JPH0331023Y2 - - Google Patents

Description

[Detailed explanation of the idea] [Technical field] The present invention relates to an IC socket.

[Background technology] With the trend toward extremely high mounting density of electronic components on printed circuit boards, when mounting an IC on a printed circuit board using an IC socket, IC socket 1 and printed circuit board are connected to each other as shown in Figure 4. There is considerable space between the board 3 and between the IC sockets 1 and IC2.

[Purpose of the invention] The present invention was developed in view of the above points, and its purpose is to make the spaces between the IC socket and the printed circuit board and between the IC socket and the IC suitable for mounting electronic components. The object of the present invention is to provide an IC socket that can be used and can be mounted in high density.

[Disclosure of the invention] The present invention is a chip printed board in which the terminal receiving parts of the IC are lined up on both sides of the upper surface and the terminals for connecting to the printed circuit board protrude from the lower surface, and the connecting terminals penetrate through the lower surface. It is characterized by the fact that there is an opening in the center that opens up and down, and the inside of the opening serves as a space for arranging electronic components to be mounted on the chip printed board. be.

The present invention will be described in detail below based on the illustrated embodiments. In FIGS. 1 to 3, 1 is an IC socket;
2 is an IC, and 3 is a printed circuit board 3. The IC socket 1 has terminal receiving parts 10 lined up on both sides of its upper surface for receiving terminals protruding from the IC 2, and terminal receiving parts 10 for receiving terminals protruding from the IC 2 are lined up on both sides of its lower surface. Tapered connection terminals 12 for connection are arranged in a row. Also this
IC socket 1 has hooks 1 from the bottom surface of both ends.
3 protrudes, and the central portion thereof is an opening 14 that opens upward and downward.

The IC socket 1 is mounted on the lower surface of the IC socket 1 by having holes on both sides through which the connection terminals 12 of the IC socket 1 are inserted. The chip printed board 4 has chip-type and other small electronic components 40 mounted on its upper surface, and these electronic components 40 are located within the opening 14 of the IC socket 1. In other words, this IC socket 1 has IC2 on its top surface.
In addition to being able to mount an electronic component 40 mounted on a chip printed board 4 between the IC 2 and the printed circuit board 3, it is possible to use three-dimensional electronic component mounting technology. It is something that can be easily obtained. The electronic components 40 on the chip printed board 4 are connected to other components by soldering to the connection terminals 12 of the IC socket 1.

[Effects of the invention] As described above, in this invention, electronic components mounted on a chip printed board can be mounted in the space between an IC and a printed circuit board, and three-dimensional high-density mounting is possible. In particular, electronic components can be mounted on printed circuit boards located below the chip printed board, allowing for extremely high-density mounting, and further requiring circuit changes. In this case, it may be possible to deal with the problem by changing only the chip printed board without changing the printed circuit board that is the main body board, which increases flexibility.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of one embodiment of the present invention, Fig. 2 is a plan view of the same, Fig. 3 is a perspective view of the same, and Fig. 4 is a front view of a conventional example. teeth
IC, 3 is a printed circuit board, 4 is a chip printed board,
12 is a connection terminal, 14 is an opening, and 40 is an electronic component.

Claims (1)

[Scope of utility model registration request] IC terminal receivers are lined up on both sides of the top surface, and terminals for connecting to the printed circuit board protrude from the bottom surface.
This is an IC socket, with a chip printed board attached to the bottom surface through which connection terminals pass through, and an opening that opens up and down in the center, and the inside of the opening contains the electronic components mounted on the chip printed board. The IC socket serves as the placement space for the IC socket.