIG. 4 is an enlarged sectional view of the main part of FIG. 3. DESCRIPTION OF SYMBOLS 11... Substrate, 12... First magnetic thin film, 13...
- Insulating intermediate layer, 14.23... Coil, 15... Organic insulating part, 6... Inorganic insulating thin film, 7... Second magnetic thin film, 8... Protective layer, 2... Resist, 5... Inorganic insulating film.

Claims (2)

[Claims] (1) A lower magnetic core formed on a substrate, a conductive coil formed on the lower magnetic core, and a part of the conductive coil covered with an insulating layer formed on the lower magnetic core. What is claimed is: 1. A thin-film magnetic head comprising an upper magnetic core comprising: an insulating layer made of an organic insulating material and an inorganic insulating material; (2) The organic insulating material is formed in contact with a side wall of the conductive coil, and the inorganic insulating material is formed to cover the conductive coil and the organic insulating material. Thin film magnetic head.