JPH0217429Y2 - - Google Patents
Info
- Publication number
- JPH0217429Y2 JPH0217429Y2 JP1984098502U JP9850284U JPH0217429Y2 JP H0217429 Y2 JPH0217429 Y2 JP H0217429Y2 JP 1984098502 U JP1984098502 U JP 1984098502U JP 9850284 U JP9850284 U JP 9850284U JP H0217429 Y2 JPH0217429 Y2 JP H0217429Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- socket
- printed circuit
- circuit board
- lsi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Connecting Device With Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
本考案は主としてLSIをプリント基板上に保持
するICソケツトに関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention mainly relates to an IC socket for holding an LSI on a printed circuit board.
LSIをプリント基板に取付けるとき、従来はそ
のピンをプリント基板のスルーホールに直接はん
だ付けするか、第３図に示すようなICソケツト
を介してプリント基板に取付けている。
Conventionally, when attaching an LSI to a printed circuit board, the pins are either soldered directly to through holes on the printed circuit board, or they are attached to the printed circuit board via an IC socket as shown in Figure 3.
すなわち第３図において、ICソケツト２のピ
ン５をプリント基板３の対応するスルーホール１
０にはんだ付けし、ICソケツト２にLSI１を挿入
固定している。 That is, in FIG. 3, pin 5 of IC socket 2 is connected to corresponding through hole 1 of printed circuit board 3.
0 and insert and fix LSI 1 into IC socket 2.
しかしながら上記ICソケツト２はLSI１と平行
にプリント基板上に置かれるので、ICソケツト
２のピン間隔W1はLSI１のピン間隔と同じであ
りこのためプリント基板上の専有面積が大きくな
つてプリント基板の実装効率が低下し、特に最近
LSIの高密度化に伴つて実装効率の向上が大きな
課題となつて来ている。 However, since the IC socket 2 is placed on the printed circuit board parallel to the LSI 1, the pin spacing W1 of the IC socket 2 is the same as the pin spacing of the LSI 1, and therefore the occupied area on the printed circuit board becomes large. Implementation efficiency has decreased, especially recently
As LSI density increases, improving mounting efficiency has become a major issue.
本考案は、プリント基板の実装効率を向上でき
るICソケツトを提供することを目的としている。
The purpose of this invention is to provide an IC socket that can improve the mounting efficiency of printed circuit boards.
本考案は、側面にICを挿入するピン穴を備え
下面に上記ピン穴と電気的に接続され、ピン間隔
が上記ICのピン間隔より小なるピンを備えたIC
ホルダと、上面に上記ICホルダのピンを挿入す
るピン穴を備え下面に上記ピン穴と同一の間隔を
有し、電気的に接続されると共にプリント基板の
スルーホールにはんだ付け可能なピンを備えた水
平ソケツトとから成り、ICを横向きにしてプリ
ント基板に実装できるようにし、これによつてプ
リント基板の実装効率の向上をはかつたICソケ
ツトである。
The present invention is an IC that has a pin hole on the side surface for inserting an IC, and a pin on the bottom surface that is electrically connected to the pin hole and whose pin spacing is smaller than the pin spacing of the above IC.
A holder, with pin holes on the top surface for inserting the pins of the IC holder, and pins on the bottom surface having the same spacing as the pin holes, electrically connected, and solderable to the through holes of the printed circuit board. This is an IC socket that allows the IC to be mounted horizontally on a printed circuit board, thereby improving the mounting efficiency of the printed circuit board.
本考案の一実施例を第１図に示す。 An embodiment of the present invention is shown in FIG.
第１図において、６はICホルダ、８は水平ソ
ケツトであり、この両方を組合せて本考案のIC
ソケツトが構成される。 In Figure 1, 6 is an IC holder and 8 is a horizontal socket.
The socket is configured.
すなわち第１図において、LSI１はICホルダ６
の側面に設けたピン穴７に挿入固定され、ICホ
ルダ６の凸部１１及び垂直部下面に設けたピン１
２を、プリント基板３のスルーホール１０にその
ピン１３をはんだ付けして固定した水平ソケツト
８のピン穴９に挿入してICホルダ６を固定する。 In other words, in Fig. 1, LSI 1 is IC holder 6.
The pin 1 is inserted and fixed into the pin hole 7 provided on the side surface of the IC holder 6, and the pin 1 provided on the convex portion 11 and the vertical lower surface of the IC holder 6.
The IC holder 6 is fixed by inserting the IC holder 2 into the pin hole 9 of the horizontal socket 8 whose pin 13 is soldered and fixed to the through hole 10 of the printed circuit board 3.
なおピン穴７とピン１２およびピン穴９とピン
１３とは対応するものがそれぞれ電気的に接続さ
れている。 Note that corresponding pin holes 7 and pins 12 and corresponding pin holes 9 and pins 13 are electrically connected.
この場合水平ソケツト８のピン間隔W2はLSI
１のピン間隔W1よりかなり小さくすることがで
きるので、水平ソケツト８のプリント基板３上で
の専有面積もLSIに比してかなり小さくなり、従
つてプリント基板３上でのLSIの実装効率が向上
する。 In this case, the pin spacing W2 of horizontal socket 8 is LSI
Since the pin spacing W of 1 can be made considerably smaller than 1 , the area occupied by the horizontal socket 8 on the printed circuit board 3 is also considerably smaller than that of the LSI, and therefore the mounting efficiency of the LSI on the printed circuit board 3 is reduced. improves.
なおLSI１をプリント基板３に挿脱するとき
は、LSI１をICホルダ６に固定したままで行なえ
るので、LSI１を側面方向へ引出すためのスペー
スは不要であり、さらにICホルダ６へのLSIの挿
脱も容易となる。 Note that when inserting or removing the LSI 1 into the printed circuit board 3, it can be done while the LSI 1 is fixed to the IC holder 6, so there is no need for space to pull the LSI 1 out to the side. It also becomes easier to take off.
第２図は本考案のICソケツトを用いてLSI１を
プリント基板３に取付けた状態を示している。 FIG. 2 shows the LSI 1 mounted on the printed circuit board 3 using the IC socket of the present invention.
なおICホルダ６および水平ソケツト８として
はエポキシ樹脂などの絶縁材料を基材として用い
る。 Note that the IC holder 6 and the horizontal socket 8 are made of an insulating material such as epoxy resin as a base material.
以上説明したように本考案によれば、LSIなど
のICをプリント基板に装着する際、IC本体の幅
によつて決まるピン間隔よりかなり小さいピン間
隔を有する水平ソケツトを介して装着できるの
で、これによつてプリント基板へのICの実装効
率を向上することができ、さらにICの着脱も容
易となる合理的なICソケツトが得られる。
As explained above, according to the present invention, when an IC such as an LSI is mounted on a printed circuit board, it can be mounted via a horizontal socket having a pin spacing considerably smaller than the pin spacing determined by the width of the IC body. As a result, it is possible to improve the efficiency of mounting an IC on a printed circuit board, and furthermore, it is possible to obtain a rational IC socket that allows easy attachment and detachment of an IC.
第１図は本考案の一実施例を示す構成図、第２
図は本考案のICソケツトを用いてLSIをプリント
基板に取付けた状態を示す図、第３図は従来の
ICソケツトの一例を示す図である。
１……LSI、３……プリント基板、４，１２，
１３……ピン、６……ICホルダ、７，９……ピ
ン穴、８……水平ソケツト、１０……スルーホー
ル、１１……凸部。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure shows the LSI mounted on a printed circuit board using the IC socket of the present invention, and Figure 3 shows the conventional IC socket.
FIG. 3 is a diagram showing an example of an IC socket. 1...LSI, 3...Printed circuit board, 4,12,
13... Pin, 6... IC holder, 7, 9... Pin hole, 8... Horizontal socket, 10... Through hole, 11... Convex part.
Claims (1)
ピン穴と電気的に接続されピン間隔が上記ICの
ピン間隔より小なるピンを備えたICホルダと、
上面に上記ICホルダのピンを挿入するピン穴を
備え下面に上記ピン穴と同一の間隔を有し電気的
に接続されると共にプリント基板のスルーホール
にはんだ付け可能なピンを備えた水平ソケツトと
からなるICソケツト。 an IC holder having a pin hole for inserting an IC on the side surface and a pin on the bottom surface that is electrically connected to the pin hole and whose pin spacing is smaller than the pin spacing of the IC;
A horizontal socket having a pin hole on the top surface into which the pin of the IC holder is inserted, and a horizontal socket on the bottom surface having the same spacing as the pin hole and having a pin that is electrically connected and can be soldered to the through hole of the printed circuit board. IC socket consisting of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9850284U JPS6116886U (en) | 1984-07-02 | 1984-07-02 | IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9850284U JPS6116886U (en) | 1984-07-02 | 1984-07-02 | IC socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6116886U JPS6116886U (en) | 1986-01-31 |
| JPH0217429Y2 true JPH0217429Y2 (en) | 1990-05-15 |
Family
ID=30658041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9850284U Granted JPS6116886U (en) | 1984-07-02 | 1984-07-02 | IC socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116886U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7127282B2 (en) | 1998-12-23 | 2006-10-24 | Medispectra, Inc. | Optical methods and systems for rapid screening of the cervix |
| US7136518B2 (en) | 2003-04-18 | 2006-11-14 | Medispectra, Inc. | Methods and apparatus for displaying diagnostic data |
| US7187810B2 (en) | 1999-12-15 | 2007-03-06 | Medispectra, Inc. | Methods and systems for correcting image misalignment |
| US7260248B2 (en) | 1999-12-15 | 2007-08-21 | Medispectra, Inc. | Image processing using measures of similarity |
| US7282723B2 (en) | 2002-07-09 | 2007-10-16 | Medispectra, Inc. | Methods and apparatus for processing spectral data for use in tissue characterization |
| US7309867B2 (en) | 2003-04-18 | 2007-12-18 | Medispectra, Inc. | Methods and apparatus for characterization of tissue samples |
| US7459696B2 (en) | 2003-04-18 | 2008-12-02 | Schomacker Kevin T | Methods and apparatus for calibrating spectral data |
| US7469160B2 (en) | 2003-04-18 | 2008-12-23 | Banks Perry S | Methods and apparatus for evaluating image focus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106269U (en) * | 1972-12-28 | 1974-09-11 | ||
| JPS55167661U (en) * | 1979-05-18 | 1980-12-02 |
-
1984
- 1984-07-02 JP JP9850284U patent/JPS6116886U/en active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7127282B2 (en) | 1998-12-23 | 2006-10-24 | Medispectra, Inc. | Optical methods and systems for rapid screening of the cervix |
| US7187810B2 (en) | 1999-12-15 | 2007-03-06 | Medispectra, Inc. | Methods and systems for correcting image misalignment |
| US7260248B2 (en) | 1999-12-15 | 2007-08-21 | Medispectra, Inc. | Image processing using measures of similarity |
| US7282723B2 (en) | 2002-07-09 | 2007-10-16 | Medispectra, Inc. | Methods and apparatus for processing spectral data for use in tissue characterization |
| US7136518B2 (en) | 2003-04-18 | 2006-11-14 | Medispectra, Inc. | Methods and apparatus for displaying diagnostic data |
| US7309867B2 (en) | 2003-04-18 | 2007-12-18 | Medispectra, Inc. | Methods and apparatus for characterization of tissue samples |
| US7459696B2 (en) | 2003-04-18 | 2008-12-02 | Schomacker Kevin T | Methods and apparatus for calibrating spectral data |
| US7469160B2 (en) | 2003-04-18 | 2008-12-23 | Banks Perry S | Methods and apparatus for evaluating image focus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6116886U (en) | 1986-01-31 |
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