JPH02174151A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPH02174151A
JPH02174151A JP63328274A JP32827488A JPH02174151A JP H02174151 A JPH02174151 A JP H02174151A JP 63328274 A JP63328274 A JP 63328274A JP 32827488 A JP32827488 A JP 32827488A JP H02174151 A JPH02174151 A JP H02174151A
Authority
JP
Japan
Prior art keywords
lead
tip
inner lead
protruding
recognized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63328274A
Other languages
Japanese (ja)
Inventor
Yoshio Urasaki
浦崎　善雄
Hitoshi Ito
仁 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP63328274A priority Critical patent/JPH02174151A/en
Publication of JPH02174151A publication Critical patent/JPH02174151A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To correctly recognize a position of an inner lead by installing the inner lead of a structure whose tip position is protruding or hollowed from the tip of other inner leads. CONSTITUTION:Inner leads 2 whose one or plurality of inner leads protrude or are recessed from a tip position of an inner lead 1 are provided; a protruding or recessed amount is set within a range of 0.05 to 5.0mm. When a position of the tip of the inner lead 1 is recognized during a wire bonding process, the protruding parts 2 are used as recognition parts; then, the parts are not recognized erroneously by a similar lead; when the protruding leads 2 are arranged in a symmetrical direction, they can be recognized doubly by recognizing a shape and by recognizing distances (a), (b). Thereby, the position of the inner leads can be recognized surely during the wire bonding process; it is possible to remarkably reduce a connection error and the like by an erroneous recognition operation.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、主に、半導体装置等のチップ装置に利用する
ことのできるリードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention mainly relates to a lead frame that can be used in chip devices such as semiconductor devices.

従来の技術 従来の技術では、チップとインナーリードを結線させる
ワイヤーボンディング工程で自動ワイヤーボンダー（チ
ップとインナーリードとを導電性の金属細線などで自動
的に結線する機械装置）を用いるが、インナーリード先
端部を認識させることにより、ワイヤーボンダーがイン
ナーリードの結線位置を判断しチップとインナーリード
を結線するが、従来のリードフレームでは、多数端子の
リードフレームになると、第５図の一部破断乎面図、第
６図の側面図のように、インナーリード１の先端の形状
が似かよってくるため、誤まって認識する。そのため、
インナーリードの認識箇所を第７図のようにグイバット
サポート３とインナーリード１の位置の形状を記憶させ
、インナーリードの結線位置を判断させるなどの方法が
一般的に用いられる。Conventional technology In the conventional technology, an automatic wire bonder (a mechanical device that automatically connects the chip and inner leads with thin conductive metal wires, etc.) is used in the wire bonding process to connect the chip and the inner leads. By recognizing the tip, the wire bonder determines the connection position of the inner lead and connects the chip and the inner lead. However, in conventional lead frames, when the lead frame has multiple terminals, a part breaks as shown in Figure 5. As shown in the top view and the side view of FIG. 6, the shapes of the tips of the inner leads 1 are similar, so they are mistakenly recognized. Therefore,
A commonly used method is to memorize the shape of the position of the Guibat support 3 and the inner lead 1, as shown in FIG. 7, to determine the connection position of the inner lead.

発明が解決しようとする課題 しかしながら、従来のリードフレームでは、多数端子の
リードフレームになるとインナーリード先端形状が似か
よっているので認識装置の移動による振動やフレーム送
りのずれなどが要因となって、誤まったリードを認識す
る場合がある。又、先に述べた従来例のダイパッドサポ
ート３とその隣のインナーリードを認識させる方法でも
、第６図のように、デイプレス４のようなリードフレー
ム加工を行なうことがある。この場合、認識をしようと
するインナーリードとダイパッドサポート３がティプレ
ス加工により、第６図のように高さ方向の位置関係が違
ってくるため、しばしば誤認識を起こしてしまう。また
、グイバットサポート３の隣のインナーリード１は、イ
ンナーリードの内で一番長いリードになる場合が多く、
変形が生じやすいという点もあり、変形した状態のイン
ナーリードの位置を認識した場合正しい位置にあるリー
ドがボンド外れなどの結線ミスを起してしまうなどの問
題点がある。Problems to be Solved by the Invention However, in conventional lead frames, when the lead frame has multiple terminals, the shapes of the inner lead tips are similar, so vibrations caused by the movement of the recognition device and deviations in frame feeding can cause errors. It may recognize dead leads. Also, in the conventional method described above for recognizing the die pad support 3 and the inner leads adjacent thereto, lead frame processing such as a day press 4 may be performed as shown in FIG. In this case, the inner lead to be recognized and the die pad support 3 are subjected to tip press processing, so that the positional relationship in the height direction differs as shown in FIG. 6, which often causes erroneous recognition. In addition, the inner lead 1 next to the Guibat support 3 is often the longest lead among the inner leads,
There is also the problem that deformation easily occurs, and if the position of the deformed inner lead is recognized, the lead in the correct position may cause a connection error such as the bond coming off.

課題を解決するための手段 本発明は、これらの問題を解消するもので、要約するに
、先端位置を他のインナーリードの先端より突出あるい
は、窪ませた構造のインナーリードを億えたリードフレ
ームである。Means for Solving the Problems The present invention solves these problems.In summary, it is a lead frame with an inner lead having a structure in which the tip position is protruded or recessed from the tip position of other inner leads. be.

作用 本発明の構成によれば、インナーリードの認識箇所が自
由に作成ができ、従来のリードフレームで必然的に決ま
ってくる認識箇所を選択しなくてもよいことになり、従
来のインナーリード認識箇所にまつわる諸問題がことご
とく解決できる。Effects According to the configuration of the present invention, recognition points for inner leads can be created freely, and there is no need to select recognition points that are inevitably determined in conventional lead frames. All problems related to the place can be solved.

実施例 以下に、本発明の実施例を図面に基づき説明する。Example Embodiments of the present invention will be described below based on the drawings.

第１図、第２図は本発明の実施例のリードフレームのイ
ンナーリード部の構造例を示す要部平面図２部分拡大平
面図、第３図、第４図は他の実施例のリードフレームの
インナーリード要部平面図２部分拡大平面図である。こ
の実施例のリードフレームは、インナーリード１の先端
位置より、−本ないし複数本のインナーリードを突出あ
るいは、窪（凹）ませたインナーリード２を備えたリー
ドフレームであり、この突出あるいは、窪み量は０．０
５ｍｍ〜５．０■の範囲で設定されている。1 and 2 are principal part plan views showing structural examples of the inner lead portion of a lead frame according to an embodiment of the present invention, and 2 partially enlarged plan views, and FIGS. 3 and 4 are lead frames of other embodiments. FIG. 2 is a partially enlarged plan view of a main part of the inner lead. The lead frame of this embodiment is a lead frame equipped with an inner lead 2 in which one or more inner leads protrude or are recessed from the tip position of the inner lead 1. The amount is 0.0
It is set in the range of 5 mm to 5.0 mm.

上記構成によれば、ワイヤーボンディング工程のインナ
ーリード先端の位置認識を行う際に、この突出箇所２を
認識箇所にすれば、類似リードによる、誤認識が行なわ
れないで済む、また、第１図のように突出リード２を対
称方向にも設置すれば、形状認識及び距離ａ、ｂの認識
により、２重の確認ができ、より確実な認識を行なうこ
とができる。According to the above configuration, when the position of the tip of the inner lead in the wire bonding process is recognized, if this protruding part 2 is used as the recognition part, erroneous recognition due to similar leads can be avoided. If the protruding leads 2 are also installed in the symmetrical direction as shown in the figure, double confirmation can be made by recognizing the shape and distances a and b, and more reliable recognition can be achieved.

また、この構成によれば、突出リード２の作成より、認
識位置がある程度自由に配置することができ、第５図の
グイバットサポート３を認識に使用しなくてもよいため
、第６図のデイプレス加工４の有無にかかわらず、リー
ド認識が行なえる。In addition, according to this configuration, the recognition position can be arranged more freely than the protruding lead 2, and the Guibat support 3 shown in FIG. 5 does not need to be used for recognition, so the recognition position shown in FIG. Lead recognition can be performed regardless of the presence or absence of day press processing 4.

発明の効果 本発明によると、ワイヤーボンド工程のインナーリード
の位置認識が確実に行なわれるため、誤認識による、結
線ミスなどを著しく低減させることができる。Effects of the Invention According to the present invention, since the position of the inner lead in the wire bonding process is reliably recognized, wiring errors caused by erroneous recognition can be significantly reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は本発明の実施例のリードフレームのイ
ンナーリード部の要部平面図、部分拡大平面図、第３図
、第４図は他の実施例のリードフレームのインナーリー
ド要部平面図、部分拡大平面図、第５図は従来例のリー
ドフレームインナーリードの要部平面図、第６図は同従
来例の側面図、第７図は同従来例のインナーリード部分
拡大平面図である。 １・・・・・・インナーリード先端部（インナーリード
）、２・・・・・・突出リード、凹みリード、３・・・
・・・グイバットサポート、４・・・・・・デイプレス
、５・・・・・・グイバット。 代理人の氏名　弁理士　粟野重孝　ほか１名第 図 第 図1 and 2 are principal part plan views and partially enlarged plan views of the inner lead portion of a lead frame according to an embodiment of the present invention, and FIGS. 3 and 4 are main parts of inner leads of a lead frame according to another embodiment. Fig. 5 is a plan view of the main part of the lead frame inner lead of the conventional example, Fig. 6 is a side view of the conventional example, and Fig. 7 is an enlarged plan view of the inner lead part of the conventional example. It is a diagram. 1...Inner lead tip (inner lead), 2...Protruding lead, recessed lead, 3...
...Guibat Support, 4...Day Press, 5...Guibat. Name of agent: Patent attorney Shigetaka Awano and one other person

Claims (2)

【特許請求の範囲】[Claims] （１）インナーリード先端部の位置より、突出あるいは
、窪んでいるインナーリードを備えたことを特徴とする
リードフレーム。(1) A lead frame characterized by having an inner lead that protrudes or is recessed from the position of the tip of the inner lead. （２）インナーリード先端部位置より、突出リードの長
さあるいは、窪み深さが０．０５ｍｍ〜５．０ｍｍの範
囲に設定された請求項（１）記載のリードフレーム。(2) The lead frame according to claim (1), wherein the length of the protruding lead or the depth of the recess is set in a range of 0.05 mm to 5.0 mm from the position of the tip of the inner lead.
JP63328274A 1988-12-26 1988-12-26 Lead frame Pending JPH02174151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63328274A JPH02174151A (en) 1988-12-26 1988-12-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63328274A JPH02174151A (en) 1988-12-26 1988-12-26 Lead frame

Publications (1)

Publication Number Publication Date
JPH02174151A true JPH02174151A (en) 1990-07-05

Family

ID=18208391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63328274A Pending JPH02174151A (en) 1988-12-26 1988-12-26 Lead frame

Country Status (1)

Country Link
JP (1) JPH02174151A (en)

Similar Documents

Publication Publication Date Title
US6495773B1 (en) Wire bonded device with ball-shaped bonds
JPH02174151A (en) Lead frame
JP3967314B2 (en) Light emitting element
JPH06232196A (en) Semiconductor device
JPS63187657A (en) Manufacture of semiconductor device
JP2003179193A (en) Lead frame, method of manufacturing the same, resin-sealed semiconductor device, method of manufacturing the same, and method of inspecting resin-sealed semiconductor device
JPH09330999A (en) Lead deformation prevention package
JP3157249B2 (en) Semiconductor device package and mounting method
JPH04250656A (en) Lead frame
US6172318B1 (en) Base for wire bond checking
JPH1187565A (en) Semiconductor device
JP2003031605A (en) Semiconductor module manufacturing method
JPH01286343A (en) Resin sealed type semiconductor device
JP2511765Y2 (en) Lead frame
JPH04246852A (en) Package for semiconductor device
JPH07142529A (en) Holding device for lead frame for electronic parts and holding method using the same
JP2981309B2 (en) Semiconductor device
JPH03173153A (en) Semiconductor integrated circuit device
JPH0590320A (en) Ball-type wire bonding method
JPS63104437A (en) Manufacture of semiconductor device
JP2002093987A (en) Lead frame with recognition pattern
KR19980078729A (en) Leadframe for Package
JPH10223678A (en) Semiconductor integrated circuit chip
JPH113963A (en) Resin-sealed semiconductor device and lead frame
KR19980083261A (en) Lead Frame Recognition Method and Lead Frame Structure for Wire Bonding