JPH02168175A - Contactor for inspecting semiconductor device - Google Patents
Contactor for inspecting semiconductor deviceInfo
- Publication number
- JPH02168175A JPH02168175A JP32391088A JP32391088A JPH02168175A JP H02168175 A JPH02168175 A JP H02168175A JP 32391088 A JP32391088 A JP 32391088A JP 32391088 A JP32391088 A JP 32391088A JP H02168175 A JPH02168175 A JP H02168175A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contactor
- electrode
- semiconductor device
- brought
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 239000012212 insulator Substances 0.000 abstract description 4
- 238000007689 inspection Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の検査装置に関し、特に半導体装置
のリード端子と接触するためのコンタクタに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a testing device for semiconductor devices, and more particularly to a contactor for contacting lead terminals of semiconductor devices.
従来のコンタクタを第３図（ａ）〜（ｄ）により説明す
る。図に示すように、絶縁支持体５のＩ！ｊ側にテスト
ボートのソケットに挿入する脚ビンを下端に弓き出した
コンタクタ電極２と前記コンタクタ電極２の外側にＧＮ
Ｄ板ｌが設けられ、第３図（ｂ）のように５コンタクタ
電極２が半導体装置３のリート端子４に外側より押し付
けられて接触する。A conventional contactor will be explained with reference to FIGS. 3(a) to 3(d). As shown in the figure, I! of the insulating support 5! On the j side, a leg bottle to be inserted into the socket of a test boat is protruded from the lower end of the contactor electrode 2, and a GN is attached to the outside of the contactor electrode 2.
A D plate 1 is provided, and as shown in FIG. 3(b), the five contactor electrodes 2 are pressed from the outside and come into contact with the lead terminals 4 of the semiconductor device 3.
上述した従来のコンタクタでは半導体装置を検査する際
に、半導体装置とコンタクタの電極の接触が完全でない
ことがあり、半導体装置が良品であるにもかかわらず接
触不良のために、不良と判定してしまうという欠点があ
った。With the conventional contactor described above, when inspecting a semiconductor device, the contact between the semiconductor device and the contactor's electrodes may not be perfect, and even though the semiconductor device is good, it may be determined to be defective due to poor contact. There was a drawback that it could be stored away.
本発明の目的は前記課題を解決した半導体装１１（を検
査用コンタクタを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a contactor for testing a semiconductor device 11 that solves the above problems.
、上述した従来の゛を導体装置検査用コンタクタに対し
１本発明は半導体装置のリード端子とコンタクタ電極と
の導通を確認することにより、接触不良を検出するとい
う相違点を有する。The present invention differs from the above-mentioned conventional contactor for testing conductor devices in that a contact failure is detected by confirming continuity between the lead terminal of the semiconductor device and the contactor electrode.
前記目的を達成するため９本発明は半導体装置の検査に
用いるコンタクタにおいて、半導体装置のリード端子に
接触させる接触ピンを、ｉ「記り−ド端子を介して導通
する対をなすコクタクタｔＥ極にて構成したものである
。In order to achieve the above object, the present invention provides a contactor used for testing semiconductor devices, in which a contact pin to be brought into contact with a lead terminal of a semiconductor device is connected to a pair of contactor tE poles that are electrically connected via a lead terminal. It is composed of
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
（実施例１）
第１図（ａ）〜（２）は本発明による実施例１を示す図
であり、（ａ）はコンタクタの側面図、（ｂ）はコンタ
クタ電極と半導体装置の接触状態を示す斜視図、（Ｃ）
はコンタクタ電極とリード端子のコンタクト状態を示す
拡大図、（ｄ）はコンタクタ電極の断面図、（ｅ）はリ
レーとコンタクタ電極の接続図、（ｆ）は半導体装置検
査時を示す拡大図、（２）は接触チエツク時を示す拡大
図である。(Example 1) Figures 1 (a) to (2) are diagrams showing Example 1 according to the present invention, in which (a) is a side view of the contactor, and (b) is a diagram showing the contact state between the contactor electrode and the semiconductor device. Perspective view shown, (C)
(d) is a cross-sectional view of the contactor electrode, (e) is a connection diagram of the relay and contactor electrode, (f) is an enlarged view showing the state of contact between the contactor electrode and the lead terminal, (f) is an enlarged view showing the state of contact between the contactor electrode and the lead terminal, ( 2) is an enlarged view showing the contact check.
図において１本発明の半導体装置検査用コンタクタは、
半導体装置のリード端子と接触ピンとの導通を確認する
ことにより、接触不良を検出するものである。すなわち
、絶縁支持体５の両側に取付ける接触ピンは、その間に
絶縁体９を挟んで平行に配列され半導体装置３のリード
端子４を介して導通する対をなすコンタクタ電極２ａ、
２ｂから構成しである。また、１はコンタクタ電極２ａ
、２ｂの外側に配列したＧＮＤ板である。また、６はリ
レーである。In the figure, the contactor for semiconductor device testing of the present invention is as follows:
A contact failure is detected by checking continuity between a lead terminal of a semiconductor device and a contact pin. That is, the contact pins attached to both sides of the insulating support 5 are arranged in parallel with the insulator 9 in between, and form a pair of contactor electrodes 2a that are electrically connected via the lead terminals 4 of the semiconductor device 3.
It is composed of 2b. In addition, 1 is a contactor electrode 2a
, 2b are arranged outside the GND plates. Further, 6 is a relay.
半導体装置を検査するにあたって、半導体装置３のリー
ド端子４とコンタクタ電極２ａ、２ｂ間の導通を確認し
、接触不良を検出するため、リレー６をＯＮさせ、第１
図（２）の状態にする。コンタクタ電極２ａは、絶縁支
持体５の両側に備えられその下面から下方に突出してい
る脚ピンに引き出され各脚ビンはテストボードに取付け
られているソケットに挿入されテスターに接続されてい
る。テスター側より半導体装ｌｌ￥３の各リード端子４
にコンタクタ電極２ａより′Ｉｔ圧を加え半導体装置３
のリート端子４を通しコンタクタ電極２ｂに流れる電流
７を１ｌｌ１１定し電流が流れたら接触良と判定し、電
流が流れないか、又は規格値より小さい電流の場合は接
触不良とすることで接触不良が検出できる。全ビン接触
長の場合は第１１ＥＩ（ｆつのようにリレー６の接点を
切替えて半導体装置３の特性検査を行い、接触不良のも
のは再度検査するか、マニュアルにて再検査を行う。以
上のことにより、接触不良による検査ミスをなくすこと
ができる。When inspecting a semiconductor device, the relay 6 is turned on and the first
Set the state as shown in figure (2). The contactor electrodes 2a are drawn out by leg pins provided on both sides of the insulating support 5 and protruding downward from the lower surface thereof, and each leg pin is inserted into a socket attached to a test board and connected to a tester. From the tester side, each lead terminal 4 of the semiconductor device ¥3
'It pressure is applied from the contactor electrode 2a to the semiconductor device 3.
The current 7 flowing through the lead terminal 4 to the contactor electrode 2b is fixed at 1ll11, and if the current flows, it is determined that the contact is good.If the current does not flow or the current is smaller than the standard value, it is judged as a poor contact. can be detected. In the case of total bottle contact length, the characteristics of the semiconductor device 3 are inspected by switching the contacts of the relay 6 as shown in the 11th EI (f), and if the contact is poor, inspect again or re-inspect manually. By doing so, it is possible to eliminate inspection errors due to poor contact.
（実施例２）
第２図（ａ）、 （ｂ）は本発明の実施例２を示す図で
ある。本実施例は半導体装置３のリード端子４と接触す
るコンタクト部がポゴピン構造のものを対象とするもの
であり、内径のコンタクタ電極８ａと外径のコンタクタ
電極８ｂとを筒状の絶縁体９を介して内外２重に配列し
たものであり、２つの内外コンタクタ電極８８と８ｂと
が半導体装置３のリード端子４により導通された状態を
接触良として判定し接触不良状態を検出するものである
。(Example 2) FIGS. 2(a) and 2(b) are diagrams showing Example 2 of the present invention. In this embodiment, the contact portion that contacts the lead terminal 4 of the semiconductor device 3 has a pogo pin structure, and a cylindrical insulator 9 is used to connect the inner diameter contactor electrode 8a and the outer diameter contactor electrode 8b. A state in which the two inner and outer contactor electrodes 88 and 8b are electrically connected by the lead terminal 4 of the semiconductor device 3 is determined to be good contact, and a bad contact state is detected.
以上説明したように本発明は半導体装置の検査時に半導
体装置のリート端子にて対をなすコンタクタ電極間を４
通させる構造としたものであり、半導体装置のリード端
子とコンタクタ電極との接触不良が検出でき、検査ミス
が低減でき、検査歩留りを向上させることができる効果
を有する。As explained above, the present invention provides four connections between the pair of contactor electrodes at the lead terminal of the semiconductor device during inspection of the semiconductor device.
This structure allows the contact between the lead terminal of the semiconductor device and the contactor electrode to be detected, reduces inspection errors, and improves the inspection yield.
第１図（ａ）は本発明の実施例１を示す側面図、（ｂ）
は半導体装１１”ｉ検査状態を示す斜視図、（Ｃ）はリ
ード端子とコンタクタ電極の接触状態を示す拡大図、（
４）はコンタクタ電極を示す断面図、（ｅ）はコンタク
タ電極とリレーとの接続図、げ）は半導体装置検査時の
り−１・端子とコンタクタ電極との関係を示す拡大図、
（２）は半導体装置のリード端子とコンタクタ電極の接
触チエツク時のり−１一端子とコンタクタ電極の関係を
示す拡大図、第２図軸）は本発明の実Ｋｉ例２を示す側
面図、（ｂ）は同斜視図、第３図（ａ）は従来例を示す
側面図、（ｂ）は半導体装置検査状態を示す斜視図、（
ｃ）はリード端子とコンタクタ電極の接触状態を示す拡
大図、（ｄ）はコンタクタ電極の断面図である。
１・ＧＮＤ板 ２ａ 、 ２ｂ・コンタクタ電
極３・・半導体装置 ４・・リート端子５・・絶
縁支持体 ６・リレー７・・導通電流
８ａ 、 ｌｌｂ・・・ポゴピン構造のコンタクタＨｆ
ｒｅ９・・・絶縁体
第２図
（ａ）
第３図
（Ｃ）
＝］−２
（ｄ）
第３図FIG. 1(a) is a side view showing Embodiment 1 of the present invention, FIG. 1(b)
(C) is a perspective view showing the state of inspection of the semiconductor device 11''i, (C) is an enlarged view showing the contact state of the lead terminal and contactor electrode, (
4) is a cross-sectional view showing the contactor electrode, (e) is a connection diagram between the contactor electrode and the relay, and (e) is an enlarged view showing the relationship between the glue-1 terminal and the contactor electrode during semiconductor device inspection.
(2) is an enlarged view showing the relationship between the lead terminal of the semiconductor device and the contactor electrode during a contact check, and (2) is a side view showing the practical example 2 of the present invention. FIG. 3(b) is a perspective view of the same, FIG. 3(a) is a side view showing the conventional example, FIG.
(c) is an enlarged view showing the contact state between the lead terminal and the contactor electrode, and (d) is a cross-sectional view of the contactor electrode. 1.GND plate 2a, 2b.Contactor electrode 3..Semiconductor device 4..Lead terminal 5..Insulating support 6.Relay 7..Conduction current 8a, llb..Pogo pin structure contactor Hf
re9...Insulator Fig. 2 (a) Fig. 3 (C) =]-2 (d) Fig. 3
Claims (1)
半導体装置のリード端子に接触させる接触ピンを、前記
リード端子を介して導通する対をなすコクタクタ電極に
て構成したことを特徴とする半導体装置検査用コンタク
タ。(1) In a contactor used for testing semiconductor devices,
1. A contactor for testing a semiconductor device, characterized in that a contact pin brought into contact with a lead terminal of a semiconductor device is constituted by a pair of contactor electrodes that are electrically connected via the lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32391088A JPH02168175A (en) | 1988-12-22 | 1988-12-22 | Contactor for inspecting semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32391088A JPH02168175A (en) | 1988-12-22 | 1988-12-22 | Contactor for inspecting semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02168175A true JPH02168175A (en) | 1990-06-28 |
Family
ID=18159981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32391088A Pending JPH02168175A (en) | 1988-12-22 | 1988-12-22 | Contactor for inspecting semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02168175A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12429498B2 (en) | 2021-06-23 | 2025-09-30 | Mitsubishi Electric Corporation | Inspection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939038A (en) * | 1982-08-27 | 1984-03-03 | Nec Corp | Selecting and inspecting device for acceptable or defective integrated circuit |
-
1988
- 1988-12-22 JP JP32391088A patent/JPH02168175A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939038A (en) * | 1982-08-27 | 1984-03-03 | Nec Corp | Selecting and inspecting device for acceptable or defective integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12429498B2 (en) | 2021-06-23 | 2025-09-30 | Mitsubishi Electric Corporation | Inspection device |
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